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AM6442ASDGHAALV

Texas Instruments

AM6442ASDGHAALV by Texas Instruments

AM6442ASDGHAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, suitable for industrial applications requiring low power mode and boundary scan capabilities. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm and nominal voltage of 0.75 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,922 parts In-Stock

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Vyrian

USA . 4,452 parts In-Stock

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Native Components

USA . 78 parts In-Stock

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$1.904

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Northwest PG Solutions

USA . 1,495 parts In-Stock

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$2.094

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One Stop Electronics

USA . 1,261 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 485 parts In-Stock

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$9.310

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Parana Technologies

USA . 737 parts In-Stock

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$56.552

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$5,251.746

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$50.897

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737

$56.552

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$50.897

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DigiPath Technology Company

USA . 775 parts In-Stock

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$62.271

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775

$62.271

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ChromeModa Solutions

Germany . 4,083 parts In-Stock

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$63.542

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$52.104

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IDEA Electronic Components Group

UK . 765 parts In-Stock

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$63.542

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$60.365

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$57.188

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765

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Corphita

USA . 2,770 parts In-Stock

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Overview

Elevate your electronics projects with the AM6442ASDGHAALV microprocessor from Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge technology in the realm of microprocessors. This powerful chip is perfect for a wide range of applications, offering integrated cache, low power mode, and a maximum clock frequency of 25 MHz. With a wide data bus width and boundary scan capability, this versatile microprocessor provides exceptional value and performance for your projects. Embrace the future of technology with Texas Instruments and the AM6442ASDGHAALV microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

The integrated cache helps improve processing speed by storing frequently accessed data, resulting in faster overall performance.

Maximum Supply Voltage: 0.79 V

The low maximum supply voltage makes the product energy-efficient and helps in minimizing power consumption.

On Chip Data RAM Width: 16

Having a wide data RAM width of 16 bits allows the processor to handle larger chunks of data efficiently.

No. of Terminals: 441

The high number of terminals enables the processor to connect to various external devices, expanding its functionality and versatility.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the processor can function reliably even in harsh environments with extreme cold conditions.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz allows the processor to perform operations at a faster rate, enhancing overall system performance.

Technical Specifications

Microprocessors AM6442ASDGHAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

1048576

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6442ASDGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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