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MPC860TZQ80D4

NXP Semiconductors

MPC860TZQ80D4 by NXP Semiconductors

The NXP Semiconductors MPC860TZQ80D4 is a 32-bit microprocessor with integrated cache and 3.3V power supply, suitable for applications requiring low power mode and boundary scan capability. With a max clock frequency of 50MHz, it is ideal for use in embedded systems that demand high-speed processing within a compact form factor.

Median Price

$223.400

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

MPC860TZQ80D4 by NXP Semiconductors
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Rochester

USA . 136 parts In-Stock

1+ parts

$223.400

100+ parts

$210.000

1k+ parts

$196.590

10k+ parts

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136

$223.400

$210.000

$196.590

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DigiKey

USA . 136 parts In-Stock

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136

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Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$148.895

100+ parts

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27

$148.895

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Digiode

USA . 2,508 parts In-Stock

1+ parts

$187.568

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2,508

$187.568

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Anansix

USA . 2,279 parts In-Stock

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2,279

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PC Components Company LLC

USA . 572 parts In-Stock

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572

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Bristol Electronics

USA . 572 parts In-Stock

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572

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Vyrian

USA . 136 parts In-Stock

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136

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R&J Components

USA . 14 parts In-Stock

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14

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J & M Industries LLC

USA . 11 parts In-Stock

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Pride Electronics

USA . 5 parts In-Stock

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Semi Source

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 268 parts In-Stock

1+ parts

$11.796

100+ parts

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268

$11.796

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Vigor

Singapore . 212 parts In-Stock

1+ parts

$117.000

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212

$117.000

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Microchip USA

USA . 454 parts In-Stock

1+ parts

$118.300

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454

$118.300

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Continental Prestige Electronics

USA . 490 parts In-Stock

1+ parts

$148.895

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$145.917

490

$148.895

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$145.917

Netroflash

USA . 50 parts In-Stock

1+ parts

$148.895

100+ parts

-

1k+ parts

$141.451

10k+ parts

$138.473

50

$148.895

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$141.451

$138.473

Corphita

USA . 1,858 parts In-Stock

1+ parts

$177.696

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1,858

$177.696

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Component Stockers USA

USA . 133 parts In-Stock

1+ parts

$204.490

100+ parts

$192.220

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133

$204.490

$192.220

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One Stop Electronics

USA . 136 parts In-Stock

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$214.680

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136

$214.680

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Ampacity Inc.

Singapore . 136 parts In-Stock

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$214.680

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136

$214.680

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 5,648 parts In-Stock

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5,648

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UNI Independent Distributors

Spain . 5,392 parts In-Stock

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Argo Parts USA

USA . 3,531 parts In-Stock

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Perfect Parts

USA . 108 parts In-Stock

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ChipstoGo Electronic ltd

UK . 10 parts In-Stock

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10

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Speed Components Ltd (Excess)

Israel . 8 parts In-Stock

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Overview

Experience unmatched performance and reliability with the MPC860TZQ80D4 microprocessor by NXP Semiconductors. Known for their superior quality and cutting-edge technology, NXP Semiconductors delivers a top-of-the-line product that is perfect for a wide range of applications. From industrial automation to telecommunications, this microprocessor offers seamless integration, high-speed processing, and low power consumption. Upgrade your systems today with the MPC860TZQ80D4 and enjoy the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microprocessor, making it resistant to physical damage.

Integrated Cache: YES

Having an integrated cache improves processing speed and overall performance of the microprocessor by reducing memory access time.

Surface Mount: YES

Being surface mountable makes installation and integration of the microprocessor easier and more efficient.

Maximum Supply Voltage: 3.465 V

Operating within this voltage range ensures stable and reliable performance of the microprocessor.

Address Bus Width: 32

Having a wider address bus allows for larger memory address space, which is beneficial for handling complex computing tasks.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space when designing and incorporating the microprocessor into a system.

Bit Size: 32

A bit size of 32 indicates a high level of data processing capability, suitable for demanding applications and tasks.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power sources and reduces the risk of damage from voltage fluctuations.

No. of Terminals: 357

Having a large number of terminals allows for versatile connectivity options and functionality when integrating the microprocessor into a system.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and electrical connections, enhancing overall performance and reliability.

Minimum Supply Voltage: 3.135 V

The minimum supply voltage ensures that the microprocessor can operate within a safe range, preventing damage due to insufficient power.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures allows the microprocessor to be used in a variety of environments and conditions without compromising performance.

Terminal Finish: TIN LEAD SILVER

The terminal finish provides reliable electrical connections and corrosion resistance, ensuring long-term functionality of the microprocessor.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure installation of the microprocessor in a system, ensuring proper connectivity and stability.

Maximum Seated Height: 2.52 mm

The low seated height provides a compact and slim profile, making the microprocessor suitable for space-constrained applications.

Width: 25 mm

The compact width of the microprocessor allows for flexibility in design and integration into various systems and devices.

Boundary Scan: YES

Having boundary scan capability enables easier testing and debugging of the microprocessor during the development and production stages.

External Data Bus Width: 32

A wider external data bus allows for faster data transfer between the microprocessor and other components, improving overall system performance.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for swift and efficient execution of instructions, making the microprocessor suitable for high-speed computing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for a specified time ensures the reliability and durability of the microprocessor during the manufacturing process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance indicates the robustness of the microprocessor during assembly processes, ensuring proper soldering and connectivity.

Length: 25 mm

The compact length of the microprocessor allows for versatile placement and integration into various system designs.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor type enhances processing efficiency and speed, making it suitable for handling complex computing tasks with minimal instruction overhead.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microprocessor in different applications.

Terminal Form: BALL

The ball terminal form provides reliable and secure electrical connections, ensuring proper functionality and connectivity of the microprocessor.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and reduces the risk of damage from power fluctuations.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for efficient layout and design of the microprocessor in a system, maximizing connectivity and functionality.

Format: FIXED POINT

The fixed-point format provides precise and efficient numerical processing capabilities, making the microprocessor suitable for a wide range of mathematical computations.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during handling and storage.

Speed: 80 rpm

The high speed of 80 rpm allows for efficient data processing and computation, making the microprocessor suitable for demanding applications that require quick response times.

Low Power Mode: YES

The low power mode capability allows the microprocessor to operate with reduced power consumption, prolonging battery life and reducing overall energy usage.

Technical Specifications

Microprocessors MPC860TZQ80D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

80 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860TZQ80D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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