Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors MPC8323ECVRAFDCA is a 32-bit microprocessor with integrated cache and a max clock frequency of 66.67 MHz. It is commonly used in applications requiring low power mode and peripheral ICs, such as embedded systems and networking devices.
Median Price
$58.841
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Digiode
$72.694
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Anansix
Martec Srl
Flip Electronics
Nova Conductors
AZTECH Wire
$8.418
Corohmni
$42.616
Aztec Data Supply Inc.
$47.318
Ampacity Inc.
$65.040
Semicontronic
$63.414
$63.089
Corphita
$68.868
Vigor
$81.400
Lixinc
UNI Independent Distributors
Microchip USA
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Robosynatics
$19.579
$19.180
Lucentia Tech
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Bastille Electronics
PLASTIC/EPOXY - This material provides durability and protection for the microprocessor, making it a reliable choice.
YES - The integrated cache improves the microprocessor's overall performance and efficiency, making it an excellent option for demanding tasks.
YES - The surface mount feature allows for easier installation and integration of the microprocessor onto circuit boards, simplifying the manufacturing process.
1.05 V - The high maximum supply voltage ensures stable and consistent power delivery, making the microprocessor suitable for high-performance applications.
SQUARE - The square shape of the package allows for efficient utilization of space, making it ideal for compact devices or densely populated circuit boards.
32 - With a bit size of 32, this microprocessor offers compatibility with a wide range of software and ensures efficient data processing.
516 - The high number of terminals provides extensive connectivity options, allowing the microprocessor to interface with various components and peripherals.
GRID ARRAY - The grid array package style ensures reliable contact between the microprocessor and the circuit board, enhancing signal transmission and reducing the risk of errors.
0.95 V - The low minimum supply voltage allows for energy-efficient operation, reducing power consumption and heat generation, making it an environmentally friendly choice.
TIN SILVER - The tin silver terminal finish improves the microprocessor's conductivity and corrosion resistance, ensuring optimal performance and longevity.
BOTTOM - The bottom terminal position facilitates easy and secure mounting of the microprocessor onto the circuit board, enhancing stability and reliability.
2.55 mm - The low maximum seated height allows for a slimmer profile in devices, enabling the implementation of the microprocessor in space-constrained applications.
27 mm - The moderate width dimension provides a good balance between functionality and compactness, making it suitable for a wide range of device sizes.
YES - The inclusion of boundary scan functionality allows for efficient testing and debugging of the microprocessor during the manufacturing and development stages, ensuring quality and reliability.
66.67 MHz - The high maximum clock frequency enables the microprocessor to execute instructions at a fast rate, enhancing overall performance and responsiveness.
40 - The microprocessor can withstand peak reflow temperatures for up to 40 seconds, allowing for efficient and reliable soldering during manufacturing processes.
260 - The microprocessor's peak reflow temperature of 260°C ensures proper soldering and component bonding, resulting in a robust connection and long-lasting product.
27 mm - The moderate length dimension allows for versatility in device designs and compatibility with various sizes and form factors.
MICROPROCESSOR, RISC - Being a RISC (Reduced Instruction Set Computer) microprocessor, it offers enhanced performance by executing fewer and simpler instructions more quickly, making it well-suited for high-speed computing tasks.
CMOS - The CMOS technology employed in this microprocessor ensures low power consumption, high speed, and reliable performance, making it a desirable choice for energy-efficient devices.
BALL - The ball terminal form enhances connectivity and allows for efficient heat dissipation, contributing to the microprocessor's overall reliability and performance.
1 V - The nominal supply voltage of 1 V provides a stable and optimal power input, ensuring consistent and efficient operation of the microprocessor.
1 mm - The narrow terminal pitch allows for increased connectivity density, enabling the microprocessor to interface with numerous components and peripherals in a compact space.
FLOATING POINT - The floating-point format enables the microprocessor to perform complex mathematical operations with high precision and accuracy, making it well-suited for scientific and computational applications.
3 - With a moisture sensitivity level of 3, this microprocessor can withstand moderately high humidity environments, providing increased reliability and durability.
333 rpm - With a high rotational speed of 333 revolutions per minute, this microprocessor offers swift and efficient operation, making it ideal for time-sensitive tasks.
YES - The inclusion of a low power mode allows the microprocessor to conserve energy during periods of reduced activity, prolonging battery life and reducing overall power consumption.
Microprocessors MPC8323ECVRAFDCA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MPC8323ECVRAFDCA Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
LIS3DHTR
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
1N4148
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Microchip Technology
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
Multicomp Pro
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
Eic Semiconductor
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
MCIMX6Q4AVT10ADR
NXP Semiconductors
MCIMX6Q4AVT10ADR by NXP is a 32-bit microprocessor with 64-bit external data bus width. It operates at speeds up to 1000 rpm, suitable for automotive applications. Featuring integrated cache and low power mode, it has a temperature range of -40 to 125 °C and boundary scan capability.
P1014NXE5HFB
P1014NXE5HFB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 100 MHz. This processor features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices. With a package style of grid array and fine pitch, this chip offers advanced performance in a small form factor.
MCF5484CVR200
NXP Semiconductors' MCF5484CVR200 microprocessor features 32-bit architecture, 66.67 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. With a package style of grid array and terminal pitch of 1mm, it offers efficient performance in various embedded systems.
ATSAMA5D36A-CNR
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
AM3352BZCEA30
Texas Instruments
AM3352BZCEA30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and a max clock frequency of 26 MHz. Ideal for industrial applications requiring low power consumption, it features a package style of grid array with a low profile and fine pitch design. With an operating temperature range from -40 to 105°C, this processor offers integrated cache and boundary scan capabilities for efficient performance.
MPC8347EVRAGDB
NXP Semiconductors' MPC8347EVRAGDB microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is suitable for applications requiring integrated cache, low power mode, and boundary scan capabilities. The package style is grid array with 620 terminals, making it ideal for high-performance computing systems.
STM32MP157FAA1
MICROPROCESSOR, RISC;
I5-3470
Intel
MICROPROCESSOR; Technology: CMOS;
ATSAMA5D35A-CN
MPC5121YVY400B
NXP Semiconductors' MPC5121YVY400B microprocessor features 32-bit architecture, integrated cache, and operates at a speed of 400 rpm. Ideal for industrial applications, it has low power mode capability and supports boundary scan technology.
MCF5328CVM240
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
MPC5123YVY400B
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: HBGA; Package Shape: SQUARE;
MCF54452CVP200
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCIMX6U5EVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
BV80605001911APSLBLC
Intel BV80605001911APSLBLC is a 64-bit microprocessor with 1156 terminals and CMOS technology. Operating at 0.65/1.4V, it has a max supply current of 110000mA and speed of 2660rpm. This processor is suitable for high-performance computing applications requiring efficient power consumption and advanced processing capabilities.
MC9S08PT16VLD
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
DM3730CUSA
The Texas Instruments DM3730CUSA microprocessor features 32-bit architecture, 1.2V supply voltage, and 54MHz clock frequency. Ideal for industrial applications requiring a low-profile package with integrated cache and boundary scan capabilities.
DRA829VMTGBALFR
DRA829VMTGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for high-speed computing applications. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various industrial settings.
MCF5233CVM150
NXP Semiconductors' MCF5233CVM150 microprocessor features 32-bit architecture, 75 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85 °C and boundary scan capability.
MPC8347VVAJFB
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 672; Package Code: LBGA; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MPC8270CVRMIBA
The NXP Semiconductors MPC8270CVRMIBA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 266 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing in devices such as networking equipment and industrial control systems.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC8308CVMAGDA
NXP Semiconductors' MPC8308CVMAGDA is a 32-bit microprocessor with integrated cache, operating at speeds up to 400 rpm. It features low power mode and boundary scan support, suitable for industrial applications. With a package style of grid array and fine pitch, it offers 473 terminals in a compact square shape.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;
MPC8270CVRMIBA,557
NXP Semiconductors' MPC8270CVRMIBA,557 microprocessor features 32-bit address bus width, 64-bit external data bus width, and a max clock frequency of 266 MHz. Ideal for applications requiring high-speed processing such as networking equipment and industrial automation systems.
MPC8308VMAGDA
The NXP Semiconductors MPC8308VMAGDA microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and supports low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a square package shape and 473 terminals.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE; Data EEPROM Size: 0;
MPC8314VRAGDA
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: HBGA; Package Shape: SQUARE;
The NXP Semiconductors MPC8314VRAGDA is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and heat sink/slug, this processor is ideal for use in various embedded systems where space efficiency is crucial.
MPC8569EVTAUNLB
MPC8569EVTAUNLB by Freescale: 32-bit microprocessor with 64-bit data bus, 16-bit address bus, and integrated cache. Ideal for RISC applications requiring low power mode, operating at max clock frequency of 133 MHz. Features grid array package style suitable for surface mount assembly.
MPC8321ECVRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 0;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;
MPC8270VRMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC8321VRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MPC8280CZUQLDA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MPC852TVR100A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,16X16,50;
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