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MCF5275LCVM166

Freescale Semiconductor

MCF5275LCVM166 by Freescale Semiconductor

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

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$32.217

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Technical Specifications

Microprocessors MCF5275LCVM166 attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

83 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,2.5/3.3,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

166 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER OVER NICKEL

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MCF5275LCVM166 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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