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MPC860TCZQ66D4

NXP Semiconductors

MPC860TCZQ66D4 by NXP Semiconductors

NXP Semiconductors' MPC860TCZQ66D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Ideal for low power applications, it operates at a speed of 66 rpm and supports integrated cache memory. Suitable for various embedded systems requiring high processing capabilities.

Median Price

$251.325

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

MPC860TCZQ66D4 by NXP Semiconductors
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,502 parts In-Stock

1+ parts

$223.400

100+ parts

$210.000

1k+ parts

$196.590

10k+ parts

-

4,502

$223.400

$210.000

$196.590

-

DigiKey

USA . 4,502 parts In-Stock

1+ parts

$279.250

100+ parts

-

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4,502

$279.250

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-

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Flip Electronics (Authorized)

USA . 1 parts In-Stock

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1

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Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$210.530

100+ parts

-

1k+ parts

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900

$210.530

-

-

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Digiode

USA . 4,936 parts In-Stock

1+ parts

$224.314

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-

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4,936

$224.314

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DigiKey Marketplace

USA . 4,280 parts In-Stock

1+ parts

-

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4,280

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Anansix

USA . 2,857 parts In-Stock

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2,857

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Vyrian

USA . 2,854 parts In-Stock

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2,854

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Flip Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Vigor

Singapore . 375 parts In-Stock

1+ parts

$202.840

100+ parts

-

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10k+ parts

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375

$202.840

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Ampacity Inc.

Singapore . 2,521 parts In-Stock

1+ parts

$208.730

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-

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2,521

$208.730

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Continental Prestige Electronics

USA . 1,173 parts In-Stock

1+ parts

$210.530

100+ parts

-

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10k+ parts

$206.319

1,173

$210.530

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-

$206.319

Netroflash

USA . 50 parts In-Stock

1+ parts

$210.530

100+ parts

$206.319

1k+ parts

-

10k+ parts

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50

$210.530

$206.319

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Corphita

USA . 2,605 parts In-Stock

1+ parts

$212.508

100+ parts

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2,605

$212.508

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Component Stockers USA

USA . 4,758 parts In-Stock

1+ parts

$243.080

100+ parts

$228.490

1k+ parts

$206.620

10k+ parts

-

4,758

$243.080

$228.490

$206.620

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Microchip USA

USA . 152 parts In-Stock

1+ parts

$256.005

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152

$256.005

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Lixinc

USA . 12,663 parts In-Stock

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12,663

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A-Z Elektronik GmbH

Germany . 7,124 parts In-Stock

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UNI Independent Distributors

Spain . 6,398 parts In-Stock

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6,398

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Argo Parts USA

USA . 3,437 parts In-Stock

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3,437

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 2,517 parts In-Stock

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2,517

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Futuretech Components

Singapore . 891 parts In-Stock

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891

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Kepictronics

USA . 104 parts In-Stock

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104

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Overview

Unleash the power of cutting-edge technology with the MPC860TCZQ66D4 by NXP Semiconductors. As a leader in the industry, NXP Semiconductors delivers top-quality microprocessors that offer unparalleled performance and reliability. Ideal for a wide range of applications, this innovative product provides customers with enhanced speed, efficiency, and functionality. Experience seamless operation and unmatched value with the MPC860TCZQ66D4, setting new standards in the world of microprocessors. Upgrade to NXP Semiconductors and elevate your technological capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing access times and increasing data retrieval speeds.

Address Bus Width: 32

A wider address bus allows for larger memory addressing capabilities, enabling the microprocessor to access more memory and handle complex tasks efficiently.

Bit Size: 32

A 32-bit architecture allows the microprocessor to process data in 32-bit chunks, improving overall performance and efficiency.

Power Supplies (V): 3.3

Operating at 3.3V provides a balance between power consumption and performance, making this microprocessor energy-efficient.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency, this microprocessor can handle tasks at a faster rate, making it suitable for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor reliable and energy-efficient.

Technical Specifications

Microprocessors MPC860TCZQ66D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860TCZQ66D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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