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MCF54452VR266

NXP Semiconductors

MCF54452VR266 by NXP Semiconductors

NXP Semiconductors MCF54452VR266 microprocessor features 32-bit address and data bus width, with integrated cache. Operating at a max clock frequency of 66 MHz, it is suitable for commercial-grade applications requiring low power consumption. The package style is grid array with a terminal pitch of 1 mm, making it ideal for compact designs.

Median Price

$6.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,147 parts In-Stock

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$6.500

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Anansix

USA . 2,536 parts In-Stock

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2,536

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Digiode

USA . 2,003 parts In-Stock

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2,003

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Ampacity Inc.

Singapore . 961 parts In-Stock

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$9.000

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961

$9.000

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One Stop Electronics

USA . 2,096 parts In-Stock

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$26.000

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Vigor

Singapore . 440 parts In-Stock

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$32.010

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440

$32.010

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Corohmni

South Africa . 175 parts In-Stock

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$66.763

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175

$66.763

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Modulus Dynamics

Lithuania . 1,436 parts In-Stock

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$70.271

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$70.271

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$70.271

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1,436

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$70.271

$70.271

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Microchip USA

USA . 477 parts In-Stock

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$145.719

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477

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UNI Independent Distributors

Spain . 2,897 parts In-Stock

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Corphita

USA . 2,524 parts In-Stock

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Kepictronics

USA . 2,300 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,415 parts In-Stock

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Continental Prestige Electronics

USA . 1,314 parts In-Stock

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1,314

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Perfect Parts

USA . 633 parts In-Stock

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633

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Authorized Procurement Solutions

USA . 180 parts In-Stock

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180

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iodParts Technologies Inc.

India . 150 parts In-Stock

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150

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Overview

Unleash the power of innovation with the MCF54452VR266 by NXP Semiconductors. This high-quality microprocessor boasts integrated cache and a wide range of power supplies, making it ideal for a variety of applications. From industrial automation to consumer electronics, this versatile chip offers exceptional performance and reliability. Experience the value and benefits of cutting-edge technology with the MCF54452VR266, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microprocessor by reducing memory access times.

Maximum Supply Voltage: 1.65 V

This ensures the microprocessor operates within safe voltage limits, preventing damage due to overvoltage.

Address Bus Width: 32

A wider address bus allows for larger memory addressing capabilities, enabling better performance in handling data.

Package Shape: SQUARE

Square package shape helps in efficient placement on circuit boards, optimizing space usage.

Power Supplies (V): 1.5,1.8,2.5,3.3

Availability of multiple power supply options gives flexibility in power management based on system requirements.

No. of Terminals: 360

Having a high number of terminals allows for more connectivity options, enhancing the microprocessor's compatibility with various systems.

Minimum Operating Temperature: 0 °C

The microprocessor can operate at lower temperatures efficiently, suitable for a wide range of environmental conditions.

Maximum Clock Frequency: 66 MHz

Higher clock frequency allows for faster processing speeds, making the microprocessor suitable for tasks that require quick calculations.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture enhances the microprocessor's performance by simplifying instruction execution, enabling high-speed processing.

Technical Specifications

Microprocessors MCF54452VR266 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B360

JESD-609 Code:

e2

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

360

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA360,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,1.8,2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.48 mm

Speed:

266 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

23 mm

Peripheral IC Type:

Trade Compliance

MCF54452VR266 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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