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FH8065301567313SR3UZ

Intel

FH8065301567313SR3UZ by Intel

Intel's FH8065301567313SR3UZ microprocessor features 64-bit size, 1170 terminals, and operates at speeds up to 1330 rpm. Suitable for industrial applications with a temperature range of -40 to 110 °C, this processor is designed for high-performance computing tasks requiring integrated cache and CMOS technology.

Median Price

$51.995

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FH8065301567313SR3UZ by Intel
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Verical

USA . 161 parts In-Stock

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$46.810

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$38.460

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$37.080

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Mouser Electronics

USA . 392 parts In-Stock

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$57.180

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$42.460

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Nova Conductors

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Digiode

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TME

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Vyrian

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Continental Prestige Electronics

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Ampacity Inc.

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Corphita

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Qasali Group International

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Argo Parts USA

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Perfect Parts

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Overview

Intel's E3800 Atom Processor family is based on the Silvermont microarchitecture, and utilizes Intel's industry-leading 22nm process technology with 3-D Tri-Gate transistors to deliver significant improvements in computational performance and energy-efficiency in intelligent systems. It is the first system-on-chip (SoC) designed for intelligent systems, delivering outstanding compute, graphical and media performance while operating in an extended range of thermal conditions. Highlights include high I/O connectivity, integrated memory controller, virtualization, Error Correcting Code (ECC), and built-in security capabilities with a thermal design power (TDP) range of 5W to 10W. This product family is ideal for efficient imaging workflows, digital signage with secure content delivery, visually appealing interactive clients (interactive kiosks, intelligent vending, ATM and point-of-sale (POS) terminals, portable medical devices, industrial control systems, and in-vehicle infotainment (IVI) systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, ensuring the microprocessor can withstand various environmental conditions.

Integrated Cache: YES

Integrated cache helps improve the performance of the microprocessor by storing frequently accessed data, reducing latency and boosting overall speed.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration onto circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to place and secure the microprocessor within electronic devices, optimizing space usage and ensuring proper fit.

Bit Size: 64

64-bit architecture allows for handling more data at a time, improving overall performance and compatibility with modern software applications.

No. of Terminals: 1170

Having a high number of terminals provides greater connectivity options and flexibility for interfacing with other components in the system.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced thermal performance, better electrical characteristics, and increased reliability for the microprocessor.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this microprocessor can function reliably even in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the microprocessor remains operational even in cold conditions, providing reliability and stability in a wide range of environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and connection to the circuit board, facilitating efficient installation and maintenance of the microprocessor.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the microprocessor can perform consistently in harsh conditions commonly found in industrial settings.

Peripheral IC Type: MICROPROCESSOR

Specifically designed as a microprocessor, this product offers optimized performance and efficiency for computing tasks in various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in operation.

Terminal Form: BALL

Ball terminal form simplifies the installation process by enabling quick and secure connections to the circuit board, reducing assembly time and effort.

Format: FIXED POINT

Fixed-point format ensures accurate and efficient data processing for numerical calculations, making this microprocessor suitable for a wide range of computational tasks.

Speed: 1330 rpm

With a high operating speed of 1330 rpm, this microprocessor can deliver fast and responsive performance for demanding computing applications.

Technical Specifications

Microprocessors FH8065301567313SR3UZ attributes and parameters. Explore more Microprocessors devices from Intel

Specs

Bit Size:

64

Boundary Scan:

NO

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B1170

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Speed:

1330 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

FH8065301567313SR3UZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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