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AM6441BSDGGAALV

Texas Instruments

AM6441BSDGGAALV by Texas Instruments

AM6441BSDGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, suitable for low power applications in various industries such as automotive and industrial automation. The package style is grid array, fine pitch with 441 terminals and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,644 parts In-Stock

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8,644

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Digiode

USA . 3,905 parts In-Stock

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3,905

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Distributors (Availability)

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Native Components

USA . 150 parts In-Stock

1+ parts

$0.539

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150

$0.539

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Northwest PG Solutions

USA . 1,084 parts In-Stock

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$0.593

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1,084

$0.593

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Ampacity Inc.

Singapore . 1,319 parts In-Stock

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$3.000

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1,319

$3.000

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AZTECH Wire

Italy . 396 parts In-Stock

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$14.737

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396

$14.737

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Parana Technologies

USA . 133 parts In-Stock

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$16.415

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$16.710

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133

$16.415

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$16.710

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ChromeModa Solutions

Germany . 4,178 parts In-Stock

1+ parts

$18.444

100+ parts

$15.124

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4,178

$18.444

$15.124

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IDEA Electronic Components Group

UK . 1,346 parts In-Stock

1+ parts

$18.444

100+ parts

$17.522

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$16.600

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1,346

$18.444

$17.522

$16.600

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Semicontronic

India . 916 parts In-Stock

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$22.000

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$21.450

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$21.340

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916

$22.000

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$21.340

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One Stop Electronics

USA . 968 parts In-Stock

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$32.000

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968

$32.000

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Corphita

USA . 4,440 parts In-Stock

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4,440

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DigiPath Technology Company

USA . 1,216 parts In-Stock

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$16.629

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$16.629

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Corohmni

South Africa . 253 parts In-Stock

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Overview

Experience unmatched performance and reliability with the AM6441BSDGGAALV by Texas Instruments, a leading manufacturer in the industry. This high-quality microprocessor is designed to meet the demands of today's technology-driven world, offering integrated cache and a wide range of applications. With its advanced features and top-notch design, this product provides exceptional value and benefits to customers, ensuring seamless operation and optimal efficiency. Upgrade your systems with Texas Instrument's AM6441BSDGGAALV and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 0.79 V

Operating within this voltage range ensures optimal performance and prevents damage to the microprocessor.

On Chip Data RAM Width: 16

A wider RAM width enables faster data access and better multitasking capabilities.

Address Bus Width: 14

A larger address bus width allows for accessing a larger memory space, enhancing the microprocessor's functionality.

Package Shape: SQUARE

The square package shape provides efficient use of space and easier integration into circuit designs.

Bit Size: 64

A 64-bit architecture allows for processing larger chunks of data at a time, improving overall performance.

No. of Terminals: 441

Having a high number of terminals allows for more connections and functionality options for the microprocessor.

Package Style (Meter): GRID ARRAY, FINE PITCH

This package style is suitable for high-density circuit boards and enables efficient signal routing.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 105 °C

Being able to operate at high temperatures makes the microprocessor suitable for various environments and applications.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures ensures reliable performance in extreme conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and allows for easier connections in circuit designs.

Maximum Seated Height: 2.652 mm

The low seated height enables compact and slim device designs using the microprocessor.

RAM Words: 2359296

Having a large RAM capacity allows for storing and accessing a significant amount of data efficiently.

Width: 17.2 mm

A compact width makes the microprocessor suitable for small form factor devices and space-constrained applications.

Boundary Scan: YES

Boundary scan capability aids in debugging, testing, and diagnosing faults in the microprocessor during production or operation.

External Data Bus Width: 16

The external data bus width of 16 enhances data transfer speeds and system performance.

Maximum Clock Frequency: 25 MHz

This clock frequency allows for fast processing speeds, suitable for various computing tasks.

Length: 17.2 mm

A compact length makes the microprocessor versatile for integration into various device designs.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor provides efficient and streamlined processing capabilities for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the microprocessor.

Terminal Form: BALL

The ball terminal form enables secure and reliable connections for smooth operation of the microprocessor.

Nominal Supply Voltage: 0.75 V

Operating at the nominal supply voltage ensures stable performance and energy efficiency of the microprocessor.

No. of Serial I/Os: 7

Having multiple serial I/Os allows for connectivity with various external devices and peripherals.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density connections and compact circuit board designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations, making the microprocessor suitable for specific computation tasks.

Speed: 1000 rpm

The high speed capability allows for fast data processing and efficient performance of the microprocessor.

Low Power Mode: YES

The low power mode helps in reducing energy consumption and heat dissipation, extending the battery life of devices using the microprocessor.

Technical Specifications

Microprocessors AM6441BSDGGAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

2359296

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6441BSDGGAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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