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STM32MP131AAG3

STMicroelectronics

STM32MP131AAG3 by STMicroelectronics

STM32MP131AAG3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT and embedded systems. With a terminal pitch of 0.5 mm and boundary scan capability, it offers high performance in a compact form factor.

Median Price

$7.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 150 parts In-Stock

1+ parts

$7.000

100+ parts

$4.550

1k+ parts

$4.050

10k+ parts

-

150

$7.000

$4.550

$4.050

-

DigiKey

USA . 149 parts In-Stock

1+ parts

$7.000

100+ parts

$4.546

1k+ parts

$4.103

10k+ parts

$3.993

149

$7.000

$4.546

$4.103

$3.993

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 409 parts In-Stock

1+ parts

$5.168

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$5.168

-

-

-

Vyrian

USA . 3,845 parts In-Stock

1+ parts

-

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3,845

-

-

-

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Anansix

USA . 2,525 parts In-Stock

1+ parts

-

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2,525

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-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

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1k+ parts

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150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 150 parts In-Stock

1+ parts

$4.620

100+ parts

$4.504

1k+ parts

$4.481

10k+ parts

-

150

$4.620

$4.504

$4.481

-

Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$4.620

100+ parts

-

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-

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141

$4.620

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-

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Corphita

USA . 185 parts In-Stock

1+ parts

$4.896

100+ parts

-

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-

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185

$4.896

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AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$19.411

100+ parts

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642

$19.411

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Continental Prestige Electronics

USA . 912 parts In-Stock

1+ parts

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Argo Parts USA

USA . 214 parts In-Stock

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214

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Bastille Electronics

Australia . 49 parts In-Stock

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49

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Overview

Experience the power and efficiency of the STM32MP131AAG3 microprocessor by STMicroelectronics. With integrated cache, boundary scan, and a maximum clock frequency of 48 MHz, this CMOS technology-based chip is perfect for a wide range of applications. From IoT devices to industrial automation, the STM32MP131AAG3 offers unmatched performance and reliability. Trust in STMicroelectronics' reputation for quality and innovation to deliver a product that exceeds your expectations. Upgrade your projects with the value and benefits of the STM32MP131AAG3 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the microprocessor, ensuring durability and reliability.

Integrated Cache: YES

Integrated cache helps improve the efficiency and performance of the microprocessor by storing frequently accessed data for quicker access.

Maximum Supply Voltage: 1.38 V

Higher maximum supply voltage allows for better performance and flexibility in power management.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for faster data processing and improved multitasking capabilities.

Address Bus Width: 26

A wider address bus width enables the microprocessor to access a larger memory address space, supporting more complex computing tasks.

Package Shape: SQUARE

Square package shape makes the microprocessor easier to handle and install, enhancing usability.

Bit Size: 32

32-bit microprocessors can handle larger amounts of data at once, leading to improved performance and efficiency.

No. of Terminals: 289

Having a higher number of terminals allows for more connections and functionalities, making the microprocessor versatile and capable of handling complex tasks.

Minimum Supply Voltage: 1.21 V

Lower minimum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even under demanding conditions, making the microprocessor suitable for various applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC (Reduced Instruction Set Computing) architecture in the microprocessor allows for faster and more efficient execution of instructions, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Maximum Clock Frequency: 48 MHz

Higher maximum clock frequency allows for faster processing and execution of instructions, improving overall performance.

No. of DMA Channels: 56

Having a high number of Direct Memory Access (DMA) channels allows for efficient data transfer between peripherals and memory, enhancing system throughput.

Speed: 650 rpm

High speed of 650 rpm ensures quick response times and faster data processing, making the microprocessor suitable for real-time computing applications.

Low Power Mode: YES

Low power mode helps in reducing power consumption during idle or low-load situations, improving energy efficiency and prolonging battery life.

Technical Specifications

Microprocessors STM32MP131AAG3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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