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MCF5270VM100

NXP Semiconductors

MCF5270VM100 by NXP Semiconductors

The NXP Semiconductors MCF5270VM100 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 75 MHz. It is suitable for applications requiring low power consumption, such as embedded systems and industrial automation. The device has a terminal pitch of 1 mm and supports boundary scan testing for efficient debugging.

Median Price

$19.911

Lifecycle Status

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1k+

MCF5270VM100 by NXP Semiconductors
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Flip Electronics (Authorized)

USA . 995 parts In-Stock

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Verical

USA . 630 parts In-Stock

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Avnet

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Rochester

USA . 37 parts In-Stock

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$19.110

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$16.100

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$16.100

Farnell

UK . 37 parts In-Stock

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$25.665

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Digiode

USA . 638 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Anansix

USA . 1,689 parts In-Stock

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TME

Poland . 537 parts In-Stock

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Vyrian

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Lantek

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PC Components Company LLC

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Singapore . 513 parts In-Stock

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Ampacity Inc.

Singapore . 213 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 923 parts In-Stock

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Netroflash

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Microchip USA

USA . 1,499 parts In-Stock

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$74.520

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$73.220

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$72.580

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$71.930

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UNI Independent Distributors

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Authorized Procurement Solutions

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Perfect Parts

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Argo Parts USA

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GreenTree Electronics

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Overview

Discover the power and performance of the MCF5270VM100 by NXP Semiconductors, a top-tier microprocessor that delivers seamless integration, lightning-fast speed, and exceptional reliability. As a leader in semiconductor technology, NXP offers cutting-edge solutions for a wide range of applications. Whether you're looking to enhance your IoT devices, streamline industrial automation, or optimize automotive systems, the MCF5270VM100 is the perfect choice. Unlock new possibilities and elevate your projects with this high-quality microprocessor that offers unmatched value and benefits to customers seeking superior performance and efficiency.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache : YES

Having integrated cache helps in improving the performance of the microprocessor by reducing the average time to access memory.

Surface Mount : YES

Being surface mountable makes the microprocessor easy to install on circuit boards, saving space and allowing for automated assembly.

Maximum Supply Voltage : 1.6 V

The maximum supply voltage of 1.6V allows for efficient power consumption while maintaining optimum performance.

Address Bus Width : 24

With a wider address bus width of 24, the microprocessor can handle larger memory addressing, enabling it to work with more data efficiently.

Package Shape : SQUARE

The square package shape provides uniformity in design and makes it easier to handle during installation.

Bit Size : 32

A bit size of 32 allows for handling and processing of data in larger chunks, improving the overall speed and efficiency of the microprocessor.

No. of Terminals : 196

Having a higher number of terminals enables the microprocessor to connect to various external components, expanding its functionality and compatibility.

Package Style (Meter) : GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers a compact and efficient design, making it suitable for space-constrained applications.

Minimum Supply Voltage : 1.4 V

The minimum supply voltage of 1.4V ensures that the microprocessor operates reliably even under lower power conditions.

Maximum Operating Temperature : 70 °C

With a maximum operating temperature of 70°C, the microprocessor can perform consistently under varying environmental conditions.

Minimum Operating Temperature : 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments.

Terminal Finish : TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and corrosion resistance, ensuring the durability and longevity of the microprocessor.

Terminal Position : BOTTOM

Having terminals positioned at the bottom facilitates easier and more secure connections, improving the overall reliability of the microprocessor.

Maximum Seated Height : 1.6 mm

The maximum seated height of 1.6 mm allows for a slim profile, making the microprocessor suitable for compact devices.

Width : 15 mm

A width of 15 mm provides a balance between compactness and compatibility, making the microprocessor versatile for various applications.

Boundary Scan : YES

The presence of boundary scan capability allows for efficient testing and debugging of the microprocessor during production and maintenance.

External Data Bus Width : 32

With an external data bus width of 32, the microprocessor can transfer data at higher speeds, enhancing overall performance.

Maximum Clock Frequency : 75 MHz

A maximum clock frequency of 75 MHz ensures high-speed operation, enabling the microprocessor to handle demanding tasks efficiently.

Maximum Time At Peak Reflow Temperature (s) : 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C : 260

With a peak reflow temperature of 260°C, the microprocessor can withstand high-temperature soldering processes without compromising its performance.

Length : 15 mm

A length of 15 mm provides a compact form factor, making the microprocessor suitable for space-constrained applications.

Temperature Grade : COMMERCIAL

Being rated for commercial temperature grades makes the microprocessor suitable for a wide range of consumer electronics and industrial applications.

Peripheral IC Type : MICROPROCESSOR, RISC

Being a RISC-based microprocessor enables efficient processing of instructions, making it well-suited for embedded systems and high-performance computing.

Technology : CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy efficient and reliable.

Terminal Form : BALL

Having a ball terminal form simplifies the installation and connection process, ensuring secure and reliable connections for the microprocessor.

Nominal Supply Voltage : 1.5 V

The nominal supply voltage of 1.5V provides an optimal balance between performance and power efficiency for the microprocessor.

Terminal Pitch : 1 mm

A terminal pitch of 1 mm allows for compact and efficient routing of connections, maximizing space utilization on circuit boards.

Format : FIXED POINT

The fixed-point format simplifies arithmetic operations and improves computational efficiency, making the microprocessor suitable for numerical processing tasks.

Moisture Sensitivity Level (MSL) : 3

Having a moisture sensitivity level of 3 indicates that the microprocessor is resistant to moisture damage, ensuring long-term reliability in diverse environments.

Speed : 100 rpm

A speed rating of 100 rpm indicates fast processing capabilities, allowing the microprocessor to handle complex tasks with efficiency.

Low Power Mode : YES

The availability of a low power mode allows the microprocessor to conserve energy when idle or under light load conditions, extending battery life in portable devices.

Technical Specifications

Microprocessors MCF5270VM100 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MCF5270VM100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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