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MPC860DEVR80D4

NXP Semiconductors

MPC860DEVR80D4 by NXP Semiconductors

NXP Semiconductors' MPC860DEVR80D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. It is designed for low power mode applications, utilizing a 3.3V nominal voltage and integrated cache for enhanced performance in embedded systems.

Median Price

$137.035

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MPC860DEVR80D4 by NXP Semiconductors
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Verical

USA . 82 parts In-Stock

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$61.300

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82

$61.300

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Rochester

USA . 75 parts In-Stock

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$212.770

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$200.000

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$187.240

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75

$212.770

$200.000

$187.240

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Distributors (In-Stock)

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Digiode

USA . 3,479 parts In-Stock

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$58.235

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$58.235

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Nova Conductors

Japan . 80 parts In-Stock

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$107.071

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Vyrian

USA . 2,916 parts In-Stock

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Anansix

USA . 1,244 parts In-Stock

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Cyclops Electronics Ltd

UK . 970 parts In-Stock

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DigiKey Marketplace

USA . 500 parts In-Stock

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$166.407

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Distributors (Availability)

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AZTECH Wire

Italy . 427 parts In-Stock

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$7.110

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Ampacity Inc.

Singapore . 667 parts In-Stock

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$52.100

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One Stop Electronics

USA . 658 parts In-Stock

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$52.100

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Corphita

USA . 2,222 parts In-Stock

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$55.170

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Microchip USA

USA . 1,031 parts In-Stock

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$89.998

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Vigor

Singapore . 910 parts In-Stock

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$94.810

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$94.810

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Component Stockers USA

USA . 52 parts In-Stock

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$105.400

100+ parts

$141.690

1k+ parts

$128.130

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52

$105.400

$141.690

$128.130

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Continental Prestige Electronics

USA . 583 parts In-Stock

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$107.071

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$104.929

583

$107.071

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$104.929

UNI Independent Distributors

Spain . 6,912 parts In-Stock

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Argo Parts USA

USA . 3,202 parts In-Stock

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Perfect Parts

USA . 591 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$104.929

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$101.717

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$99.576

100

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$104.929

$101.717

$99.576

Overview

Experience the power of innovation with the MPC860DEVR80D4 by NXP Semiconductors. Crafted with precision and expertise, this microprocessor offers unparalleled performance and reliability for a wide range of applications. From embedded systems to networking devices, this cutting-edge technology ensures seamless operation and efficiency. Elevate your projects with the quality and value that only NXP Semiconductors can deliver. Choose excellence, choose MPC860DEVR80D4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and long-lasting.

Integrated Cache: YES

The integrated cache helps improve processing speed by storing frequently accessed data, enhancing the performance of the microprocessor.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.465 V

With a high maximum supply voltage, this microprocessor can handle greater power demands, making it suitable for demanding applications.

Address Bus Width: 32

A wide address bus width allows for efficient data transfer between components, enhancing the overall speed and performance of the microprocessor.

Package Shape: SQUARE

The square shape provides a compact design, saving space in electronic devices where the microprocessor is installed.

Bit Size: 32

32-bit architecture allows for processing of larger chunks of data at a time, improving efficiency and performance.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with a wide range of electronic systems.

No. of Terminals: 357

The high number of terminals provides ample connectivity options for various peripherals and components, increasing the versatility of the microprocessor.

Package Style (Meter): GRID ARRAY

The grid array package style offers a secure and reliable connection, ensuring stable performance in diverse operating conditions.

Minimum Supply Voltage: 3.135 V

The low minimum supply voltage allows for energy-efficient operation, reducing power consumption and heat generation.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for uninterrupted performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance, making it easier to integrate the microprocessor into electronic systems.

Maximum Seated Height: 2.52 mm

The low seated height allows for a compact design, enabling the microprocessor to be used in space-constrained applications.

Width: 25 mm

A moderate width makes the microprocessor easy to integrate into various electronic devices without taking up excessive space.

Boundary Scan: YES

Boundary scan capability simplifies the testing and debugging process, ensuring the reliability and quality of the microprocessor.

External Data Bus Width: 32

A wide external data bus width enables efficient communication with external devices and peripherals, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for fast data processing and execution speeds, making the microprocessor suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the microprocessor can withstand high-temperature reflow soldering processes without damage.

Peak Reflow Temperature °C: 245

The microprocessor can withstand peak reflow temperatures of up to 245°C, ensuring reliable solder joints and long-term durability.

Length: 25 mm

A moderate length allows for easy integration of the microprocessor into various electronic devices without compromising functionality or performance.

Peripheral IC Type: MICROPROCESSOR, RISC

This microprocessor features a RISC architecture, enabling fast and efficient data processing for a wide range of applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form simplifies installation and provides a secure connection, ensuring stable performance in demanding operating conditions.

Nominal Supply Voltage: 3.3 V

Operating at a standard nominal voltage of 3.3V ensures compatibility and reliability in various electronic systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm facilitates easy soldering and assembly, making it convenient to integrate the microprocessor into circuit boards.

Format: FIXED POINT

The fixed-point format simplifies mathematical calculations and enhances precision, making the microprocessor suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the microprocessor can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability.

Speed: 80 rpm

Operating at a speed of 80 rotations per minute, the microprocessor can quickly process and execute instructions for efficient performance.

Low Power Mode: YES

The low power mode allows for energy-efficient operation, reducing power consumption and heat dissipation, making it an environmentally friendly choice.

Technical Specifications

Microprocessors MPC860DEVR80D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

80 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860DEVR80D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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