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TMS320DM8147SCYE1

Texas Instruments

TMS320DM8147SCYE1 by Texas Instruments

TMS320DM8147SCYE1 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power mode applications. With 72 DMA channels, it is ideal for high-speed processing in various electronic devices.

Median Price

$52.692

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 20 parts In-Stock

1+ parts

$20.470

100+ parts

-

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-

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20

$20.470

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Chip1Stop

Japan . 20 parts In-Stock

1+ parts

$51.080

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-

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20

$51.080

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Verical

USA . 20 parts In-Stock

1+ parts

$52.692

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20

$52.692

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Texas Instruments

USA . 207 parts In-Stock

1+ parts

$58.919

100+ parts

$52.372

1k+ parts

$38.509

10k+ parts

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207

$58.919

$52.372

$38.509

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Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$83.670

100+ parts

$64.000

1k+ parts

$62.150

10k+ parts

-

37

$83.670

$64.000

$62.150

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,995 parts In-Stock

1+ parts

$48.526

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2,995

$48.526

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Nova Conductors

Japan . 500 parts In-Stock

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$63.540

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500

$63.540

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Vyrian

USA . 4,601 parts In-Stock

1+ parts

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4,601

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Chip Stock

USA . 365 parts In-Stock

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365

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Distributors (Availability)

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AZTECH Wire

Italy . 440 parts In-Stock

1+ parts

$16.080

100+ parts

-

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440

$16.080

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$31.951

100+ parts

$29.075

1k+ parts

$26.200

10k+ parts

-

3,000

$31.951

$29.075

$26.200

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Parana Technologies

USA . 1,436 parts In-Stock

1+ parts

$32.271

100+ parts

$2,996.806

1k+ parts

$29.043

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-

1,436

$32.271

$2,996.806

$29.043

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DigiPath Technology Company

USA . 1,412 parts In-Stock

1+ parts

$35.534

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1,412

$35.534

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ChromeModa Solutions

Germany . 5,762 parts In-Stock

1+ parts

$36.259

100+ parts

$29.732

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5,762

$36.259

$29.732

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IDEA Electronic Components Group

UK . 2,110 parts In-Stock

1+ parts

$36.259

100+ parts

$34.446

1k+ parts

$32.633

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2,110

$36.259

$34.446

$32.633

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Ampacity Inc.

Singapore . 77 parts In-Stock

1+ parts

$43.420

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77

$43.420

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Corphita

USA . 2,249 parts In-Stock

1+ parts

$45.972

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2,249

$45.972

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Corohmni

South Africa . 435 parts In-Stock

1+ parts

$49.031

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435

$49.031

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$62.269

100+ parts

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$59.778

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100

$62.269

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$59.778

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Continental Prestige Electronics

USA . 5,562 parts In-Stock

1+ parts

$63.540

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$62.269

5,562

$63.540

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$62.269

Lixinc

USA . 15,450 parts In-Stock

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15,450

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Argo Parts USA

USA . 2,100 parts In-Stock

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2,100

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Overview

Experience the power of innovation with the TMS320DM8147SCYE1 microprocessor by Texas Instruments. With its cutting-edge technology and superior quality, this product offers unmatched performance in a variety of applications. From smart home devices to industrial automation systems, this microprocessor provides reliability and efficiency like no other. Trust in Texas Instruments to deliver the best in microprocessor technology, and unlock endless possibilities with the TMS320DM8147SCYE1. Elevate your projects with the ultimate combination of value and performance.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache allows for faster access to frequently used data, improving overall performance of the microprocessor.

Maximum Supply Voltage: 1.42 V

The high maximum supply voltage allows for flexibility in power management, ensuring stable operation under various conditions.

Address Bus Width: 28

A wider address bus allows the microprocessor to access a larger memory space, enabling it to handle more complex tasks efficiently.

Bit Size: 32

A 32-bit architecture allows the microprocessor to process data in larger chunks, improving speed and performance for various applications.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency indicates the processing speed capability of the microprocessor, making it suitable for tasks requiring quick calculations.

Technical Specifications

Microprocessors TMS320DM8147SCYE1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

1.1/1.35

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8147SCYE1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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