Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors' MPC860DEVR80D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. It is designed for low power mode applications, utilizing a 3.3V nominal voltage and integrated cache for enhanced performance in embedded systems.
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This material is lightweight and durable, making the microprocessor easy to handle and long-lasting.
The integrated cache helps improve processing speed by storing frequently accessed data, enhancing the performance of the microprocessor.
Allows for easy installation on circuit boards, saving time and effort during assembly.
With a high maximum supply voltage, this microprocessor can handle greater power demands, making it suitable for demanding applications.
A wide address bus width allows for efficient data transfer between components, enhancing the overall speed and performance of the microprocessor.
The square shape provides a compact design, saving space in electronic devices where the microprocessor is installed.
32-bit architecture allows for processing of larger chunks of data at a time, improving efficiency and performance.
Operating at a standard voltage of 3.3V ensures compatibility with a wide range of electronic systems.
The high number of terminals provides ample connectivity options for various peripherals and components, increasing the versatility of the microprocessor.
The grid array package style offers a secure and reliable connection, ensuring stable performance in diverse operating conditions.
The low minimum supply voltage allows for energy-efficient operation, reducing power consumption and heat generation.
This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for uninterrupted performance.
Bottom terminal position simplifies installation and maintenance, making it easier to integrate the microprocessor into electronic systems.
The low seated height allows for a compact design, enabling the microprocessor to be used in space-constrained applications.
A moderate width makes the microprocessor easy to integrate into various electronic devices without taking up excessive space.
Boundary scan capability simplifies the testing and debugging process, ensuring the reliability and quality of the microprocessor.
A wide external data bus width enables efficient communication with external devices and peripherals, enhancing overall system performance.
The high maximum clock frequency allows for fast data processing and execution speeds, making the microprocessor suitable for high-performance applications.
With a maximum reflow time of 30 seconds, the microprocessor can withstand high-temperature reflow soldering processes without damage.
The microprocessor can withstand peak reflow temperatures of up to 245°C, ensuring reliable solder joints and long-term durability.
A moderate length allows for easy integration of the microprocessor into various electronic devices without compromising functionality or performance.
This microprocessor features a RISC architecture, enabling fast and efficient data processing for a wide range of applications.
Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.
The ball terminal form simplifies installation and provides a secure connection, ensuring stable performance in demanding operating conditions.
Operating at a standard nominal voltage of 3.3V ensures compatibility and reliability in various electronic systems.
The terminal pitch of 1.27mm facilitates easy soldering and assembly, making it convenient to integrate the microprocessor into circuit boards.
The fixed-point format simplifies mathematical calculations and enhances precision, making the microprocessor suitable for a wide range of applications.
With an MSL of 3, the microprocessor can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability.
Operating at a speed of 80 rotations per minute, the microprocessor can quickly process and execute instructions for efficient performance.
The low power mode allows for energy-efficient operation, reducing power consumption and heat dissipation, making it an environmentally friendly choice.
Microprocessors MPC860DEVR80D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MPC860DEVR80D4 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
Silicon Standard
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
4554
Jw Miller Magnetics
Other Semiconductors;
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
BAV99
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
T1023NXE7PQA
NXP Semiconductors
The NXP Semiconductors T1023NXE7PQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is grid array with fine pitch terminals for compact design.
XPC860SRZP50C1
XPC860SRZP50C1 by Motorola is a 32-bit RISC microprocessor with a clock frequency of 50 MHz. It operates at a supply voltage range of 3.135V to 3.465V, making it suitable for high-speed computing applications requiring low power consumption in compact devices. With a grid array package style and ball terminal form, this processor is ideal for surface mount designs with limited space constraints.
MC7448VU800ND
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 360; Package Code: LGA; Package Shape: SQUARE;
MPC8347ECVRAGDB
NXP Semiconductors' MPC8347ECVRAGDB microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for industrial applications, it operates at a max clock frequency of 66 MHz in an industrial temperature range from -40 to 105°C.
MC68EC000EI10
MC68EC000EI10 by Freescale Semiconductor is a 32-bit microprocessor with 5V power supply, operating b/w 0-70°C. It comes in a square chip carrier package with 68 terminals and J bend terminal form. Ideal for commercial applications requiring RISC technology and a max speed of 10 rpm.
MPC852TVR100A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,16X16,50;
MPC8280CZUQLDA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
P1010NXE5HFB
The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.
MPC860PZQ80D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;
MPC8308CVMAGD
The Freescale Semiconductor MPC8308CVMAGD microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and has a low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing in a compact form factor with a temperature range from -40 to 105 °C.
AM5706BCBDJAS
Texas Instruments
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER;
MC8640DTHX1250HC
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1023; Package Code: BGA; Package Shape: SQUARE;
RTPXA270C5C520
Intel
The Intel RTPXA270C5C520 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 3.6864 MHz. It is designed for low power mode applications, with a nominal voltage of 1.45 V and boundary scan capability for efficient testing.
MPC880ZP66
NXP Semiconductors' MPC880ZP66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for applications requiring a RISC-based microprocessor with a max supply voltage of 1.9V, such as embedded systems and industrial automation.
MCIMX537CVV8C
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
MPC8270CVRMIBA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC880CZP133
The NXP Semiconductors MPC880CZP133 is a 32-bit microprocessor with integrated cache and low power mode. It operates at a speed of 133 rpm, with a max supply voltage of 1.9 V. Ideal for applications requiring high performance in compact devices.
AM3357BZCZA30
AM3357BZCZA30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a terminal pitch of 0.8 mm and package style of grid array, it offers high performance in compact designs.
LUPXA255A0C400
Intel's LUPXA255A0C400 microprocessor features 32-bit architecture, 26-bit address bus width, and a max clock frequency of 3.6864 MHz. Ideal for low power applications with its integrated cache and support for boundary scan technology.
AV8063801149402SR0T6
Intel AV8063801149402SR0T6 is a 64-bit microprocessor with 1023 terminals in a grid array package. It features integrated cache, CMOS technology, and operates at 2800 rpm. Ideal for high-performance computing applications requiring fixed-point processing capabilities.
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The NXP Semiconductors MPC8270CVRMIBA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 266 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing in devices such as networking equipment and industrial control systems.
MPC8308CVMAGDA
NXP Semiconductors' MPC8308CVMAGDA is a 32-bit microprocessor with integrated cache, operating at speeds up to 400 rpm. It features low power mode and boundary scan support, suitable for industrial applications. With a package style of grid array and fine pitch, it offers 473 terminals in a compact square shape.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;
MPC8270CVRMIBA,557
NXP Semiconductors' MPC8270CVRMIBA,557 microprocessor features 32-bit address bus width, 64-bit external data bus width, and a max clock frequency of 266 MHz. Ideal for applications requiring high-speed processing such as networking equipment and industrial automation systems.
MPC8308VMAGDA
The NXP Semiconductors MPC8308VMAGDA microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and supports low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a square package shape and 473 terminals.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE; Data EEPROM Size: 0;
MPC8314VRAGDA
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: HBGA; Package Shape: SQUARE;
The NXP Semiconductors MPC8314VRAGDA is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and heat sink/slug, this processor is ideal for use in various embedded systems where space efficiency is crucial.
MPC8569EVTAUNLB
MPC8569EVTAUNLB by Freescale: 32-bit microprocessor with 64-bit data bus, 16-bit address bus, and integrated cache. Ideal for RISC applications requiring low power mode, operating at max clock frequency of 133 MHz. Features grid array package style suitable for surface mount assembly.
MPC8321ECVRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 0;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;
MPC8270VRMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC8321VRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
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