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APQ-8016E-1-760NSP-TR-01-0

Qualcomm

APQ-8016E-1-760NSP-TR-01-0 by Qualcomm

Qualcomm's APQ-8016E-1-760NSP-TR-01-0 microprocessor features 760 terminals, operates b/w -30 to 60 °C, and has a peak reflow temp of 255C. Ideal for applications requiring a CMOS RISC processor with a very thin profile and fine pitch grid array package style.

Median Price

$39.847

Lifecycle Status

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7

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1k+

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Verical

USA . 4,000 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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$24.886

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Vyrian

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Sensible Micro Corp

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Distributors (Availability)

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iBuyXS LLC

. 22,804 parts In-Stock

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$5.520

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$24.331

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Aranea Global

USA . 500 parts In-Stock

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$23.413

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Aztec Data Supply Inc.

USA . 3,660 parts In-Stock

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$27.490

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Corohmni

South Africa . 1,138 parts In-Stock

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Microchip USA

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Modulus Dynamics

Lithuania . 2,916 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 56,000 parts In-Stock

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GreenTree Electronics

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Formix International (Excess)

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Futuretech Components

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Kepictronics

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BidChips

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Argo Parts USA

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Overview

Elevate your electronic devices to a whole new level with the APQ-8016E-1-760NSP-TR-01-0 by Qualcomm. As a leading manufacturer in the industry, Qualcomm delivers top-notch quality microprocessors that are versatile and reliable. This powerful chip is perfect for a wide range of applications, from smartphones to IoT devices. With its advanced technology and innovative design, the APQ-8016E-1-760NSP-TR-01-0 offers unmatched performance and efficiency, providing you with the value and benefits you need to stay ahead in today's fast-paced world. Upgrade your devices today and experience the difference with Qualcomm.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and can withstand various environmental conditions, making this microprocessor a reliable choice.

Surface Mount: YES

Being surface mountable makes this microprocessor easy to integrate into circuit boards, saving space and allowing for more compact designs.

Maximum Supply Voltage: 1.12 V

With a high maximum supply voltage, this microprocessor can handle power fluctuations without compromising performance.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on a circuit board, optimizing space utilization.

No. of Terminals: 760

The high number of terminals enables this microprocessor to be used in complex systems, providing versatility and functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact design with precise alignment, ideal for applications where space is limited.

Minimum Supply Voltage: 0.84 V

The low minimum supply voltage ensures efficient power consumption, making this microprocessor energy-efficient.

Maximum Operating Temperature: 60 °C

With a high maximum operating temperature, this microprocessor can withstand heat without experiencing performance issues.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for stable performance even in cold environments, increasing the product's reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and ensures secure connections, making this microprocessor user-friendly.

Maximum Seated Height: 0.96 mm

The low maximum seated height allows for a slim and compact design, suitable for applications with space constraints.

Width: 12 mm

The compact width of this microprocessor facilitates easy integration into various devices, enabling versatile usage.

Peak Reflow Temperature °C: 255

The high peak reflow temperature ensures reliable soldering during manufacturing, guaranteeing a robust connection.

Length: 14 mm

The moderate length of this microprocessor provides a balance between space efficiency and ease of handling during installation.

Peripheral IC Type: MICROPROCESSOR, RISC

This microprocessor is designed as a RISC-based peripheral IC, offering high-speed processing and efficiency for optimal performance.

Technology: CMOS

The CMOS technology used in this microprocessor provides low power consumption and high noise immunity, enhancing overall efficiency.

Terminal Form: BALL

The ball terminal form offers a reliable connection and simplifies the soldering process, ensuring a secure and stable electrical connection.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, this microprocessor can withstand typical exposure to moisture during handling and storage.

Technical Specifications

Microprocessors APQ-8016E-1-760NSP-TR-01-0 attributes and parameters. Explore more Microprocessors devices from Qualcomm

Specs

JESD-30 Code:

R-PBGA-B760

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

255

Maximum Seated Height:

.96 mm

Maximum Supply Voltage:

1.12 V

Minimum Supply Voltage:

.84 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

APQ-8016E-1-760NSP-TR-01-0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Qualcomm

Qualcomm develops and licenses wireless technology and designs chips for smartphones. The company's key patents revolve around CDMA and OFDMA technologies, which are standards in wireless communications that are the backbone of all 3G and 4G networks. The firm is a leader in 5G network technology as well. Qualcomm's IP is licensed by virtually all wireless device makers. The firm is also the world's largest wireless chip vendor, supplying nearly every premier handset maker with leading-edge processors. Qualcomm also sells RF-front end modules into smartphones and chips into automotive and Internet of Things markets.

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