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MPC880VR66

NXP Semiconductors

MPC880VR66 by NXP Semiconductors

NXP Semiconductors' MPC880VR66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Suitable for RISC applications, it operates at a speed of 66 rpm with a max supply voltage of 1.9 V.

Median Price

$39.410

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MPC880VR66 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$39.410

1k+ parts

$35.260

10k+ parts

$33.180

4

-

$39.410

$35.260

$33.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$29.923

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42

$29.923

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Digiode

USA . 1,493 parts In-Stock

1+ parts

$41.696

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1,493

$41.696

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Vyrian

USA . 7,697 parts In-Stock

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7,697

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Anansix

USA . 2,269 parts In-Stock

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2,269

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Chip Stock

USA . 153 parts In-Stock

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153

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Flip Electronics

USA . 152 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 537 parts In-Stock

1+ parts

$6.473

100+ parts

-

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537

$6.473

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Continental Prestige Electronics

USA . 6,934 parts In-Stock

1+ parts

$29.923

100+ parts

-

1k+ parts

-

10k+ parts

$29.325

6,934

$29.923

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$29.325

Netroflash

USA . 100 parts In-Stock

1+ parts

$29.923

100+ parts

$29.325

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100

$29.923

$29.325

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One Stop Electronics

USA . 4 parts In-Stock

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$37.310

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4

$37.310

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Ampacity Inc.

Singapore . 4 parts In-Stock

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$37.310

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4

$37.310

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Semicontronic

India . 4 parts In-Stock

1+ parts

$37.310

100+ parts

$36.377

1k+ parts

$36.191

10k+ parts

-

4

$37.310

$36.377

$36.191

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Corphita

USA . 2,934 parts In-Stock

1+ parts

$39.501

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2,934

$39.501

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Microchip USA

USA . 156 parts In-Stock

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$40.812

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156

$40.812

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Vigor

Singapore . 134 parts In-Stock

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$42.132

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134

$42.132

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A-Z Elektronik GmbH

Germany . 5,361 parts In-Stock

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5,361

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UNI Independent Distributors

Spain . 4,546 parts In-Stock

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Argo Parts USA

USA . 1,452 parts In-Stock

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1,452

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Futuretech Components

Singapore . 891 parts In-Stock

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891

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Perfect Parts

USA . 262 parts In-Stock

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262

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ChipstoGo Electronic ltd

UK . 23 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 9 parts In-Stock

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Overview

Experience the power and efficiency of the MPC880VR66 microprocessor by NXP Semiconductors. With integrated cache and low power mode, this cutting-edge technology offers unparalleled performance for a variety of applications. Whether you're in the automotive industry, IoT sector, or consumer electronics market, this microprocessor delivers top-notch results. Trust in NXP Semiconductors' reputation for quality and innovation, and elevate your product offerings with the MPC880VR66. Unlock new possibilities and stay ahead of the competition with this high-speed, reliable solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can protect the microprocessor from damage, ensuring a longer lifespan for the product.

Integrated Cache: YES

Having integrated cache helps improve the overall performance of the microprocessor by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 1.9 V

A higher maximum supply voltage allows for more flexibility in power supply options and can potentially support higher performance capabilities.

Address Bus Width: 32

A wider address bus allows for a larger memory address space, enabling the microprocessor to handle more data efficiently.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity for the product.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture typically allows for faster and more efficient processing of instructions, making this microprocessor a good choice for performance-critical applications.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making it an energy-efficient and reliable choice for a microprocessor.

Technical Specifications

Microprocessors MPC880VR66 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC880VR66 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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