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MCF5373LCVM240

NXP Semiconductors

MCF5373LCVM240 by NXP Semiconductors

NXP Semiconductors' MCF5373LCVM240 microprocessor features 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact square package with 256 terminals.

Median Price

$29.080

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

MCF5373LCVM240 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 319 parts In-Stock

1+ parts

$29.080

100+ parts

$24.140

1k+ parts

$23.170

10k+ parts

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319

$29.080

$24.140

$23.170

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Farnell

UK . 10 parts In-Stock

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$6.580

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10

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$6.580

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Element14

Singapore . 10 parts In-Stock

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$39.350

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10

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$39.350

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$19.576

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300

$19.576

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Flip Electronics

USA . 7,678 parts In-Stock

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7,678

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Vyrian

USA . 4,842 parts In-Stock

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4,842

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Digiode

USA . 3,977 parts In-Stock

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Anansix

USA . 1,900 parts In-Stock

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1,900

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

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One Stop Electronics

USA . 10 parts In-Stock

1+ parts

$5.590

100+ parts

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10

$5.590

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$5.590

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10

$5.590

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Semicontronic

India . 4 parts In-Stock

1+ parts

$5.590

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$5.450

1k+ parts

$5.422

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4

$5.590

$5.450

$5.422

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AZTECH Wire

Italy . 480 parts In-Stock

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$18.415

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480

$18.415

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Corohmni

South Africa . 155 parts In-Stock

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$50.743

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155

$50.743

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Microchip USA

USA . 3,347 parts In-Stock

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$55.384

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$55.384

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Modulus Dynamics

Lithuania . 3,044 parts In-Stock

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$70.552

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$70.552

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$70.552

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3,044

$70.552

$70.552

$70.552

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Aztec Data Supply Inc.

USA . 3,727 parts In-Stock

1+ parts

$76.038

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3,727

$76.038

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Robosynatics

Brazil . 4,781 parts In-Stock

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$54.097

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$52.993

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$52.993

4,781

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$52.993

$52.993

Lucentia Tech

USA . 4,781 parts In-Stock

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$54.097

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$52.993

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$52.993

4,781

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$52.993

$52.993

Corphita

USA . 3,744 parts In-Stock

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Argo Parts USA

USA . 1,843 parts In-Stock

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Perfect Parts

USA . 988 parts In-Stock

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UNI Independent Distributors

Spain . 611 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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A-Z Elektronik GmbH

Germany . 107 parts In-Stock

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Continental Prestige Electronics

USA . 10 parts In-Stock

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$6.580

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10

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Overview

Unlock the power of cutting-edge technology with the MCF5373LCVM240 by NXP Semiconductors. Designed with precision and expertise, this microprocessor offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value and efficiency, making it the ideal choice for your next project. Experience innovation at its finest with the MCF5373LCVM240 and take your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency.

Surface Mount: YES

Enables easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.6 V

Allows for higher performance capabilities without exceeding the safe voltage threshold.

Address Bus Width: 24

Enables efficient communication with other devices and peripherals.

Package Shape: SQUARE

Optimizes space usage and facilitates heat dissipation.

Bit Size: 32

Supports processing of 32-bit instructions, enhancing overall performance.

No. of Terminals: 256

Provides ample connectivity options for interfacing with various components.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Enhances reliability and allows for a compact design.

Minimum Supply Voltage: 1.4 V

Ensures stable operation even at lower power levels.

Maximum Operating Temperature: 85 °C

Allows for operation in a wide range of environments.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and improves electrical conductivity.

Terminal Position: BOTTOM

Facilitates easy PCB mounting and soldering.

Maximum Seated Height: 1.6 mm

Ensures compatibility with slim devices and compact designs.

Width: 17 mm

Provides a balance between space-saving and component integration.

Boundary Scan: YES

Facilitates testing and troubleshooting during production and maintenance.

External Data Bus Width: 32

Supports high-speed data transfer between the microprocessor and external devices.

Maximum Clock Frequency: 80 MHz

Offers fast processing speeds for efficient multitasking.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Allows for secure and durable solder joints.

Length: 17 mm

Suits compact and space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature and humidity levels.

Peripheral IC Type: MICROPROCESSOR, RISC

Designed for efficient processing and operation of various peripheral devices.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity.

Terminal Form: BALL

Facilitates reliable and strong connections on the PCB.

Nominal Supply Voltage: 1.5 V

Provides a stable operating voltage for efficient performance.

Terminal Pitch: 1 mm

Allows for precise placement and soldering on the PCB.

Format: FIXED POINT

Optimizes arithmetic operations for speed and efficiency.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture during storage and handling.

Speed: 240 rpm

Delivers high processing speeds for demanding applications.

Low Power Mode: YES

Enables energy-efficient operation, reducing overall power consumption.

Technical Specifications

Microprocessors MCF5373LCVM240 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

240 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCF5373LCVM240 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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