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TMS320DM8127BCYE1

Texas Instruments

TMS320DM8127BCYE1 by Texas Instruments

TMS320DM8127BCYE1 by Texas Instruments is a 32-bit microprocessor with 16-bit external data bus width, operating at max 30 MHz clock frequency. It features integrated cache, operates b/w 0-90°C, and has a low power mode. Ideal for applications requiring high-speed processing in compact devices like IoT sensors or embedded systems.

Median Price

$65.272

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

$58.020

1k+ parts

$51.910

10k+ parts

$48.860

1,320

-

$58.020

$51.910

$48.860

DigiKey

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,320

-

-

-

-

Verical

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

$72.525

1k+ parts

$64.888

10k+ parts

$61.075

1,320

-

$72.525

$64.888

$61.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 931 parts In-Stock

1+ parts

$61.237

100+ parts

-

1k+ parts

-

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-

931

$61.237

-

-

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Vyrian

USA . 4,455 parts In-Stock

1+ parts

$64.460

100+ parts

-

1k+ parts

-

10k+ parts

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4,455

$64.460

-

-

-

DigiKey Marketplace

USA . 1,320 parts In-Stock

1+ parts

$67.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,320

$67.040

-

-

-

Odintec Ltd.

Israel . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10

-

-

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

1+ parts

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5

-

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Bristol Electronics

USA . 5 parts In-Stock

1+ parts

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-

1k+ parts

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5

-

-

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Dan-Mar Components

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 365 parts In-Stock

1+ parts

$34.688

100+ parts

-

1k+ parts

-

10k+ parts

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365

$34.688

-

-

-

DigiPath Technology Company

USA . 1,423 parts In-Stock

1+ parts

$38.196

100+ parts

$35.140

1k+ parts

-

10k+ parts

-

1,423

$38.196

$35.140

-

-

ChromeModa Solutions

Germany . 3,966 parts In-Stock

1+ parts

$38.975

100+ parts

$31.960

1k+ parts

-

10k+ parts

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3,966

$38.975

$31.960

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IDEA Electronic Components Group

UK . 286 parts In-Stock

1+ parts

$38.975

100+ parts

$37.026

1k+ parts

$35.078

10k+ parts

-

286

$38.975

$37.026

$35.078

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Corphita

USA . 4,667 parts In-Stock

1+ parts

$58.014

100+ parts

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4,667

$58.014

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QUARKTWIN TECHNOLOGY LTD

USA . 23,833 parts In-Stock

1+ parts

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23,833

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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-

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Microchip USA

USA . 259 parts In-Stock

1+ parts

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259

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Metaverse IC Inc.

Canada . 150 parts In-Stock

1+ parts

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150

-

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ChipstoGo Electronic ltd

UK . 50 parts In-Stock

1+ parts

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50

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Perfect Parts

USA . 6 parts In-Stock

1+ parts

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6

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Overview

Unlock the full potential of your projects with the TMS320DM8127BCYE1 by Texas Instruments. As a trusted leader in microprocessors, Texas Instruments delivers unparalleled quality and reliability. This versatile processor is perfect for a wide range of applications, offering seamless integration and enhanced performance. Experience the value and benefits of this cutting-edge technology, revolutionizing the way you work and creating endless possibilities. Elevate your designs with the TMS320DM8127BCYE1 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor suitable for portable devices.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage allows for efficient power consumption, leading to better energy efficiency.

Address Bus Width: 28

With a wider address bus width, the microprocessor can handle larger amounts of addressable memory.

Bit Size: 32

A 32-bit architecture provides good balance between performance and memory capacity.

No. of Terminals: 684

Having a high number of terminals allows for more connectivity options and versatility in the usage of the microprocessor.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures stable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation in various environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor efficient and reliable.

Technical Specifications

Microprocessors TMS320DM8127BCYE1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.06 mm

Speed:

720 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127BCYE1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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