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TMS320DM8147BCYE1

Texas Instruments

TMS320DM8147BCYE1 by Texas Instruments

TMS320DM8147BCYE1 by Texas Instruments is a 32-bit microprocessor with 28-bit address bus, 16-bit external data bus, and integrated cache. It operates at a max clock frequency of 30 MHz and is suitable for applications requiring low power mode and floating-point format processing.

Median Price

$65.410

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 300 parts In-Stock

1+ parts

$65.410

100+ parts

$64.110

1k+ parts

$62.800

10k+ parts

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300

$65.410

$64.110

$62.800

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Distributors (In-Stock)

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Digiode

USA . 219 parts In-Stock

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$62.140

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219

$62.140

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Vyrian

USA . 4,951 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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ComSIT Distribution GmbH

Germany . 60 parts In-Stock

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ComSIT USA

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LIBRA Elektronik GmbH

Germany . 7 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,057 parts In-Stock

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$14.990

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$14.990

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Parana Technologies

USA . 177 parts In-Stock

1+ parts

$39.055

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$3,626.847

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$35.149

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177

$39.055

$3,626.847

$35.149

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DigiPath Technology Company

USA . 526 parts In-Stock

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$43.004

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$39.564

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ChromeModa Solutions

Germany . 1,955 parts In-Stock

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$43.882

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$35.983

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$43.882

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IDEA Electronic Components Group

UK . 625 parts In-Stock

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$43.882

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$41.688

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$39.494

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$43.882

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$39.494

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Ampacity Inc.

Singapore . 300 parts In-Stock

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$55.600

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$55.600

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Corphita

USA . 1,596 parts In-Stock

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$58.869

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Corohmni

South Africa . 37 parts In-Stock

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$68.535

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A-Z Elektronik GmbH

Germany . 7,364 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 2,086 parts In-Stock

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Continental Prestige Electronics

USA . 2,054 parts In-Stock

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Microchip USA

USA . 486 parts In-Stock

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Netroflash

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Perfect Parts

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Overview

Discover the power and precision of the TMS320DM8147BCYE1 by Texas Instruments, a top-tier microprocessor designed to elevate your projects to new heights. With cutting-edge technology and unparalleled reliability, Texas Instruments delivers a product that exceeds expectations in performance and efficiency. Perfect for a wide range of applications, this microprocessor offers unmatched value, benefits, and advantages for customers seeking superior quality and seamless functionality. Explore endless possibilities with the TMS320DM8147BCYE1 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing memory access times.

Maximum Supply Voltage: 1.42 V

The maximum supply voltage allows for efficient power management and helps prevent damage to the microprocessor.

Address Bus Width: 28

A wider address bus width enables the microprocessor to handle larger amounts of memory and data, increasing its capabilities.

Bit Size: 32

A 32-bit microprocessor can process larger chunks of data at a time, improving overall efficiency and performance.

Power Supplies (V): 0.95/1.35

Having multiple power supply options allows for flexibility in power consumption, making it suitable for various applications.

No. of Terminals: 684

A higher number of terminals enables more connections and functionality, making the microprocessor versatile in its applications.

Peripheral IC Type: MICROPROCESSOR, RISC

A RISC architecture microprocessor typically offers better performance and energy efficiency compared to CISC architectures.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making it a reliable choice for microprocessors.

Technical Specifications

Microprocessors TMS320DM8147BCYE1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA688,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8147BCYE1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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