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MPC8323ECVRADDCA

NXP Semiconductors

MPC8323ECVRADDCA by NXP Semiconductors

NXP Semiconductors' MPC8323ECVRADDCA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. This CMOS technology chip features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices.

Median Price

$51.148

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MPC8323ECVRADDCA by NXP Semiconductors
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Verical

USA . 10,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 200 parts In-Stock

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Vyrian

USA . 3,485 parts In-Stock

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Anansix

USA . 1,855 parts In-Stock

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Digiode

USA . 674 parts In-Stock

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Flip Electronics

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 226 parts In-Stock

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$17.509

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Semicontronic

India . 106 parts In-Stock

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$21.000

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$20.475

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$20.370

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Ampacity Inc.

Singapore . 200 parts In-Stock

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$22.000

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Aztec Data Supply Inc.

USA . 229 parts In-Stock

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$26.570

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One Stop Electronics

USA . 200 parts In-Stock

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$35.000

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Vigor

Singapore . 269 parts In-Stock

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$70.757

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Corohmni

South Africa . 32 parts In-Stock

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Microchip USA

USA . 10,788 parts In-Stock

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Continental Prestige Electronics

USA . 6,935 parts In-Stock

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UNI Independent Distributors

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Corphita

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Argo Parts USA

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Elevate your electronics with the MPC8323ECVRADDCA microprocessor from NXP Semiconductors. Crafted with precision and expertise, this cutting-edge technology offers seamless integration, high performance, and reliability for a variety of applications. Whether you're designing next-gen IoT devices or enhancing industrial automation systems, this microprocessor's advanced features and unparalleled value will take your projects to new heights. Unlock endless possibilities with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring reliable performance over time.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of the microprocessor, making it suitable for advanced computing tasks.

Maximum Supply Voltage: 1.05 V

Operating within this voltage range ensures stable and safe performance of the microprocessor, optimizing its lifespan.

Bit Size: 32

With a 32-bit architecture, this microprocessor can handle a wide range of computing tasks effectively and efficiently.

No. of Terminals: 516

Having a high number of terminals allows for seamless connectivity and integration with other components, enhancing overall system functionality.

Maximum Clock Frequency: 66.67 MHz

A high clock frequency enables fast data processing and execution, making this microprocessor suitable for high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making this microprocessor energy-efficient and durable.

Speed: 266 rpm

The high speed of 266 rpm allows for quick data processing, reducing latency and improving overall system performance.

Technical Specifications

Microprocessors MPC8323ECVRADDCA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Speed:

266 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8323ECVRADDCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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