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MPC860PCZQ50D4

NXP Semiconductors

MPC860PCZQ50D4 by NXP Semiconductors

The NXP Semiconductors MPC860PCZQ50D4 is a 32-bit microprocessor with integrated cache and a max clock frequency of 50 MHz. It is commonly used in applications requiring low power mode and high-speed processing, such as embedded systems and industrial automation.

Median Price

$207.450

Lifecycle Status

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7

In-Stock Inventory

1k+

MPC860PCZQ50D4 by NXP Semiconductors
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Rochester

USA . 54 parts In-Stock

1+ parts

$207.450

100+ parts

$195.000

1k+ parts

$182.560

10k+ parts

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54

$207.450

$195.000

$182.560

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Distributors (In-Stock)

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Nova Conductors

Japan . 64 parts In-Stock

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$143.936

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64

$143.936

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Vyrian

USA . 4,096 parts In-Stock

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Digiode

USA . 3,910 parts In-Stock

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3,910

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Flip Electronics

USA . 969 parts In-Stock

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Anansix

USA . 496 parts In-Stock

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496

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Zilex Electronics Inc.

Canada . 32 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 282 parts In-Stock

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$13.284

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$13.284

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Advanced Electronics

New Zealand . 37 parts In-Stock

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$54.258

100+ parts

$49.375

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$44.492

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37

$54.258

$49.375

$44.492

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Microchip USA

USA . 290 parts In-Stock

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$96.298

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Vigor

Singapore . 392 parts In-Stock

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$124.840

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Ampacity Inc.

Singapore . 888 parts In-Stock

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$137.280

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$137.280

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One Stop Electronics

USA . 774 parts In-Stock

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$137.280

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Aranea Global

USA . 500 parts In-Stock

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$141.057

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$135.415

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500

$141.057

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$135.415

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Continental Prestige Electronics

USA . 5,038 parts In-Stock

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$143.936

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$141.057

5,038

$143.936

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$141.057

Semicontronic

India . 916 parts In-Stock

1+ parts

$298.780

100+ parts

$291.310

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$289.817

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916

$298.780

$291.310

$289.817

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UNI Independent Distributors

Spain . 6,884 parts In-Stock

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Corphita

USA . 3,274 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Argo Parts USA

USA . 2,043 parts In-Stock

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Kepictronics

USA . 1,045 parts In-Stock

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Perfect Parts

USA . 49 parts In-Stock

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Overview

Discover the power of the MPC860PCZQ50D4 by NXP Semiconductors, a high-quality microprocessor that offers unrivaled performance and reliability. Manufactured by NXP Semiconductors, a leader in the industry, this product is designed to exceed expectations. With its integrated cache and surface mount capabilities, it brings a new level of efficiency to your applications. Whether you're looking to enhance your electronics or develop cutting-edge solutions, the MPC860PCZQ50D4 delivers with its 32-bit technology and low power mode. Experience the value and benefits of this exceptional microprocessor and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the microprocessor, making it a reliable choice for various applications.

Integrated Cache: YES

The presence of integrated cache enhances the performance and efficiency of the microprocessor, making it capable of handling complex tasks smoothly.

Surface Mount: YES

The ability to surface mount the microprocessor simplifies the assembly process and allows for compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.465 V

With a high maximum supply voltage, this microprocessor can operate reliably even in demanding conditions, ensuring stability and optimal performance.

Address Bus Width: 32

With a wide address bus width of 32, the microprocessor can efficiently handle a large amount of memory, facilitating faster data retrieval and processing.

Package Shape: SQUARE

The square package shape provides better compatibility and ease of integration with other components, contributing to the overall versatility and usability of the microprocessor.

Bit Size: 32

The microprocessor's 32-bit architecture enables it to process and manipulate data in larger chunks, resulting in improved performance and faster execution speeds.

Power Supplies (V): 3.3

The low power supply requirement of 3.3V makes this microprocessor an energy-efficient choice, reducing power consumption and heat generation.

No. of Terminals: 357

With 357 terminals, this microprocessor offers extensive connectivity options, allowing for seamless integration with external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides a high-density configuration, maximizing space utilization and enabling efficient thermal management, making it an excellent choice for compact systems.

Minimum Supply Voltage: 3.135 V

The microprocessor's low minimum supply voltage ensures reliable operation even in low-power scenarios, increasing its versatility for use in various power-sensitive applications.

Minimum Operating Temperature: -40 °C

The capability to operate in extreme temperatures as low as -40 °C enhances the microprocessor's reliability, making it suitable for harsh environments and outdoor use.

Terminal Finish: TIN LEAD

The use of tin lead as the terminal finish enhances the microprocessor's solderability, facilitating robust and reliable connections during assembly.

Terminal Position: BOTTOM

The bottom terminal position simplifies the routing of traces and allows for more straightforward board layouts, making it easier to design and manufacture systems with this microprocessor.

Maximum Seated Height: 2.52 mm

The microprocessor's low maximum seated height allows for compact designs and efficient space utilization, making it ideal for slim and portable devices.

Width: 25 mm

With a width of 25mm, this microprocessor offers compatibility with various board sizes and form factors, increasing its suitability for different system configurations.

Boundary Scan: YES

The inclusion of boundary scan capabilities simplifies the testing and debugging process, improving overall product quality and reducing time-to-market for devices utilizing this microprocessor.

External Data Bus Width: 32

The wide external data bus width of 32 ensures efficient data transfer between the microprocessor and external memory or peripherals, enhancing system performance.

Maximum Clock Frequency: 50 MHz

With a maximum clock frequency of 50 MHz, this microprocessor enables high-speed data processing and execution, making it ideal for applications that require real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The microprocessor's ability to withstand peak reflow temperatures for up to 30 seconds ensures reliable solder joints and prevents damage during assembly processes.

Peak Reflow Temperature °C: 245

The microprocessor's high peak reflow temperature tolerance of 245°C allows for compatibility with lead-free soldering processes, ensuring compliance with environmental regulations.

Length: 25 mm

The 25mm length of this microprocessor enables it to be accommodated in various system designs, providing flexibility and compatibility with different application requirements.

Peripheral IC Type: MICROPROCESSOR, RISC

With its RISC (Reduced Instruction Set Computing) architecture, this microprocessor delivers efficient and streamlined execution of instructions, optimizing system performance.

Technology: CMOS

The adoption of CMOS (Complementary Metal-Oxide-Semiconductor) technology in this microprocessor ensures low power consumption, high reliability, and compatibility with modern digital systems.

Terminal Form: BALL

The ball terminal form simplifies the soldering process by providing a large surface area for reliable electrical connections, ensuring a robust and durable assembly.

Nominal Supply Voltage: 3.3 V

The microprocessor's nominal supply voltage of 3.3V ensures compatibility with a wide range of power sources, making it suitable for various applications and power supply configurations.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for high-density packaging and facilitates reliable solder connections, enabling the microprocessor to be used in space-constrained designs.

Format: FIXED POINT

The fixed-point format supported by this microprocessor simplifies numerical calculations and ensures accurate and precise results, making it suitable for arithmetic-intensive applications.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this microprocessor exhibits moderate moisture sensitivity during storage and handling, ensuring long-term reliability and robustness.

Speed: 50 rpm

Operating at a speed of 50 revolutions per minute, this microprocessor offers rapid data processing and execution, making it suitable for time-sensitive applications.

Low Power Mode: YES

The microprocessor's ability to operate in a low power mode conserves energy and extends battery life, making it an efficient choice for battery-powered devices.

Technical Specifications

Microprocessors MPC860PCZQ50D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

50 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860PCZQ50D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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