Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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DM3730CUS100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 54 MHz, suitable for low power applications in various industries like automotive and industrial automation. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.
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Rochester
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Speed Components Ltd (Excess)
Plastic/Epoxy package body material provides durability and protection for the microprocessor, ensuring it can withstand various environmental conditions.
The integrated cache improves the performance of the microprocessor by allowing for faster access to frequently used data, enhancing overall speed and efficiency.
The low maximum supply voltage of 1.2 V helps in reducing power consumption and heat generation, making it an energy-efficient choice.
The on-chip data RAM width of 8 improves data processing capabilities and allows for efficient handling of large amounts of information.
A wider address bus width of 26 enables the microprocessor to access a larger memory space, enhancing its versatility and performance.
The square package shape offers a compact design, making it easier to integrate the microprocessor into various electronic devices without wasting space.
The 32-bit size enhances the processing capabilities of the microprocessor, allowing it to handle complex tasks and calculations efficiently.
The availability of multiple power supply options allows for flexibility in designing and optimizing power consumption based on specific requirements.
Having a higher number of terminals provides more connectivity options and functionality, making the microprocessor suitable for various applications.
The combination of grid array, low profile, and fine pitch package styles offers ease of assembly, space-saving benefits, and efficient thermal management.
The low minimum supply voltage of 1.08 V ensures stable operation even under low power conditions, enhancing reliability and performance.
With a maximum operating temperature of 90°C, the microprocessor can function effectively in various operating environments without overheating.
The minimum operating temperature of 0°C ensures that the microprocessor remains operational even in colder conditions, increasing its versatility.
The terminal finish with tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.
Having the terminals positioned at the bottom simplifies the installation process and enhances thermal dissipation, improving overall performance and longevity.
The low maximum seated height of 1.4 mm allows for a compact design and facilitates space-saving integration of the microprocessor into electronic devices.
With 16384 RAM words, the microprocessor can efficiently store and access a large amount of data, enhancing its processing capabilities and overall performance.
The width of 16 mm provides a balance between compactness and functionality, allowing for easy integration while supporting various features and connectivity options.
The boundary scan feature enables efficient testing and debugging of the microprocessor during manufacturing and maintenance, ensuring reliability and performance.
The external data bus width of 16 enhances data transfer speed and efficiency, enabling seamless communication with other components and peripherals.
The high maximum clock frequency of 54 MHz allows the microprocessor to execute tasks quickly and efficiently, improving overall performance and responsiveness.
The peak reflow temperature of 260°C ensures reliable soldering and assembly of the microprocessor, contributing to its durability and functionality.
The length of 16 mm complements the compact width and height of the microprocessor, facilitating integration into electronic devices without compromising performance.
Being a microprocessor with RISC architecture, it offers efficient processing power, reduced complexity, and enhanced performance for various computing tasks.
The CMOS technology used in the microprocessor ensures low power consumption, high speed, and reliable operation, making it an energy-efficient and versatile choice.
The ball terminal form allows for easy and reliable connections, facilitating soldering and assembly processes while ensuring stable performance and connectivity.
The low maximum supply current of 37 mA contributes to energy efficiency, reducing power consumption and heat generation for sustainable and reliable operation.
The nominal supply voltage of 1.14 V provides a stable operating environment for the microprocessor, ensuring consistent performance and reliability over time.
Having 128 DMA channels enables efficient data transfer and processing, improving overall system performance and responsiveness for a wide range of applications.
The small terminal pitch of 0.65 mm allows for high-density mounting and efficient connectivity, optimizing space usage and enhancing functionality in compact designs.
With a floating-point format, the microprocessor can handle complex mathematical calculations with increased precision and accuracy, making it suitable for demanding computational tasks.
With an MSL of 3, the microprocessor can withstand moderate exposure to moisture during manufacturing and operation, ensuring long-term reliability and functionality.
The speed of 1000 rpm allows the microprocessor to deliver fast and responsive performance, supporting seamless operation in various computing and processing tasks.
The low power mode feature optimizes energy efficiency by reducing power consumption when the microprocessor is idle or under low load, extending battery life and enhancing sustainability.
Microprocessors DM3730CUS100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of DMA Channels:
No. of Terminals:
On Chip Data RAM Width:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
RAM Words:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
DM3730CUS100 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Daco Semiconductor
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Surge Components
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
LM358N
Intersil
Onsemi
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
LM2931AZ-5.0RAG
LM2931AZ-5.0RAG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage, 0.1A max output current, and 0.6V max dropout voltage. Ideal for applications requiring stable voltage regulation in temperature-sensitive environments up to 150°C.
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
Silicon Standard
MBR0520LT1G
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Hitachi
MCF53281CVM240
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
MC7448THX1267ND
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
MIMXRT1062DVN6B
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MPC880VR66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MPC8308VMAGDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE; Data EEPROM Size: 0;
AV8063801149402SR0T6
Intel
Intel AV8063801149402SR0T6 is a 64-bit microprocessor with 1023 terminals in a grid array package. It features integrated cache, CMOS technology, and operates at 2800 rpm. Ideal for high-performance computing applications requiring fixed-point processing capabilities.
TN80C188XL12
Intel TN80C188XL12 is a 16-bit microprocessor with 20-bit address bus, operating at max 25 MHz. Suitable for industrial applications, it features low power mode and supports external data bus width of 8 bits. With a package style of chip carrier and quad terminal position, it offers high performance in embedded systems.
AM3352BZCZT60
AM3352BZCZT60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for automotive applications requiring low power mode and boundary scan capability. With a temperature range from -40 to 125 °C, it offers high performance in compact square package style.
N80C188-12
Advanced Micro Devices
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
MPC860TCZQ50D4
NXP Semiconductors' MPC860TCZQ50D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Ideal for applications requiring low power mode, such as embedded systems and networking devices.
MCIMX536AVV8C
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
CH80566EE014DT/SLGPP
Intel CH80566EE014DT/SLGPP is a 64-bit microprocessor with 28-bit address bus width and 64-bit external data bus width. It operates at speeds up to 1330 rpm, suitable for industrial applications requiring low power consumption. The processor features integrated cache, boundary scan, and CMOS technology for efficient performance in various electronic devices.
MIMXRT1064DVJ6B
NXP Semiconductors' MIMXRT1064DVJ6B microprocessor features 32-bit architecture, 1.3V max supply voltage, and 24MHz clock frequency. Ideal for low power applications, it offers integrated cache, 1048576 RAM words, and 32 DMA channels for efficient data processing in various electronic devices.
MIMXRT595SFFOCR
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
ATSAMA5D22C-CNR
ATSAMA5D22C-CNR by Microchip Technology is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, thin profile, fine pitch with terminal finish of tin silver copper nickel.
MPC8321VRADDC
The Freescale Semiconductor MPC8321VRADDC microprocessor features 32-bit architecture, integrated cache, and a max clock frequency of 66.67 MHz. It is suitable for applications requiring low power mode, such as embedded systems and networking devices.
STM32MP157DAA1
STMicroelectronics
STM32MP157DAA1 by STMicroelectronics is a 32-bit microprocessor with 64 MHz clock frequency, 448 terminals, and 724992 RAM words. Ideal for industrial applications, it features low power mode, boundary scan support, and 48 DMA channels for efficient data transfer.
AM6412BSCGGAALV
AM6412BSCGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, making it suitable for high-speed computing applications. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm, ideal for compact designs requiring low power consumption.
AM3517AZERC
AM3517AZERC by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and integrated cache. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
MCIMX6S8DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Address Bus Width: 16;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DM3730CBPD100
Texas Instruments DM3730CBPD100 microprocessor features 32-bit architecture, 1.2V supply voltage, and 54MHz clock frequency. Ideal for industrial applications requiring high-speed processing with low power consumption.
DM3730CBPA
DM3730CBPA by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 54 MHz. It is commonly used in industrial applications due to its low power mode, wide temperature range (-40 to 105 °C), and high number of DMA channels (128).
DM3730CUS100NEP
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE;
DM3725CUSD100
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE;
DM3730CBP100
DM3730CBP100 by Texas Instruments is a microprocessor with integrated cache and surface mount capability. It has an address bus width of 26, on-chip data RAM width of 8, and operates at a max clock frequency of 54 MHz. This processor is commonly used in applications requiring high-speed processing and low power consumption.
DM3730CUS
DM3730CUSD100
DM3725CBPDR100
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE;
DM3730CUSA
DM3730CBCD100
DM3730CBCA
DM3725CBPD100
DM3725CBCD100
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES;
DM3730CBP
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE;
DM3725CUS
DM3725CBC100
DM3725CBP
DM3725CUS100
DM3725CBP100
Supply Digital Components
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