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MPC860TCZQ50D4

NXP Semiconductors

MPC860TCZQ50D4 by NXP Semiconductors

NXP Semiconductors' MPC860TCZQ50D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Ideal for applications requiring low power mode, such as embedded systems and networking devices.

Median Price

$233.380

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

MPC860TCZQ50D4 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,454 parts In-Stock

1+ parts

$207.450

100+ parts

$195.000

1k+ parts

$182.560

10k+ parts

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2,454

$207.450

$195.000

$182.560

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DigiKey

USA . 2,454 parts In-Stock

1+ parts

$259.310

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2,454

$259.310

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Flip Electronics (Authorized)

USA . 17 parts In-Stock

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17

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Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$112.516

100+ parts

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900

$112.516

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Digiode

USA . 2,997 parts In-Stock

1+ parts

$149.245

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2,997

$149.245

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DigiKey Marketplace

USA . 3,079 parts In-Stock

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3,079

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Anansix

USA . 2,104 parts In-Stock

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Vyrian

USA . 1,433 parts In-Stock

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Flip Electronics

USA . 17 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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Corohmni

South Africa . 492 parts In-Stock

1+ parts

$79.971

100+ parts

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492

$79.971

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$110.265

100+ parts

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$105.855

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50

$110.265

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$105.855

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Continental Prestige Electronics

USA . 1,737 parts In-Stock

1+ parts

$112.516

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$110.265

1,737

$112.516

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$110.265

Ampacity Inc.

Singapore . 1,488 parts In-Stock

1+ parts

$138.870

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1,488

$138.870

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Corphita

USA . 4,081 parts In-Stock

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$141.390

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$141.390

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Vigor

Singapore . 856 parts In-Stock

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$188.485

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856

$188.485

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QUARKTWIN TECHNOLOGY LTD

USA . 20,113 parts In-Stock

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UNI Independent Distributors

Spain . 6,954 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,096 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Microchip USA

USA . 5,749 parts In-Stock

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Argo Parts USA

USA . 3,476 parts In-Stock

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3,476

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Perfect Parts

USA . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the MPC860TCZQ50D4 by NXP Semiconductors. This cutting-edge microprocessor redefines performance and reliability, making it ideal for a wide range of applications. NXP Semiconductors, known for their top-notch quality and advanced technology, ensures that this product delivers unparalleled value to customers. From integrated cache to low power mode, this microprocessor offers unmatched benefits and advantages that will take your projects to the next level. Upgrade your systems with the MPC860TCZQ50D4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product sturdy and affordable.

Integrated Cache: YES

Having integrated cache improves the overall performance and speed of the microprocessor, making it a suitable choice for fast processing tasks.

Surface Mount: YES

Surface mount technology allows for easy installation and reduces the overall size of the product, making it space-efficient.

Maximum Supply Voltage: 3.465 V

Operates efficiently under a maximum supply voltage of 3.465V, ensuring stable and reliable performance.

Address Bus Width: 32

Having a 32-bit address bus width enables the microprocessor to access and process a larger amount of memory, making it suitable for handling complex tasks.

Package Shape: SQUARE

Square package shape allows for efficient placement on circuit boards, maximizing space utilization and improving overall aesthetics.

Bit Size: 32

32-bit architecture allows for fast and efficient processing of data, making the microprocessor ideal for performance-intensive applications.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures energy efficiency and helps in reducing power consumption, making it environmentally friendly.

No. of Terminals: 357

Having a higher number of terminals allows for more connectivity options, making the microprocessor versatile and compatible with a wide range of devices.

Package Style (Meter): GRID ARRAY

Grid array packaging offers a high level of reliability and robustness, ensuring the product's longevity and durability.

Minimum Supply Voltage: 3.135 V

Operating within a minimum supply voltage of 3.135V ensures the stability and performance of the microprocessor even under low power conditions.

Minimum Operating Temperature: -40 °C

Capable of operating efficiently at temperatures as low as -40°C, making it suitable for use in a variety of environments and conditions.

Terminal Finish: TIN LEAD SILVER

The use of tin lead silver terminal finish ensures good solderability and reliability, enhancing the overall quality of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on PCBs, making it convenient for assembly and maintenance.

Maximum Seated Height: 2.52 mm

With a maximum seated height of 2.52mm, the microprocessor can be accommodated in low-profile applications without compromising performance.

Width: 25 mm

Compact width of 25mm makes the microprocessor suitable for small form factor devices and applications where space is a constraint.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microprocessor, ensuring high reliability and easier troubleshooting.

External Data Bus Width: 32

Having a 32-bit external data bus width enables fast data transfer between the microprocessor and external devices, enhancing overall performance.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50MHz enables high-speed processing and efficient multitasking capabilities, making it suitable for performance-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring robustness during the manufacturing process and improving product reliability.

Peak Reflow Temperature °C: 245

Capable of withstanding peak reflow temperatures of 245°C, making it suitable for lead-free soldering processes.

Length: 25 mm

Compact length of 25mm makes the microprocessor suitable for space-constrained applications without compromising functionality.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers streamlined instruction sets and faster execution, making it ideal for performance-critical applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Having ball terminal form facilitates easy installation and soldering, ensuring a reliable electrical connection and simplifying assembly.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures stable and efficient performance, making it suitable for a wide range of applications.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the microprocessor offers good connectivity options and is compatible with standard PCB layouts, simplifying integration.

Format: FIXED POINT

Fixed-point format allows for efficient arithmetic operations and precise calculations, making the microprocessor suitable for numerical computing tasks.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to humidity during storage and assembly.

Speed: 50 rpm

Operating at a speed of 50 rotations per minute ensures efficient processing and responsiveness, making it suitable for high-speed applications.

Low Power Mode: YES

Having a low power mode option allows for energy-efficient operation and reduced power consumption, extending the product's battery life and reducing overall cost.

Technical Specifications

Microprocessors MPC860TCZQ50D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

50 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860TCZQ50D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-659-6207, 5962016596207

NIIN

016596207

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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