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TMS320DM8147SCYE0

Texas Instruments

TMS320DM8147SCYE0 by Texas Instruments

TMS320DM8147SCYE0 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power applications in various industries like automotive and industrial automation. The package style is grid array with fine pitch, making it ideal for compact designs.

Median Price

$58.518

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 446 parts In-Stock

1+ parts

$55.065

100+ parts

$48.946

1k+ parts

$35.990

10k+ parts

-

446

$55.065

$48.946

$35.990

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Mouser Electronics

USA . 34 parts In-Stock

1+ parts

$78.200

100+ parts

$59.900

1k+ parts

$58.080

10k+ parts

-

34

$78.200

$59.900

$58.080

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Avnet

USA . 314 parts In-Stock

1+ parts

-

100+ parts

$58.518

1k+ parts

$53.868

10k+ parts

-

314

-

$58.518

$53.868

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 949 parts In-Stock

1+ parts

$52.312

100+ parts

-

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949

$52.312

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-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$59.702

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-

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50

$59.702

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Vyrian

USA . 8,746 parts In-Stock

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-

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8,746

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Chip Stock

USA . 360 parts In-Stock

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360

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Distributors (Availability)

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AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$12.057

100+ parts

-

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-

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644

$12.057

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-

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Parana Technologies

USA . 931 parts In-Stock

1+ parts

$42.740

100+ parts

-

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931

$42.740

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-

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Ampacity Inc.

Singapore . 253 parts In-Stock

1+ parts

$46.810

100+ parts

-

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253

$46.810

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DigiPath Technology Company

USA . 1,047 parts In-Stock

1+ parts

$47.062

100+ parts

-

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1,047

$47.062

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-

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ChromeModa Solutions

Germany . 2,915 parts In-Stock

1+ parts

$48.022

100+ parts

$39.378

1k+ parts

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2,915

$48.022

$39.378

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IDEA Electronic Components Group

UK . 897 parts In-Stock

1+ parts

$48.022

100+ parts

$45.621

1k+ parts

$43.220

10k+ parts

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897

$48.022

$45.621

$43.220

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Corphita

USA . 755 parts In-Stock

1+ parts

$49.558

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755

$49.558

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$59.702

100+ parts

$58.508

1k+ parts

$56.717

10k+ parts

$55.523

2,000

$59.702

$58.508

$56.717

$55.523

Continental Prestige Electronics

USA . 1,717 parts In-Stock

1+ parts

$59.702

100+ parts

-

1k+ parts

-

10k+ parts

$58.508

1,717

$59.702

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-

$58.508

Lixinc

USA . 15,446 parts In-Stock

1+ parts

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15,446

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Argo Parts USA

USA . 3,325 parts In-Stock

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3,325

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Overview

Unlock unparalleled performance and efficiency with the TMS320DM8147SCYE0 by Texas Instruments. This cutting-edge microprocessor boasts integrated cache, advanced technology, and a wide range of applications in various industries. With its high-quality design and reliable performance, this product delivers exceptional value to customers seeking top-notch solutions for their projects. Experience the benefits of superior processing power, flexibility, and innovation with the TMS320DM8147SCYE0.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and heat resistance, making the microprocessor reliable for long-term use.

Integrated Cache: YES

Having integrated cache allows for faster access to frequently used data, improving overall performance.

Maximum Supply Voltage: 1.26 V

Optimal maximum supply voltage ensures stable operation and protects the microprocessor from voltage spikes.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle larger chunks of data at once, enhancing processing speed.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style enables efficient heat dissipation and compact design for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture allows for simplified instruction execution, leading to improved performance and power efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient.

Technical Specifications

Microprocessors TMS320DM8147SCYE0 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

1.1/1.35

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.06 mm

Speed:

720 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8147SCYE0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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