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MCF54452CVR200

NXP Semiconductors

MCF54452CVR200 by NXP Semiconductors

NXP Semiconductors' MCF54452CVR200 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. Suitable for industrial applications, it operates b/w -40 to 85 °C, offering low power mode and integrated cache for efficient performance.

Median Price

$20.330

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 70 parts In-Stock

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$17.560

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$15.710

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$14.780

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$14.780

Verical

USA . 60 parts In-Stock

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$23.100

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Nova Conductors

Japan . 98 parts In-Stock

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$21.937

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Flip Electronics

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Vyrian

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Digiode

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Anansix

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Prism Electronics

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Velocity Electronics

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One Stop Electronics

USA . 2 parts In-Stock

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$2.000

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$2.000

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AZTECH Wire

Italy . 538 parts In-Stock

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$16.701

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Netroflash

USA . 1,000 parts In-Stock

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$21.937

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$20.840

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$20.401

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$20.401

Ampacity Inc.

Singapore . 60 parts In-Stock

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$29.000

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Vigor

Singapore . 600 parts In-Stock

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$32.010

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$32.010

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Modulus Dynamics

Lithuania . 1,479 parts In-Stock

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$64.303

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$64.303

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$64.303

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Corohmni

South Africa . 246 parts In-Stock

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Microchip USA

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Robosynatics

Brazil . 4,520 parts In-Stock

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Lucentia Tech

USA . 4,520 parts In-Stock

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$55.590

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$54.455

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$54.455

Continental Prestige Electronics

USA . 4,470 parts In-Stock

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Corphita

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Perfect Parts

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Argo Parts USA

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iodParts Technologies Inc.

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Speed Components Ltd (Excess)

Israel . 12 parts In-Stock

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GreenTree Electronics

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Overview

Unlock unparalleled performance and reliability with the MCF54452CVR200 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers cutting-edge microprocessors that set the standard for quality and innovation. Designed with integrated cache and a variety of power supplies, this product is versatile and efficient, making it perfect for a wide range of applications. Experience the value and benefits of this top-of-the-line microprocessor, offering customers unmatched speed, efficiency, and reliability. Elevate your projects with the MCF54452CVR200 and discover the difference that NXP Semiconductors can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reduces the overall weight of the microprocessor, making it a reliable and lightweight choice.

Integrated Cache: YES

The integrated cache enhances the performance of the microprocessor by allowing for quicker access to frequently used data, making it an efficient choice for high-speed computing tasks.

Surface Mount: YES

The surface mount capability makes it easy to install the microprocessor on a circuit board, saving time and effort during assembly and making it a convenient choice for production.

Maximum Supply Voltage: 1.65 V

The maximum supply voltage of 1.65 V ensures optimal power efficiency while providing sufficient voltage for seamless operation, making it a reliable and energy-efficient choice.

Address Bus Width: 32

With an address bus width of 32, this microprocessor can handle a large amount of memory address space efficiently, making it suitable for complex computing tasks that require extensive memory access.

Package Shape: SQUARE

The square package shape allows for compact and efficient placement on the circuit board, saving space and enabling streamlined design layouts, making it a versatile choice for tight configurations.

Bit Size: 32

The 32-bit size of the microprocessor allows for quick and efficient data processing, making it suitable for demanding computational tasks that require high-speed performance.

Power Supplies (V): 1.5,1.8,2.5,3.3

The availability of multiple power supply options (1.5V, 1.8V, 2.5V, 3.3V) provides flexibility in accommodating different system requirements, making it a versatile choice for various applications.

No. of Terminals: 360

With 360 terminals, this microprocessor offers ample connectivity options for interfacing with external components, making it a versatile choice for integrating into diverse electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure and reliable connections between the microprocessor and the circuit board, reducing the risk of signal interference and making it a robust choice for demanding environments.

Technical Specifications

Microprocessors MCF54452CVR200 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B360

JESD-609 Code:

e2

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

360

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA360,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,1.8,2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.48 mm

Speed:

200 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

23 mm

Peripheral IC Type:

Trade Compliance

MCF54452CVR200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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