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TMS320DM8127BCYE3

Texas Instruments

TMS320DM8127BCYE3 by Texas Instruments

TMS320DM8127BCYE3 by Texas Instruments is a 32-bit microprocessor with 16-bit external data bus, operating at max 30 MHz clock frequency. It features integrated cache, low power mode, and boundary scan for applications requiring high-speed processing in compact devices.

Median Price

$93.251

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$82.890

1k+ parts

$74.160

10k+ parts

$69.800

180

-

$82.890

$74.160

$69.800

DigiKey

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

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180

-

-

-

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Verical

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$103.612

1k+ parts

$92.700

10k+ parts

$87.250

180

-

$103.612

$92.700

$87.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,249 parts In-Stock

1+ parts

$87.486

100+ parts

-

1k+ parts

-

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3,249

$87.486

-

-

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Vyrian

USA . 6,754 parts In-Stock

1+ parts

-

100+ parts

-

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6,754

-

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DigiKey Marketplace

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

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180

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$41.378

100+ parts

$37.654

1k+ parts

$33.930

10k+ parts

-

2,500

$41.378

$37.654

$33.930

-

Parana Technologies

USA . 1,396 parts In-Stock

1+ parts

$55.338

100+ parts

-

1k+ parts

-

10k+ parts

-

1,396

$55.338

-

-

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ChromeModa Solutions

Germany . 1,376 parts In-Stock

1+ parts

$62.177

100+ parts

$50.985

1k+ parts

-

10k+ parts

-

1,376

$62.177

$50.985

-

-

IDEA Electronic Components Group

UK . 1,004 parts In-Stock

1+ parts

$62.177

100+ parts

$59.068

1k+ parts

$55.959

10k+ parts

-

1,004

$62.177

$59.068

$55.959

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Corphita

USA . 455 parts In-Stock

1+ parts

$82.881

100+ parts

-

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455

$82.881

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A-Z Elektronik GmbH

Germany . 7,128 parts In-Stock

1+ parts

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7,128

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DigiPath Technology Company

USA . 1,190 parts In-Stock

1+ parts

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$56.059

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1,190

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$56.059

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Microchip USA

USA . 362 parts In-Stock

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362

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Perfect Parts

USA . 67 parts In-Stock

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67

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Kepictronics

USA . 42 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320DM8127BCYE3 microprocessor by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that meet the highest standards. This microprocessor is perfect for a wide range of applications, offering seamless integration and exceptional reliability. Unlock endless possibilities and streamline your projects with the TMS320DM8127BCYE3, providing unmatched value and benefits to customers seeking cutting-edge technology solutions. Elevate your designs with this innovative microprocessor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microprocessor, ensuring a longer lifespan and reliable performance.

Integrated Cache: YES

Having integrated cache helps improve the overall performance of the microprocessor by reducing latency and speeding up data access.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly of electronic devices, saving time and effort during production.

Maximum Supply Voltage: 1.42 V

Higher maximum supply voltage allows for better overclocking potential and performance under heavy workloads.

Address Bus Width: 28

Wider address bus width enables the microprocessor to access a larger memory space, enhancing its processing capabilities.

Package Shape: SQUARE

Square package shape helps optimize the use of space within electronic devices, making it easier to fit the microprocessor into compact designs.

Bit Size: 32

32-bit architecture allows the microprocessor to handle larger chunks of data at once, boosting its computational power and efficiency.

No. of Terminals: 684

Having a higher number of terminals allows for more connections to other components, increasing the flexibility and functionality of the microprocessor.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enhances the reliability and performance of the microprocessor by providing better electrical connections and signal integrity.

Minimum Supply Voltage: 1.28 V

Lower minimum supply voltage helps in reducing power consumption and heat generation, leading to improved energy efficiency and longer battery life in portable devices.

Maximum Operating Temperature: 90 °C

Being able to operate at high temperatures makes this microprocessor suitable for use in demanding environments or under heavy workloads without compromising performance.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures ensures the microprocessor remains functional and reliable even in cold climates or refrigerated environments.

Terminal Finish: TIN SILVER COPPER

Combination of tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability for optimal performance and longevity.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation and connection process of the microprocessor, making it easier to integrate into electronic devices.

Maximum Seated Height: 3.06 mm

Having a maximum seated height of 3.06 mm allows for a compact and slim profile, making it suitable for thin and lightweight devices.

Width: 23 mm

With a width of 23 mm, this microprocessor can easily fit into a variety of electronic devices without taking up too much space.

Boundary Scan: YES

Boundary scan feature allows for easy testing and debugging of the microprocessor during production, ensuring higher quality and reliability.

External Data Bus Width: 16

16-bit external data bus width facilitates faster data transfer between the microprocessor and other components, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

With a maximum clock frequency of 30 MHz, this microprocessor delivers fast and efficient processing speeds, ideal for a wide range of computing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperature for 30 seconds ensures the microprocessor remains stable and reliable during the assembly process.

Peak Reflow Temperature °C: 250

High peak reflow temperature of 250°C enables the microprocessor to endure the soldering process without any damage, guaranteeing long-term functionality.

Length: 23 mm

With a length of 23 mm, this microprocessor offers a balanced form factor that fits well in various electronic devices while providing ample connectivity.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC (Reduced Instruction Set Computing) architecture enhances the microprocessor's performance by simplifying instructions and improving execution speed.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliable operation, making this microprocessor suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form provides secure connections and improved signal transmission, contributing to the stability and performance of the microprocessor.

Nominal Supply Voltage: 1.35 V

Stable nominal supply voltage of 1.35 V ensures consistent and reliable performance of the microprocessor under various operating conditions.

Terminal Pitch: 0.8 mm

Having a terminal pitch of 0.8 mm allows for compact and efficient packaging of the microprocessor, optimizing space utilization in electronic devices.

Format: FLOATING POINT

Floating-point format supports high-precision arithmetic operations, making this microprocessor ideal for scientific calculations and complex mathematical tasks.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates the microprocessor's resistance to moisture-related damage, ensuring reliability and longevity in humid environments.

Speed: 1000 rpm

Operating at a speed of 1000 rpm, this microprocessor delivers fast and responsive performance, suitable for demanding computational tasks and real-time applications.

Low Power Mode: YES

Enabling low power mode enhances energy efficiency and reduces power consumption of the microprocessor, extending battery life and reducing operating costs.

Technical Specifications

Microprocessors TMS320DM8127BCYE3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127BCYE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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