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TMS320DM8127BCYE2

Texas Instruments

TMS320DM8127BCYE2 by Texas Instruments

TMS320DM8127BCYE2 by Texas Instruments is a 32-bit microprocessor with 16-bit external data bus width, operating at max 30 MHz clock frequency. Ideal for low power applications, it features integrated cache and boundary scan support. Suitable for various embedded systems requiring high-speed processing in a compact form factor.

Median Price

$81.574

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 640 parts In-Stock

1+ parts

-

100+ parts

$72.510

1k+ parts

$64.880

10k+ parts

$61.060

640

-

$72.510

$64.880

$61.060

DigiKey

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

640

-

-

-

-

Verical

USA . 340 parts In-Stock

1+ parts

-

100+ parts

$90.638

1k+ parts

$81.100

10k+ parts

$76.325

340

-

$90.638

$81.100

$76.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,425 parts In-Stock

1+ parts

$76.542

100+ parts

-

1k+ parts

-

10k+ parts

-

2,425

$76.542

-

-

-

Vyrian

USA . 6,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,796

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,307 parts In-Stock

1+ parts

$18.069

100+ parts

-

1k+ parts

$18.215

10k+ parts

-

1,307

$18.069

-

$18.215

-

DigiPath Technology Company

USA . 1,523 parts In-Stock

1+ parts

$19.896

100+ parts

$18.304

1k+ parts

-

10k+ parts

-

1,523

$19.896

$18.304

-

-

ChromeModa Solutions

Germany . 6,373 parts In-Stock

1+ parts

$20.302

100+ parts

$16.648

1k+ parts

-

10k+ parts

-

6,373

$20.302

$16.648

-

-

IDEA Electronic Components Group

UK . 1,807 parts In-Stock

1+ parts

$20.302

100+ parts

$19.287

1k+ parts

$18.272

10k+ parts

-

1,807

$20.302

$19.287

$18.272

-

Corphita

USA . 1,871 parts In-Stock

1+ parts

$72.513

100+ parts

-

1k+ parts

-

10k+ parts

-

1,871

$72.513

-

-

-

Component Stockers USA

USA . 910 parts In-Stock

1+ parts

$82.730

100+ parts

$77.780

1k+ parts

-

10k+ parts

-

910

$82.730

$77.780

-

-

Microchip USA

USA . 414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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414

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Overview

Experience the power of cutting-edge technology with the TMS320DM8127BCYE2 by Texas Instruments, a leading manufacturer in the industry. This high-quality microprocessor offers unparalleled performance and reliability, making it ideal for a wide range of applications. From enhancing communication systems to powering industrial automation, this innovative product provides exceptional value and benefits to customers looking for superior solutions. Trust Texas Instruments to deliver excellence with the TMS320DM8127BCYE2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability of the microprocessor, making it suitable for long-term use.

Integrated Cache: YES

Having integrated cache enhances the performance of the microprocessor by allowing for quicker access to frequently used data, resulting in improved efficiency.

Maximum Supply Voltage: 1.42 V

The high maximum supply voltage of 1.42 V ensures that the microprocessor can handle power fluctuations without risk of damage, providing stability in operation.

Address Bus Width: 28

With a wide address bus width of 28, the microprocessor can handle larger amounts of memory and data, making it suitable for complex computing tasks.

Package Shape: SQUARE

The square package shape allows for efficient handling and placement of the microprocessor on circuit boards, optimizing space utilization in electronic devices.

Bit Size: 32

A bit size of 32 indicates that the microprocessor can process data in 32-bit pieces, leading to faster and more efficient operation in handling tasks and applications.

No. of Terminals: 684

Having a high number of terminals enables the microprocessor to connect with a wide range of components and peripherals, expanding its compatibility and functionality.

Technology: CMOS

The CMOS technology used in the microprocessor ensures low power consumption and high reliability, making it an energy-efficient and dependable choice for electronic devices.

Technical Specifications

Microprocessors TMS320DM8127BCYE2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127BCYE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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