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TMS320DM8127BCYE3L

Texas Instruments

TMS320DM8127BCYE3L by Texas Instruments

TMS320DM8127BCYE3L by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and integrated cache. It operates at a max clock frequency of 30 MHz and is suitable for applications requiring low power mode and floating point format.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,359 parts In-Stock

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5,359

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Digiode

USA . 2,915 parts In-Stock

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2,915

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Distributors (Availability)

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AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$7.820

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$7.820

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One Stop Electronics

USA . 216 parts In-Stock

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$35.000

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216

$35.000

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Parana Technologies

USA . 292 parts In-Stock

1+ parts

$54.249

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$5,037.848

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$48.824

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292

$54.249

$5,037.848

$48.824

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DigiPath Technology Company

USA . 47 parts In-Stock

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$59.735

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47

$59.735

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IDEA Electronic Components Group

UK . 1,045 parts In-Stock

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$60.954

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$57.906

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$54.859

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1,045

$60.954

$57.906

$54.859

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ChromeModa Solutions

Germany . 418 parts In-Stock

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$60.954

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$49.982

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418

$60.954

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Corphita

USA . 3,821 parts In-Stock

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Microchip USA

USA . 139 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320DM8127BCYE3L by Texas Instruments, a leading manufacturer in the industry. This microprocessor is the perfect solution for a wide range of applications, offering integrated cache, low power mode, and a maximum clock frequency of 30 MHz. With advanced technology and a wide operating temperature range, this product delivers exceptional value and benefits to customers looking for high-quality processing power. Upgrade your projects with the TMS320DM8127BCYE3L and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microprocessor, making it a reliable choice for long-term use.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing memory access latency and increasing processing speed.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving space and making the assembly process more efficient.

Maximum Supply Voltage: 1.42 V

Operates efficiently at a maximum supply voltage of 1.42 V, ensuring stable performance without risking overvoltage damage.

Address Bus Width: 16

With a wide address bus width of 16, this microprocessor can handle large amounts of memory address locations, supporting complex computing tasks.

Package Shape: SQUARE

Square package shape allows for easy placement and alignment on the circuit board, facilitating the manufacturing process.

No. of Terminals: 684

Having a high number of terminals enables this microprocessor to connect to various components and peripherals, expanding its functionality.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array style with a heat sink/slug helps in efficient heat dissipation, ensuring optimal temperature management for reliable performance.

Minimum Supply Voltage: 1.28 V

Can operate efficiently at a low supply voltage of 1.28 V, offering energy efficiency and reducing power consumption.

Maximum Operating Temperature: 90 °C

Capable of operating at a maximum temperature of 90°C, providing durability and reliability even under demanding conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this microprocessor can function in a wide range of environments, from cold to hot.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper ensures good conductivity, corrosion resistance, and solderability, enhancing the reliability and longevity of the connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and connection to the circuit board, simplifying the assembly process.

Maximum Seated Height: 3.06 mm

At a maximum seated height of 3.06 mm, this microprocessor is compact and suitable for applications with space constraints.

Width: 23 mm

A width of 23 mm provides a balance between compact size and ease of handling, making it versatile for various device designs.

Boundary Scan: YES

Having boundary scan capability allows for testing and diagnosing faults in the microprocessor, aiding in troubleshooting and maintenance.

External Data Bus Width: 32

With a wide external data bus width of 32, this microprocessor can transfer large amounts of data quickly, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

Operates efficiently at a maximum clock frequency of 30 MHz, providing fast processing speeds suitable for various computing applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this microprocessor can endure soldering processes without damage.

Length: 23 mm

A length of 23 mm provides a compact form factor suitable for various device designs and integration into tight spaces.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers efficient processing of instructions, enabling high performance and low power consumption.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed, and reliable operation, making it an energy-efficient choice for electronic devices.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and soldering, ensuring stable performance in various operating conditions.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35 V ensures optimal performance and energy efficiency, prolonging the lifespan of the microprocessor.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this microprocessor offers precise alignment and connection, enhancing reliability during assembly.

Format: FLOATING POINT

Supports floating-point operations, enabling accurate and efficient numerical calculations, essential for scientific and mathematical computations.

Moisture Sensitivity Level (MSL): 4

Has a moisture sensitivity level of 4, indicating that proper handling and storage procedures are required to prevent moisture-related damage.

Speed: 1000 rpm

Capable of handling speeds of up to 1000 rpm, suitable for demanding computing tasks that require high-speed data processing.

Low Power Mode: YES

Supports a low power mode for energy efficiency, allowing the microprocessor to conserve power when in standby or idle mode, extending battery life in portable devices.

Technical Specifications

Microprocessors TMS320DM8127BCYE3L attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127BCYE3L Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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