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AM5706BCBDDA

Texas Instruments

AM5706BCBDDA by Texas Instruments

Texas Instruments AM5706BCBDDA microprocessor features 32-bit external data bus, 16-bit address bus, and integrated cache. Ideal for industrial applications with low power mode, operating temperature range of -40 to 105 °C, and max clock frequency of 32 MHz.

Median Price

$48.580

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 671 parts In-Stock

1+ parts

$36.839

100+ parts

$32.746

1k+ parts

$24.078

10k+ parts

-

671

$36.839

$32.746

$24.078

-

Mouser Electronics

USA . 25 parts In-Stock

1+ parts

$60.320

100+ parts

$46.740

1k+ parts

-

10k+ parts

-

25

$60.320

$46.740

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 84 parts In-Stock

1+ parts

$31.877

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$31.877

-

-

-

Digiode

USA . 1,536 parts In-Stock

1+ parts

$34.997

100+ parts

-

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-

10k+ parts

-

1,536

$34.997

-

-

-

Vyrian

USA . 8,739 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,739

-

-

-

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VNN

France . 5,438 parts In-Stock

1+ parts

-

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-

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5,438

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 649 parts In-Stock

1+ parts

$17.318

100+ parts

-

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-

10k+ parts

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649

$17.318

-

-

-

Ampacity Inc.

Singapore . 356 parts In-Stock

1+ parts

$31.310

100+ parts

-

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-

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356

$31.310

-

-

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Continental Prestige Electronics

USA . 1,166 parts In-Stock

1+ parts

$31.877

100+ parts

-

1k+ parts

-

10k+ parts

$31.239

1,166

$31.877

-

-

$31.239

Parana Technologies

USA . 52 parts In-Stock

1+ parts

$32.708

100+ parts

-

1k+ parts

$111.780

10k+ parts

-

52

$32.708

-

$111.780

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Corphita

USA . 4,246 parts In-Stock

1+ parts

$33.155

100+ parts

-

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-

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4,246

$33.155

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DigiPath Technology Company

USA . 1,959 parts In-Stock

1+ parts

$36.015

100+ parts

$33.134

1k+ parts

-

10k+ parts

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1,959

$36.015

$33.134

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ChromeModa Solutions

Germany . 5,408 parts In-Stock

1+ parts

$36.750

100+ parts

$30.135

1k+ parts

-

10k+ parts

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5,408

$36.750

$30.135

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IDEA Electronic Components Group

UK . 27 parts In-Stock

1+ parts

$36.750

100+ parts

$34.912

1k+ parts

$33.075

10k+ parts

-

27

$36.750

$34.912

$33.075

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Microchip USA

USA . 1,862 parts In-Stock

1+ parts

$73.320

100+ parts

$72.040

1k+ parts

$71.400

10k+ parts

$70.770

1,862

$73.320

$72.040

$71.400

$70.770

Argo Parts USA

USA . 970 parts In-Stock

1+ parts

-

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970

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$31.239

1k+ parts

$30.283

10k+ parts

$29.645

100

-

$31.239

$30.283

$29.645

Overview

Experience the power and reliability of Texas Instruments with the AM5706BCBDDA microprocessor. Designed with cutting-edge technology, this high-performance device offers seamless integration, enhanced processing speed, and low power consumption for a wide range of applications. Whether you're developing industrial automation systems, automotive electronics, or consumer devices, this microprocessor provides unmatched value and efficiency. Trust in Texas Instruments to deliver top-quality components that elevate your projects to the next level. Choose the AM5706BCBDDA for superior performance and reliability every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable package for the microprocessor, making it easy to handle and resistant to damage.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microprocessor, allowing for faster data access and retrieval.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the microprocessor more energy-efficient.

Address Bus Width: 16

A wider address bus width allows for greater memory capacity and faster data transfer, enhancing the overall performance of the microprocessor.

No. of Terminals: 538

With a high number of terminals, the microprocessor can support multiple connections and peripherals, increasing its versatility and compatibility.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the microprocessor to function efficiently in extreme conditions, making it suitable for industrial applications.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency allows for speedy execution of instructions and tasks, making the microprocessor suitable for high-performance computing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the energy efficiency and reliability of the microprocessor.

Speed: 500 rpm

The high speed of the microprocessor ensures rapid data processing and computation, making it ideal for applications that require real-time performance.

Low Power Mode: YES

The presence of a low power mode allows the microprocessor to conserve energy when not in use, prolonging battery life and reducing overall power consumption.

Technical Specifications

Microprocessors AM5706BCBDDA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

538

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.298 mm

Speed:

500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM5706BCBDDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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