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MCIMX6Q4AVT10ADR

NXP Semiconductors

MCIMX6Q4AVT10ADR by NXP Semiconductors

MCIMX6Q4AVT10ADR by NXP is a 32-bit microprocessor with 64-bit external data bus width. It operates at speeds up to 1000 rpm, suitable for automotive applications. Featuring integrated cache and low power mode, it has a temperature range of -40 to 125 °C and boundary scan capability.

Median Price

$83.761

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Verical

USA . 10,000 parts In-Stock

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Nova Conductors

Japan . 38 parts In-Stock

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Vyrian

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Anansix

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Flip Electronics

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Digiode

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AZTECH Wire

Italy . 656 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,260 parts In-Stock

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Ampacity Inc.

Singapore . 813 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 525 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$85.780

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$83.974

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$83.974

Continental Prestige Electronics

USA . 919 parts In-Stock

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Component Stockers USA

USA . 42 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Microchip USA

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Corphita

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UNI Independent Distributors

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Argo Parts USA

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Overview

Experience unparalleled performance and reliability with the MCIMX6Q4AVT10ADR microprocessor by NXP Semiconductors. As a leader in the industry, NXP delivers cutting-edge technology that ensures superior quality and functionality. Ideal for automotive applications, this microprocessor offers a seamless integration and exceptional speed to meet your specific needs. Trust NXP Semiconductors to provide you with top-of-the-line solutions that guarantee efficiency and innovation in every project. Elevate your performance with the MCIMX6Q4AVT10ADR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making it suitable for various applications.

Integrated Cache: YES

Integrated cache improves performance by storing frequently accessed data closer to the processor, reducing latency.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.5 V

Operating within a maximum supply voltage of 1.5 V ensures energy efficiency and protects the processor from potential damage.

Address Bus Width: 16

A wider address bus width of 16 allows for efficient memory addressing, enhancing overall system performance.

Package Shape: SQUARE

The square package shape provides a compact design that is easy to integrate into various electronic devices.

Bit Size: 32

A 32-bit processor allows for faster data processing and performance compared to lower bit sizes.

No. of Terminals: 624

Having 624 terminals enables efficient connectivity and functionality within complex systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style allows for high-density mounting, enhancing signal integrity and reducing electromagnetic interference.

Minimum Supply Voltage: 1.35 V

Operating within a minimum supply voltage of 1.35 V ensures power efficiency and stability for the processor.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the processor can withstand high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures the processor's functionality in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity and reliability for long-term usage.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering on the circuit board, ensuring a stable connection.

Maximum Seated Height: 2.16 mm

A low maximum seated height of 2.16 mm saves space and allows for compact system designs.

Width: 21 mm

A width of 21 mm makes the processor compatible with standard mounting configurations and easy to integrate into electronic systems.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the processor during manufacturing and maintenance.

External Data Bus Width: 64

A wider external data bus width of 64 allows for faster data transfer rates and improved system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and reflow processes during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable and secure soldering of the processor on the circuit board.

Length: 21 mm

A length of 21 mm provides a compact form factor, ideal for space-constrained applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in harsh environmental conditions often found in automotive applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with RISC architecture, it offers high performance and efficiency for processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the processor energy-efficient and reliable.

Terminal Form: BALL

The terminal form of BALL allows for secure connections and easy mounting on the circuit board.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm enables high-density mounting and efficient assembly of the processor on the circuit board.

Format: FLOATING POINT

The floating-point format allows for precise calculations and handling of decimal numbers, essential for certain computational tasks.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the processor can withstand moderate exposure to moisture during storage and handling.

Speed: 1000 rpm

Operating at a speed of 1000 rpm ensures fast and efficient processing of data and tasks.

Low Power Mode: YES

The low power mode option allows for energy-saving operation when the processor is not running at full capacity, increasing efficiency and reducing power consumption.

Technical Specifications

Microprocessors MCIMX6Q4AVT10ADR attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6Q4AVT10ADR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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