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AM6421BSDGGAALV

Texas Instruments

AM6421BSDGGAALV by Texas Instruments

AM6421BSDGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, making it suitable for high-speed applications in various industries. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,851 parts In-Stock

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1,851

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Vyrian

USA . 1,591 parts In-Stock

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1,591

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Distributors (Availability)

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Semicontronic

India . 1,074 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

1k+ parts

$6.790

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1,074

$7.000

$6.825

$6.790

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AZTECH Wire

Italy . 759 parts In-Stock

1+ parts

$8.634

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759

$8.634

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Ampacity Inc.

Singapore . 1,061 parts In-Stock

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$18.000

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$18.000

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One Stop Electronics

USA . 1,423 parts In-Stock

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$35.000

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1,423

$35.000

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Parana Technologies

USA . 90 parts In-Stock

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$50.163

100+ parts

$4,658.402

1k+ parts

$45.147

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90

$50.163

$4,658.402

$45.147

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DigiPath Technology Company

USA . 1,790 parts In-Stock

1+ parts

$55.236

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1,790

$55.236

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ChromeModa Solutions

Germany . 3,448 parts In-Stock

1+ parts

$56.363

100+ parts

$46.218

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3,448

$56.363

$46.218

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IDEA Electronic Components Group

UK . 2,330 parts In-Stock

1+ parts

$56.363

100+ parts

$53.545

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$50.727

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2,330

$56.363

$53.545

$50.727

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Corphita

USA . 1,603 parts In-Stock

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1,603

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Northwest PG Solutions

USA . 560 parts In-Stock

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$4.011

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560

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$4.011

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Native Components

USA . 318 parts In-Stock

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$3.970

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318

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$3.970

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Corohmni

South Africa . 165 parts In-Stock

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165

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Overview

Experience the power and efficiency of the AM6421BSDGGAALV microprocessor by Texas Instruments. With its cutting-edge technology and high-quality construction, this microprocessor offers unparalleled performance in a wide range of applications. Whether you're looking to enhance your computing capabilities or streamline your industrial processes, this product delivers exceptional value and reliability. Trust Texas Instruments to provide you with the tools you need to succeed in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 0.79 V

Operating within this voltage range ensures stable performance and prevents damage to the microprocessor.

On Chip Data RAM Width: 16

Having a wide data RAM width allows for faster data transfer and processing capabilities.

Address Bus Width: 14

A wide address bus width enables the microprocessor to access a larger memory space efficiently.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for devices with limited space.

Bit Size: 64

A 64-bit architecture offers high performance and computational capabilities for advanced applications.

No. of Terminals: 441

Having a high number of terminals allows for versatile connectivity and integration with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch design enhances the electrical performance and reliability of the microprocessor.

Minimum Supply Voltage: 0.715 V

Operating at a low supply voltage enables energy-efficient operation and reduces power consumption.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microprocessor can withstand heat and perform reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the microprocessor can operate effectively in extreme cold conditions.

Terminal Position: BOTTOM

Having terminals at the bottom facilitates easy installation and soldering onto circuit boards.

Maximum Seated Height: 2.652 mm

The low seated height enables the microprocessor to be used in slim devices without compromising performance.

RAM Words: 2359296

A large RAM capacity allows for efficient storage and retrieval of data during processing tasks.

Width: 17.2 mm

The compact width makes the microprocessor suitable for small form factor devices or applications with limited space.

Boundary Scan: YES

Boundary scan capability allows for easy testing and debugging of the microprocessor during production or maintenance.

External Data Bus Width: 16

A wide external data bus width enables high-speed data transfer between the microprocessor and external components.

Maximum Clock Frequency: 25 MHz

Operating at a high clock frequency allows for fast data processing and execution of instructions.

Length: 17.2 mm

The compact length of the microprocessor makes it suitable for integration into a variety of electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computer) microprocessor offers improved performance and efficiency in executing instructions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Having ball terminals simplifies the soldering process and improves the electrical connections of the microprocessor.

Nominal Supply Voltage: 0.75 V

Operating at a nominal supply voltage ensures stable performance and efficiency without compromising power consumption.

No. of Serial I/Os: 7

Having multiple serial I/Os allows for versatile communication and connectivity options with other devices or peripherals.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density mounting of the microprocessor on circuit boards, saving space and improving connectivity.

Format: FIXED POINT

Using a fixed-point format simplifies mathematical operations and improves the accuracy of calculations performed by the microprocessor.

Speed: 1000 rpm

With a high speed rating, the microprocessor can quickly execute instructions and process data, leading to efficient performance.

Low Power Mode: YES

The low power mode feature allows for energy-saving operation when high performance is not required, making the microprocessor more efficient.

Technical Specifications

Microprocessors AM6421BSDGGAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

2359296

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6421BSDGGAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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