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AM6421BSEFGAALV

Texas Instruments

AM6421BSEFGAALV by Texas Instruments

AM6421BSEFGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, suitable for low power mode applications in various industries. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm and 441 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,001 parts In-Stock

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Vyrian

USA . 2,786 parts In-Stock

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2,786

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Distributors (Availability)

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Semicontronic

India . 979 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

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979

$2.000

$1.950

$1.940

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AZTECH Wire

Italy . 785 parts In-Stock

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$11.568

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785

$11.568

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Parana Technologies

USA . 487 parts In-Stock

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$14.398

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$1,337.029

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$12.958

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487

$14.398

$1,337.029

$12.958

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DigiPath Technology Company

USA . 1,420 parts In-Stock

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$15.853

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$14.585

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$15.853

$14.585

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ChromeModa Solutions

Germany . 2,813 parts In-Stock

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$16.177

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$13.265

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$16.177

$13.265

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IDEA Electronic Components Group

UK . 2,115 parts In-Stock

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$16.177

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$15.368

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$14.559

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2,115

$16.177

$15.368

$14.559

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Ampacity Inc.

Singapore . 1,020 parts In-Stock

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$19.000

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$19.000

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One Stop Electronics

USA . 914 parts In-Stock

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$29.000

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914

$29.000

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Corphita

USA . 4,147 parts In-Stock

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Native Components

USA . 930 parts In-Stock

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Corohmni

South Africa . 75 parts In-Stock

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Northwest PG Solutions

USA . 59 parts In-Stock

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Overview

Experience the power and efficiency of the AM6421BSEFGAALV by Texas Instruments, a top-tier microprocessor designed to elevate your projects to new heights. With innovative technology and cutting-edge features, this microprocessor offers seamless performance and reliability. Whether you're working on automotive applications, industrial automation, or consumer electronics, the AM6421BSEFGAALV delivers unmatched value and benefits to enhance your designs. Trust in Texas Instruments for quality manufacturing and unlock endless possibilities with the AM6421BSEFGAALV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache improves the performance and speed of the microprocessor by reducing data access times.

Maximum Supply Voltage: 0.79 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

On Chip Data RAM Width: 16

Having a wider RAM width allows for faster data processing and multitasking capabilities.

Address Bus Width: 14

A wider address bus width enables the microprocessor to access a larger memory space efficiently.

Package Shape: SQUARE

The square package shape helps in efficient placement and mounting of the microprocessor on PCBs, saving space.

No. of Terminals: 441

Having a high number of terminals provides flexibility in connectivity options and compatibility with various systems.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microprocessor can function reliably even under extreme conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor allows for faster execution of instructions and improved overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor efficient and reliable.

Technical Specifications

Microprocessors AM6421BSEFGAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

2359296

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6421BSEFGAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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