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MPC860DEZQ50D4

NXP Semiconductors

MPC860DEZQ50D4 by NXP Semiconductors

The NXP Semiconductors MPC860DEZQ50D4 is a 32-bit microprocessor with integrated cache and 3.3V power supply. It features a max clock frequency of 50 MHz, suitable for low power mode applications in various industries like telecommunications and networking. With a package style of grid array and terminal pitch of 1.27mm, it offers high performance in a compact design.

Median Price

$191.490

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

MPC860DEZQ50D4 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 83 parts In-Stock

1+ parts

$191.490

100+ parts

$180.000

1k+ parts

$168.510

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83

$191.490

$180.000

$168.510

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Distributors (In-Stock)

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Digiode

USA . 1,604 parts In-Stock

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$115.159

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Vyrian

USA . 2,651 parts In-Stock

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ComSIT Distribution GmbH

Germany . 694 parts In-Stock

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Anansix

USA . 231 parts In-Stock

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Bristol Electronics

USA . 124 parts In-Stock

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A&K Electronics

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107

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ACDS - Activité Composants Distribution Service

France . 88 parts In-Stock

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Dan-Mar Components

USA . 88 parts In-Stock

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88

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Rotakorn

Sweden . 44 parts In-Stock

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Speed Components Ltd

Israel . 39 parts In-Stock

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PC Components Company LLC

USA . 13 parts In-Stock

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Flip Electronics

USA . 7 parts In-Stock

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Inventory MP

USA . 4 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 82 parts In-Stock

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$66.976

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82

$66.976

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Vigor

Singapore . 497 parts In-Stock

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$71.820

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497

$71.820

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Modulus Dynamics

Lithuania . 3,150 parts In-Stock

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$73.804

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$73.804

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$73.804

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3,150

$73.804

$73.804

$73.804

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Component Stockers USA

USA . 739 parts In-Stock

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$96.360

100+ parts

$122.710

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739

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$122.710

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One Stop Electronics

USA . 76 parts In-Stock

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$103.040

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76

$103.040

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Corphita

USA . 1,376 parts In-Stock

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$109.098

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Microchip USA

USA . 1,033 parts In-Stock

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$208.150

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Ampacity Inc.

Singapore . 76 parts In-Stock

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$224.260

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Argo Parts USA

USA . 2,861 parts In-Stock

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UNI Independent Distributors

Spain . 2,354 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,045 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Speed Components Ltd (Excess)

Israel . 274 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 83 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MPC860DEZQ50D4 by NXP Semiconductors. As a leader in the semiconductor industry, NXP delivers top-notch quality and reliability. This microprocessor is perfect for a wide range of applications, offering seamless performance and efficiency. With integrated cache, low power mode, and maximum clock frequency of 50 MHz, this product provides unparalleled value and benefits to customers looking for high-speed processing and optimal functionality. Upgrade your devices with the MPC860DEZQ50D4 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resilience to the package, ensuring the safety of the microprocessor during handling and operation.

Integrated Cache: YES

The integrated cache helps improve the performance of the microprocessor by reducing the time needed to access frequently used data, making it a faster and more efficient choice.

Maximum Supply Voltage: 3.465 V

The maximum supply voltage allows for reliable and stable operation of the microprocessor within a safe voltage range, ensuring optimal performance and longevity.

Address Bus Width: 32

With a wide address bus width of 32 bits, this microprocessor can handle large amounts of memory and data efficiently, making it suitable for demanding computing tasks.

Package Shape: SQUARE

The square package shape allows for easy and compact integration into circuit boards or systems, saving space and simplifying the design process.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with common voltage standards and power sources, making it versatile and easy to integrate into various systems.

No. of Terminals: 357

The high number of terminals allows for a greater connectivity and functionality of the microprocessor, enabling it to interface with a wide range of components and peripherals.

Maximum Seated Height: 2.52 mm

The low seated height enables the microprocessor to be easily mounted in compact spaces or devices, offering flexibility in design and integration.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it offers efficient and high-speed processing of instructions, making it ideal for performance-critical applications.

Technology: CMOS

The CMOS technology used in this microprocessor allows for low power consumption, high speed, and reliability, making it a cost-effective and efficient choice for various applications.

Technical Specifications

Microprocessors MPC860DEZQ50D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

50 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860DEZQ50D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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