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AM6441BSEFGAALV

Texas Instruments

AM6441BSEFGAALV by Texas Instruments

AM6441BSEFGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, making it suitable for high-speed applications requiring low power consumption. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm and a nominal voltage of 0.75 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,744 parts In-Stock

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Digiode

USA . 1,710 parts In-Stock

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1,710

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Distributors (Availability)

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Native Components

USA . 310 parts In-Stock

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$0.807

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310

$0.807

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Northwest PG Solutions

USA . 1,981 parts In-Stock

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$0.888

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1,981

$0.888

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AZTECH Wire

Italy . 471 parts In-Stock

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$9.459

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471

$9.459

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Ampacity Inc.

Singapore . 1,159 parts In-Stock

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$11.000

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$11.000

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Semicontronic

India . 1,596 parts In-Stock

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$17.000

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$16.575

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$16.490

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1,596

$17.000

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$16.490

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Parana Technologies

USA . 1,239 parts In-Stock

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$28.123

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$43.949

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$28.123

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$43.949

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DigiPath Technology Company

USA . 48 parts In-Stock

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$30.967

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$28.490

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$28.490

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ChromeModa Solutions

Germany . 6,283 parts In-Stock

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$31.599

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$25.911

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IDEA Electronic Components Group

UK . 2,275 parts In-Stock

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$31.599

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$30.019

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$28.439

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2,275

$31.599

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$28.439

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One Stop Electronics

USA . 789 parts In-Stock

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$32.000

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Corphita

USA . 3,351 parts In-Stock

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Corohmni

South Africa . 141 parts In-Stock

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Overview

Experience the power and efficiency of the AM6441BSEFGAALV by Texas Instruments, a top-of-the-line microprocessor designed for cutting-edge applications. With Texas Instruments' reputation for quality and innovation, you can trust that this microprocessor delivers unbeatable performance and reliability. Whether you're working on a high-speed data processing project or developing advanced robotics, this product offers unmatched value and benefits. Upgrade your technology with the AM6441BSEFGAALV and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices or applications where weight is a concern.

Integrated Cache: YES

Integrated cache helps improve processing speed and efficiency by storing frequently used data closer to the processor, reducing the need to fetch data from external memory.

Maximum Supply Voltage: 0.79 V

Low maximum supply voltage helps in reducing power consumption and heat generation, making the microprocessor more energy-efficient.

On Chip Data RAM Width: 16

The wide on-chip data RAM width of 16 bits allows for faster data access and processing, improving overall performance.

Address Bus Width: 14

Wide address bus width of 14 bits enables the microprocessor to access a large memory space, enhancing its capabilities in handling complex tasks and large datasets.

Package Shape: SQUARE

Square package shape provides efficient use of space and allows for easy integration into circuit board layouts.

Bit Size: 64

64-bit architecture allows for handling larger amounts of data and performing calculations with higher precision, making the microprocessor suitable for demanding computational tasks.

No. of Terminals: 441

High number of terminals provide connectivity options for various external components and peripherals, making the microprocessor versatile in different types of system designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enhances connectivity and signal integrity, ensuring reliable performance in high-speed applications.

Minimum Supply Voltage: 0.715 V

Low minimum supply voltage helps in reducing power consumption and extending battery life in devices powered by the microprocessor.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh environments or under heavy computational loads.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions, making the microprocessor suitable for a diverse range of applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and mounting of the microprocessor onto circuit boards, simplifying the assembly process.

Maximum Seated Height: 2.652 mm

Low maximum seated height profile saves space in compact device designs and allows for efficient thermal management.

RAM Words: 2359296

Large number of RAM words provides ample memory capacity for storing and processing data, supporting multitasking and complex computing operations.

Width: 17.2 mm

Compact width dimension enables easy integration into slim and space-constrained electronic devices without compromising performance.

Boundary Scan: YES

Boundary scan feature helps in debugging and testing the microprocessor during manufacturing and maintenance, ensuring higher product quality and reliability.

External Data Bus Width: 16

Wide external data bus width of 16 bits allows for faster data transfer between the microprocessor and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25 MHz supports fast processing speed and real-time computing capabilities, making the microprocessor suitable for time-critical applications.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance ensures reliable soldering and assembly of the microprocessor onto circuit boards, enhancing product durability and longevity.

Length: 17.2 mm

Compact length dimension enables easy integration into electronic devices with limited space, allowing for versatile use in various product designs.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC (Reduced Instruction Set Computer) architecture offers efficient and optimized processing capabilities, enhancing the microprocessor's performance in handling complex tasks with streamlined instructions.

Technology: CMOS

CMOS (Complementary Metal-Oxide-Semiconductor) technology provides low power consumption, high noise immunity, and reliable performance, making the microprocessor energy-efficient and suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and mounting of the microprocessor, ensuring reliable electrical connections and efficient assembly process.

Nominal Supply Voltage: 0.75 V

Stable nominal supply voltage of 0.75 V ensures consistent and reliable performance of the microprocessor, enhancing overall system stability and operation.

No. of Serial I/Os: 7

Multiple serial I/Os provide flexible connectivity options for interfacing with external devices or communication protocols, enhancing the microprocessor's versatility in diverse applications.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8 mm allows for compact placement of terminals and efficient use of PCB space, enabling dense integration of the microprocessor in complex system designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency, making the microprocessor suitable for applications requiring precise and fast number calculations.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture during handling and storage, requiring standard precautions to prevent damage and ensure product reliability.

Speed: 1000 rpm

High rotational speed of 1000 rpm ensures responsive and agile performance, enhancing the microprocessor's ability to handle rapid data processing and real-time computing tasks.

Low Power Mode: YES

Low power mode feature allows the microprocessor to operate in energy-efficient modes when not handling intensive tasks, prolonging battery life and reducing overall power consumption.

Technical Specifications

Microprocessors AM6441BSEFGAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2359296

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6441BSEFGAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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