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AM6412AKCGHAALV

Texas Instruments

AM6412AKCGHAALV by Texas Instruments

The Texas Instruments AM6412AKCGHAALV microprocessor features a 64-bit architecture, 16-bit data RAM width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a clock frequency of up to 25 MHz. With low power mode and boundary scan capabilities, this CMOS technology-based processor is suitable for high-performance computing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,391 parts In-Stock

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Digiode

USA . 2,019 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 517 parts In-Stock

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$12.564

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One Stop Electronics

USA . 187 parts In-Stock

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$13.000

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Parana Technologies

USA . 588 parts In-Stock

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$56.533

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DigiPath Technology Company

USA . 2,329 parts In-Stock

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$62.250

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$57.270

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$62.250

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ChromeModa Solutions

Germany . 3,061 parts In-Stock

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$63.520

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$52.086

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$63.520

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IDEA Electronic Components Group

UK . 1,169 parts In-Stock

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$63.520

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$60.344

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$57.168

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$63.520

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Corphita

USA . 4,263 parts In-Stock

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Northwest PG Solutions

USA . 2,013 parts In-Stock

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Native Components

USA . 803 parts In-Stock

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Overview

Experience unmatched performance and reliability with the AM6412AKCGHAALV microprocessor by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that surpasses expectations. Ideal for a wide range of applications, this microprocessor offers integrated cache, high-speed processing, and low power mode for optimal efficiency. Unlock endless possibilities and elevate your projects with the exceptional value and benefits that this top-tier product provides. Elevate your projects to new heights with the AM6412AKCGHAALV microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microprocessor, making it suitable for a variety of applications.

Integrated Cache: YES

Having integrated cache helps improve the overall performance of the microprocessor by reducing data access times and increasing processing speeds.

Maximum Supply Voltage: 0.79 V

The low maximum supply voltage of 0.79 V helps in reducing power consumption and heat generation, making the microprocessor energy efficient.

On Chip Data RAM Width: 16

The 16-bit width of on-chip data RAM allows for efficient data processing and storage within the microprocessor.

Package Shape: SQUARE

The square package shape provides a compact design for the microprocessor, allowing for easy integration into various electronic devices.

Bit Size: 64

With a 64-bit architecture, the microprocessor can handle larger amounts of data and perform complex calculations efficiently.

No. of Terminals: 441

The large number of terminals allows for connectivity to external components and peripherals, enabling versatility in system design.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in a wide range of temperature environments without compromising performance.

RAM Words: 1048576

The large number of RAM words provides ample memory capacity for storing and processing data efficiently within the microprocessor.

Technical Specifications

Microprocessors AM6412AKCGHAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

1048576

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6412AKCGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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