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AM6411BKCGGAALV

Texas Instruments

AM6411BKCGGAALV by Texas Instruments

AM6411BKCGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, suitable for low power applications in industrial settings. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm and a nominal voltage of 0.75 V.

Median Price

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Lifecycle Status

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4

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1k+

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VNN

France . 2,157 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 718 parts In-Stock

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Ampacity Inc.

Singapore . 1,343 parts In-Stock

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One Stop Electronics

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Parana Technologies

USA . 1,761 parts In-Stock

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DigiPath Technology Company

USA . 2,069 parts In-Stock

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ChromeModa Solutions

Germany . 5,786 parts In-Stock

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IDEA Electronic Components Group

UK . 1,739 parts In-Stock

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Argo Parts USA

USA . 4,055 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unlock the power of innovation with the AM6411BKCGGAALV microprocessor by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers top-of-the-line products that cater to a wide range of applications. This microprocessor is a game-changer, offering unmatched value and benefits to customers looking to optimize their systems. With integrated cache, high-speed processing capabilities, and low power consumption, this product is the perfect solution for those seeking reliable and efficient performance. Upgrade your devices with the AM6411BKCGGAALV and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Integrated Cache: YES

The integrated cache helps improve performance by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 0.79 V

Having a low maximum supply voltage helps in reducing power consumption and heat generation.

On Chip Data RAM Width: 16

A wider data RAM width allows for faster data processing and multitasking capabilities.

Address Bus Width: 14

A wider address bus allows for larger memory addressing capabilities, which is beneficial for handling more complex operations.

No. of Terminals: 441

Having a higher number of terminals allows for more connectivity options and integration with other components.

Maximum Seated Height: 2.652 mm

The compact seated height makes this product suitable for applications where space is limited.

Speed: 1000 rpm

The high speed capability ensures efficient data processing and quick response times.

Technical Specifications

Microprocessors AM6411BKCGGAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

2359296

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6411BKCGGAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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