Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Intel FH8065301487717 microprocessor features a 64-bit architecture with 16-bit address bus width and 64-bit external data bus width. With integrated cache and low power mode, it is ideal for high-performance computing applications requiring efficient processing capabilities. The package style of GRID ARRAY with 1170 terminals ensures reliable surface mount installation in various devices.
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Having an integrated cache helps improve the overall performance of the microprocessor by storing frequently accessed data closer to the processor, reducing access times and improving efficiency.
Surface mount technology allows for easier and more efficient installation of the microprocessor onto a motherboard, saving time and effort during assembly.
The rectangular package shape ensures compatibility with standard motherboard designs, making it easier to integrate the microprocessor into various systems.
A 64-bit architecture allows for increased memory addressability and processing capabilities, making this microprocessor suitable for handling complex tasks and large datasets.
Having a higher number of terminals allows for greater connectivity options and compatibility with various peripherals and components, enhancing the overall versatility of the microprocessor.
Operating at a speed of 1910 rpm, this microprocessor can deliver fast and efficient performance for demanding applications, ensuring smooth operation and responsiveness.
The low power mode feature helps to optimize energy efficiency and reduce power consumption, making this microprocessor a suitable choice for applications where power conservation is important.
Microprocessors FH8065301487717 attributes and parameters. Explore more Microprocessors devices from Intel
Address Bus Width:
Bit Size:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Low Power Mode:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Speed:
Surface Mount:
Technology:
Terminal Form:
Terminal Position:
Peripheral IC Type:
FH8065301487717 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
Synsemi
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
American Power Devices
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
SMBJ18CA
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
National Semiconductor
MCF5373LCVM240
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
STM32MP153CAB3T
STMicroelectronics
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MPC8343ZQADDB
NXP Semiconductors' MPC8343ZQADDB microprocessor features 32-bit address and external data bus width, with integrated cache and max clock frequency of 66 MHz. Ideal for low power applications, it operates b/w 0-105°C, in a square grid array package with 620 terminals.
ADSP-21489KSWZ-4A
Analog Devices
ADSP-21489KSWZ-4A by Analog Devices is a 40-bit microprocessor with integrated cache and a max clock frequency of 25 MHz. It is commonly used in applications requiring high-speed processing and floating-point calculations.
MCIMX6U6AVM08AC
MCIMX6U6AVM08AC by NXP is a 64-bit microprocessor with 16-bit address bus, operating at max 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, supporting boundary scan technology. With a temp range of -40 to 125 °C, this CMOS processor has a terminal pitch of 0.8 mm and package style in grid array format.
MIMXRT1064DVL6A
The NXP Semiconductors MIMXRT1064DVL6A is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It is used in applications requiring low power mode, such as IoT devices and embedded systems.
CS80C286-16
Renesas Electronics
CS80C286-16 by Renesas Electronics is a 16 rpm microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at temperatures b/w 0 to 70 °C, making it suitable for commercial applications requiring low power mode and fixed-point format processing.
MIMXRT1062DVL6A
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MPC8347EVVAJDB
The NXP Semiconductors MPC8347EVVAJDB is a 32-bit microprocessor with integrated cache and external data bus width of 32. It operates at a max clock frequency of 66 MHz, suitable for low power mode applications in various industries. With a package style of grid array and low profile, it offers high performance within a compact form factor.
P1013NXE2LFB
P1013NXE2LFB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max frequency of 133 MHz. It features low power mode and boundary scan capabilities, making it suitable for automotive applications requiring high-speed processing in a compact package. With a terminal pitch of 1 mm and moisture sensitivity level of 3, this CMOS technology-based processor offers efficient performance in demanding environments.
MCF5233CVM150
NXP Semiconductors' MCF5233CVM150 microprocessor features 32-bit architecture, 75 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85 °C and boundary scan capability.
MPC8245LVV266D
Motorola
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Boundary Scan: YES;
ATSAMA5D31A-CFUR
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: TFBGA; Package Shape: SQUARE;
IBM25PPC750FX-GB0133T
Ibm Microelectronics
IBM25PPC750FX-GB0133T by Ibm Microelectronics is a 32-bit RISC microprocessor with integrated cache and 64-bit external data bus. Operating at a max clock frequency of 200 MHz, it features low power mode and boundary scan for efficient performance in various applications requiring high-speed processing.
MCIMX537CVV8C
MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.
MCIMX6U8DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 64;
MPC8343VRADDB
NXP Semiconductors' MPC8343VRADDB microprocessor features 32-bit address and external data bus width, with integrated cache. Operating at a max clock frequency of 66 MHz, it supports low power mode and has a max supply voltage of 1.26 V. Ideal for applications requiring high-speed processing in compact spaces like networking equipment and embedded systems.
MCF53281CVM240
AM3352BZCZT60R
Texas Instruments
AM3352BZCZT60R by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for automotive applications due to its low power mode, it features a temperature grade of AUTOMOTIVE and boundary scan capability.
DM3730CUS100
DM3730CUS100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 54 MHz, suitable for low power applications in various industries like automotive and industrial automation. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.
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FH8065301487918SR1X7
Intel
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Integrated Cache: YES;
FH8065801974816SR267
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1168; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1168;
FH8065301487717SR3UT
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1170; Package Shape: RECTANGULAR; Bit Size: 64;
FH8066802980002SR2YB
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1296; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1296;
FH8066802980002SR2Z7
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1296; Package Code: BGA; Package Shape: RECTANGULAR; Format: FIXED POINT;
FH8065301567313
Intel FH8065301567313 is a 64-bit microprocessor with integrated cache. It has a package shape of rectangular and surface mount capability. This industrial-grade processor operates at temperatures ranging from -40 to 110 °C, making it suitable for various applications.
FH8065301567313SR1X9
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR;
FH8065301567313SR3UZ
FH8069004541900SRK0Y
Microprocessors;
FH8065301487715SR1RE
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Bit Size: 64;
FH8065301487717SR1X6
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
FH8066802979803SR2Z6
MICROPROCESSOR;
FH8065503553601SR3H1
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1283; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
FH8065503553701SR3H2
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1283; Package Shape: RECTANGULAR; Speed: 1700 rpm; Boundary Scan: NO;
FH8066501715923SR2A7
FH8066501715928SR2KP
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1170;
FH8069004638047SRKWY
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1787; Package Shape: RECTANGULAR; Format: FIXED POINT; Technology: CMOS;
FH8065301487715
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Format: FIXED POINT;
FH8065301487916
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
FH8065301487918
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Address Bus Width: 16;
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