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AM6412BSCGGAALV

Texas Instruments

AM6412BSCGGAALV by Texas Instruments

AM6412BSCGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, making it suitable for high-speed computing applications. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm, ideal for compact designs requiring low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,197 parts In-Stock

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VNN

France . 4,117 parts In-Stock

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Digiode

USA . 2,803 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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One Stop Electronics

USA . 1,572 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 421 parts In-Stock

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$15.636

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Semicontronic

India . 485 parts In-Stock

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$24.000

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$23.400

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$23.280

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Ampacity Inc.

Singapore . 1,158 parts In-Stock

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Corohmni

South Africa . 226 parts In-Stock

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Parana Technologies

USA . 1,111 parts In-Stock

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DigiPath Technology Company

USA . 1,833 parts In-Stock

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$65.264

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$60.043

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ChromeModa Solutions

Germany . 3,659 parts In-Stock

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IDEA Electronic Components Group

UK . 2,318 parts In-Stock

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Continental Prestige Electronics

USA . 6,419 parts In-Stock

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Corphita

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Argo Parts USA

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Aranea Global

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Overview

Experience unparalleled performance and reliability with the AM6412BSCGGAALV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge microprocessors that are perfect for a wide range of applications. From industrial automation to consumer electronics, this product offers exceptional value, benefits, and advantages to customers looking for top-notch quality and seamless integration. Upgrade your systems today with the AM6412BSCGGAALV and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and improving overall design.

Maximum Supply Voltage: 0.79 V

The maximum supply voltage of 0.79 V ensures efficient power consumption and lower operating costs.

On Chip Data RAM Width: 16

With a wider on-chip data RAM width of 16, the microprocessor can handle larger amounts of data simultaneously, improving performance.

Address Bus Width: 14

The address bus width of 14 allows for efficient memory addressing, improving overall processing speed and accuracy.

Package Shape: SQUARE

The square package shape provides a compact design, saving space in the overall product design.

Bit Size: 64

Having a bit size of 64 allows for handling of larger data sets and complex calculations, making it suitable for high-performance computing tasks.

No. of Terminals: 441

Having a high number of terminals allows for a broader connectivity range, making it suitable for a variety of applications and interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers precise and efficient connection points, improving overall reliability and performance.

Minimum Supply Voltage: 0.715 V

The minimum supply voltage of 0.715 V allows for energy-efficient operation, reducing power consumption and heat generation.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microprocessor can withstand challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and efficient soldering onto circuit boards, improving the overall assembly process.

Maximum Seated Height: 2.652 mm

The maximum seated height of 2.652 mm allows for a low-profile design, suitable for compact devices and applications.

RAM Words: 2359296

Having a large number of RAM words enables the microprocessor to store and access a significant amount of data quickly, enhancing overall performance.

Width: 17.2 mm

A width of 17.2 mm provides a compact form factor for the microprocessor, making it suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor during production, ensuring high-quality performance.

External Data Bus Width: 16

With an external data bus width of 16, the microprocessor can efficiently communicate with external devices, improving overall system performance.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency of 25 MHz enables fast processing speed, making it suitable for tasks that require quick and efficient computation.

Length: 17.2 mm

The length of 17.2 mm complements the compact width, providing a small footprint for the microprocessor in the overall system design.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for efficient and streamlined processing of instructions, improving overall system performance and responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for long-term use.

Terminal Form: BALL

Terminal form of ball enables efficient soldering and connection, ensuring reliable electrical contact and performance.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V provides stable and consistent power delivery, essential for reliable operation and performance.

No. of Serial I/Os: 7

Having 7 serial I/Os allows for multiple communication channels, enabling the microprocessor to connect with various external devices and interfaces simultaneously.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm offers precise and efficient terminal spacing, ensuring reliable connectivity and signal transmission.

Format: FIXED POINT

Fixed-point format simplifies mathematical calculations and improves processing efficiency for certain applications, making it a suitable choice for specific tasks.

Speed: 1000 rpm

With a speed of 1000 rpm, the microprocessor can efficiently execute instructions and process data in a timely manner, enhancing overall system performance.

Low Power Mode: YES

The availability of a low power mode allows the microprocessor to operate efficiently at reduced power levels, extending battery life and reducing energy costs.

Technical Specifications

Microprocessors AM6412BSCGGAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

2359296

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6412BSCGGAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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