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TMS320C6474FZUNA2

Texas Instruments

TMS320C6474FZUNA2 by Texas Instruments

TMS320C6474FZUNA2 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 625 MHz. With an address bus width of 14 and external data bus width of 32, it is suitable for high-speed computing applications requiring low power consumption. Its package style is grid array, fine pitch, making it ideal for compact electronic devices.

Median Price

$258.142

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,712 parts In-Stock

1+ parts

$237.370

100+ parts

$223.130

1k+ parts

$208.890

10k+ parts

-

10,712

$237.370

$223.130

$208.890

-

DigiKey

USA . 10,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,712

-

-

-

-

Verical

USA . 6,695 parts In-Stock

1+ parts

-

100+ parts

$278.913

1k+ parts

$261.113

10k+ parts

-

6,695

-

$278.913

$261.113

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,206 parts In-Stock

1+ parts

$261.830

100+ parts

-

1k+ parts

-

10k+ parts

-

3,206

$261.830

-

-

-

Vyrian

USA . 3,350 parts In-Stock

1+ parts

$275.610

100+ parts

-

1k+ parts

-

10k+ parts

-

3,350

$275.610

-

-

-

DigiKey Marketplace

USA . 10,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,712

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,743 parts In-Stock

1+ parts

$35.214

100+ parts

-

1k+ parts

-

10k+ parts

-

1,743

$35.214

-

-

-

DigiPath Technology Company

USA . 1,321 parts In-Stock

1+ parts

$38.775

100+ parts

$35.673

1k+ parts

-

10k+ parts

-

1,321

$38.775

$35.673

-

-

ChromeModa Solutions

Germany . 2,326 parts In-Stock

1+ parts

$39.566

100+ parts

$32.444

1k+ parts

-

10k+ parts

-

2,326

$39.566

$32.444

-

-

IDEA Electronic Components Group

UK . 2,043 parts In-Stock

1+ parts

$39.566

100+ parts

$37.588

1k+ parts

$35.609

10k+ parts

-

2,043

$39.566

$37.588

$35.609

-

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$39.582

100+ parts

$36.020

1k+ parts

$32.457

10k+ parts

-

15

$39.582

$36.020

$32.457

-

Corphita

USA . 2,862 parts In-Stock

1+ parts

$248.049

100+ parts

-

1k+ parts

-

10k+ parts

-

2,862

$248.049

-

-

-

Component Stockers USA

USA . 14,048 parts In-Stock

1+ parts

$278.080

100+ parts

$261.400

1k+ parts

$236.370

10k+ parts

$236.370

14,048

$278.080

$261.400

$236.370

$236.370

Microchip USA

USA . 2,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,079

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-

-

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Overview

Experience unparalleled performance and reliability with the TMS320C6474FZUNA2 microprocessor by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that is trusted by professionals worldwide. Ideal for a wide range of applications, this microprocessor offers seamless integration, efficient processing power, and advanced features that elevate your projects to new heights. Trust in the quality and innovation of Texas Instruments to bring you the best in microprocessor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, which is ideal for portable and rugged applications.

Integrated Cache: YES

The integrated cache allows for faster access to frequently used data, improving overall performance and efficiency of the microprocessor.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage of 1.2V helps in reducing power consumption and heat generation, making it suitable for energy-efficient devices.

Address Bus Width: 14

With a wider address bus width of 14, the microprocessor can effectively access and manage a larger memory space, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, enabling higher component density and better thermal performance.

Bit Size: 32

The 32-bit architecture enables the microprocessor to handle larger chunks of data at once, leading to faster and more efficient processing of instructions.

Power Supplies (V): 1.1, 1.8

The availability of multiple power supply options (1.1V and 1.8V) offers flexibility in design and allows for optimized power management in different operating conditions.

No. of Terminals: 561

With a high number of terminals, the microprocessor can support a variety of input/output connections and peripherals, making it versatile for different applications.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, this product offers advanced processing capabilities, including arithmetic, logic, and control functions, making it suitable for complex computing tasks.

Technology: CMOS

The CMOS technology used in the microprocessor ensures low power consumption, high speed, and reliable operation, making it a cost-effective and efficient choice.

Technical Specifications

Microprocessors TMS320C6474FZUNA2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

14

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

625 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B561

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

561

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA561,27X27,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Speed:

1200 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6474FZUNA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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