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P1013NSN2LFB

NXP Semiconductors

P1013NSN2LFB by NXP Semiconductors

The NXP Semiconductors P1013NSN2LFB microprocessor features a 32-bit architecture with 64-bit external data bus width. It operates b/w 0-105°C, with low power mode available. Suitable for applications requiring high-speed processing and integrated cache memory in a compact grid array package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,444 parts In-Stock

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2,444

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Vyrian

USA . 2,385 parts In-Stock

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2,385

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Digiode

USA . 733 parts In-Stock

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733

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Nova Conductors

Japan . 24 parts In-Stock

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24

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,536 parts In-Stock

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$15.000

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1,536

$15.000

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One Stop Electronics

USA . 376 parts In-Stock

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$26.000

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376

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Corohmni

South Africa . 9 parts In-Stock

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$49.257

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9

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Vigor

Singapore . 327 parts In-Stock

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$88.340

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327

$88.340

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Microchip USA

USA . 2,824 parts In-Stock

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$160.044

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Corphita

USA . 4,143 parts In-Stock

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Argo Parts USA

USA . 2,050 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,774 parts In-Stock

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UNI Independent Distributors

Spain . 653 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the P1013NSN2LFB by NXP Semiconductors. As a leader in microprocessor technology, NXP delivers cutting-edge solutions for a wide range of applications. With integrated cache and low power mode, this product offers exceptional value and benefits to customers seeking top-notch performance and efficiency. Whether you're designing consumer electronics or industrial equipment, trust NXP Semiconductors to provide the quality and innovation you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product reliable and easy to handle.

Integrated Cache: YES

Having integrated cache improves the overall performance and efficiency of the microprocessor.

Surface Mount: YES

Surface mount technology allows for easier and more compact mounting on circuit boards.

Maximum Supply Voltage: 1.05 V

Operates efficiently at a relatively low voltage, reducing power consumption.

Address Bus Width: 16

With a wider address bus, the microprocessor can handle larger amounts of memory data.

Package Shape: SQUARE

Square shape allows for more efficient use of space on the circuit board.

Bit Size: 32

Provides a good balance between processing power and compatibility with existing software.

No. of Terminals: 689

High number of terminals allow for more connections and capabilities in the microprocessor.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

This package style helps in efficient heat dissipation, preventing overheating.

Minimum Supply Voltage: 0.95 V

Can operate at a low voltage, contributing to energy efficiency.

Maximum Operating Temperature: 105 °C

Can handle high operating temperatures, suitable for demanding applications.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, making it versatile and reliable.

Terminal Finish: TIN SILVER

Provides good conductivity and corrosion resistance for the terminals.

Terminal Position: BOTTOM

Bottom terminal position allows for better integration and connections in the circuit board.

Maximum Seated Height: 2.46 mm

Low seated height helps in creating slim and compact devices.

Width: 31 mm

Compact width allows for easy integration into various electronic devices.

Boundary Scan: YES

Boundary scan capability helps in easier testing and debugging of the microprocessor.

External Data Bus Width: 64

Wide external data bus allows for faster data transfers and processing.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for a sufficient amount of time during manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperature during the manufacturing process.

Length: 31 mm

Compact length allows for easy integration and space-saving in electronic devices.

Peripheral IC Type: MICROPROCESSOR

Designed specifically as a microprocessor for various computing applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form provides reliable and solid connections in the circuit board.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance of the microprocessor.

Terminal Pitch: 1 mm

Compact terminal pitch allows for more terminals in a limited space.

Format: FIXED POINT

Fixed point format is ideal for general-purpose computing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing environments.

Speed: 1067 rpm

Operating at a good speed, suitable for a wide range of computing tasks.

Low Power Mode: YES

Low power mode option enhances energy efficiency when required.

Technical Specifications

Microprocessors P1013NSN2LFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B689

JESD-609 Code:

e2

Length:

31 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

689

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.46 mm

Speed:

1067 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

31 mm

Peripheral IC Type:

Trade Compliance

P1013NSN2LFB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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