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STM32MP131CAF3

STMicroelectronics

STM32MP131CAF3 by STMicroelectronics

STM32MP131CAF3 by STMicroelectronics is a 32-bit microprocessor with 48 MHz clock frequency, 172032 RAM words, and 56 DMA channels. It is used in applications requiring low power mode, such as IoT devices and embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,397 parts In-Stock

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10,397

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Digiode

USA . 144 parts In-Stock

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144

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Anansix

USA . 113 parts In-Stock

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113

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Distributors (Availability)

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AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$9.861

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654

$9.861

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Ampacity Inc.

Singapore . 223 parts In-Stock

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$14.000

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223

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Corphita

USA . 3,643 parts In-Stock

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Argo Parts USA

USA . 3,502 parts In-Stock

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Continental Prestige Electronics

USA . 2,354 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Elevate your projects with the STM32MP131CAF3 by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers top-quality microprocessors that are reliable, efficient, and versatile. Whether you're working on IoT devices, wearables, or industrial applications, this microprocessor offers seamless integration, high performance, and low power consumption. Experience the value of cutting-edge technology and unlock endless possibilities with the STM32MP131CAF3. Upgrade your designs today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and cost-effectiveness to the microprocessor.

Integrated Cache: YES

The integrated cache helps in speeding up data access, resulting in improved performance and efficiency.

Maximum Supply Voltage: 1.38 V

The higher maximum supply voltage allows for increased flexibility in power management and performance optimization.

Address Bus Width: 26

With a wider address bus width of 26, the microprocessor can access and process larger chunks of data more efficiently.

Bit Size: 32

The 32-bit architecture enables the microprocessor to handle larger and more complex data sets, enhancing overall performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stability and reliability even under extreme thermal conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor allows for efficient data processing and execution, leading to improved performance and power efficiency.

Technology: CMOS

The CMOS technology used in the microprocessor offers low power consumption and high noise immunity, making it an energy-efficient choice.

Speed: 650 rpm

With a clock frequency of 48 MHz, the microprocessor can handle tasks quickly and efficiently, suitable for high-speed computing applications.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low-load scenarios, extending battery life and overall efficiency.

Technical Specifications

Microprocessors STM32MP131CAF3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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