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AM3517AZCNC

Texas Instruments

AM3517AZCNC by Texas Instruments

The Texas Instruments AM3517AZCNC microprocessor features 16-bit address and external data bus width, with a max clock frequency of 26 MHz. It operates at supply voltages of 1.2V, 1.8V, and 3.3V, suitable for low power mode applications in various devices requiring high-speed processing capabilities. The package style is grid array with a low profile and fine pitch design, making it ideal for compact electronic systems where space is limited.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,916 parts In-Stock

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Digiode

USA . 2,921 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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VNN

France . 235 parts In-Stock

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One Stop Electronics

USA . 1,422 parts In-Stock

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$14.000

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$14.000

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Ampacity Inc.

Singapore . 356 parts In-Stock

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$15.000

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356

$15.000

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AZTECH Wire

Italy . 668 parts In-Stock

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$16.962

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$16.962

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Corohmni

South Africa . 411 parts In-Stock

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$23.112

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$23.112

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Semicontronic

India . 1,586 parts In-Stock

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$32.000

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$31.200

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$31.040

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$57.730

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$54.844

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$54.844

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Parana Technologies

USA . 1,361 parts In-Stock

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$62.994

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IDEA Electronic Components Group

UK . 1,130 parts In-Stock

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$70.780

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$67.241

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$63.702

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ChromeModa Solutions

Germany . 929 parts In-Stock

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$70.780

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$58.040

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QUARKTWIN TECHNOLOGY LTD

USA . 26,472 parts In-Stock

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Continental Prestige Electronics

USA . 4,828 parts In-Stock

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Corphita

USA . 4,801 parts In-Stock

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Argo Parts USA

USA . 3,704 parts In-Stock

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Microchip USA

USA . 1,665 parts In-Stock

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DigiPath Technology Company

USA . 1,342 parts In-Stock

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$63.815

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Experience cutting-edge technology with the AM3517AZCNC by Texas Instruments, a high-quality microprocessor designed to meet your every need. From its integrated cache to its low power mode, this versatile product offers unparalleled value and benefits. With applications ranging from industrial automation to consumer electronics, this microprocessor is sure to exceed your expectations. Trust in Texas Instruments, a leader in the industry, and elevate your projects to the next level with the AM3517AZCNC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing the access time to frequently used data.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the microprocessor on a circuit board.

Maximum Supply Voltage: 1.248 V

Operating within a specific voltage range ensures stable performance and prevents damage to the microprocessor.

Address Bus Width: 16

A wider address bus allows for efficient data transfer and processing within the microprocessor.

Package Shape: SQUARE

The square package shape is typically more compact and allows for efficient use of space on a circuit board.

Bit Size: 16

A 16-bit architecture provides a good balance between performance and power efficiency for various applications.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply voltages allows flexibility in designing different types of systems using this microprocessor.

No. of Terminals: 491

Having a large number of terminals enables connectivity with various components for seamless functioning.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

These package styles offer versatility in mounting options and can be suitable for different types of applications.

Minimum Supply Voltage: 1.152 V

A low minimum supply voltage ensures energy efficiency and can help in reducing power consumption during operation.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to connect the microprocessor to the circuit board and facilitates efficient heat dissipation.

Maximum Seated Height: 1.3 mm

A low seated height allows for a compact design, which is beneficial for space-constrained applications.

Width: 17 mm

The width of the microprocessor is suitable for various form factors and can be easily integrated into different systems.

Boundary Scan: YES

Boundary scan capability helps in testing and diagnosing faults in the microprocessor, improving reliability and ease of troubleshooting.

External Data Bus Width: 16

A wider external data bus width enables faster data transfer rates and enhances the processing capabilities of the microprocessor.

Maximum Clock Frequency: 26 MHz

Operating at a high clock frequency allows for faster execution of instructions, making the microprocessor suitable for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperatures for a specified duration ensures the reliability of the microprocessor during assembly processes.

Peak Reflow Temperature °C: 260

Withstanding high peak reflow temperatures helps in ensuring proper soldering during the assembly of the microprocessor onto the circuit board.

Length: 17 mm

The length of the microprocessor complements its width, providing a balanced form factor for various applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor enables efficient and fast execution of instructions, making it suitable for performance-critical tasks.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making the microprocessor energy efficient and versatile.

Terminal Form: BALL

Ball terminals provide reliable connections and are commonly used in various electronic components, ensuring compatibility and ease of installation.

Nominal Supply Voltage: 1.2 V

Operating within a specific nominal supply voltage ensures stable performance and optimal power efficiency for the microprocessor.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for high-density mounting, making the microprocessor suitable for compact designs and miniaturized devices.

Format: FLOATING POINT

Support for floating-point operations enhances the computational capabilities of the microprocessor, making it suitable for complex calculations and data processing.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level ensures the reliability of the microprocessor during storage and assembly processes.

Speed: 600 rpm

Operating at a specific speed allows for consistent performance and reliability of the microprocessor under various operating conditions.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and extends the battery life of devices powered by the microprocessor.

Technical Specifications

Microprocessors AM3517AZCNC attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM3517AZCNC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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