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DM3730CUS100

Texas Instruments

DM3730CUS100 by Texas Instruments

DM3730CUS100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 54 MHz, suitable for low power applications in various industries like automotive and industrial automation. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.

Median Price

$41.636

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 940 parts In-Stock

1+ parts

$29.150

100+ parts

$28.570

1k+ parts

$27.980

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940

$29.150

$28.570

$27.980

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Texas Instruments

USA . 24,558 parts In-Stock

1+ parts

$36.402

100+ parts

$32.357

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$23.792

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24,558

$36.402

$32.357

$23.792

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DigiKey

USA . 103 parts In-Stock

1+ parts

$53.220

100+ parts

$38.985

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-

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103

$53.220

$38.985

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Mouser Electronics

USA . 35 parts In-Stock

1+ parts

$53.220

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$38.980

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35

$53.220

$38.980

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Avnet

USA . 27 parts In-Stock

1+ parts

-

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$41.636

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$37.391

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27

-

$41.636

$37.391

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,966 parts In-Stock

1+ parts

$27.692

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-

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2,966

$27.692

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Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$41.398

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24

$41.398

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Chip Stock

USA . 4,449 parts In-Stock

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4,449

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Vyrian

USA . 3,796 parts In-Stock

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3,796

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Martec Srl

Italy . 50 parts In-Stock

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50

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Bristol Electronics

USA . 50 parts In-Stock

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50

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J & M Industries LLC

USA . 44 parts In-Stock

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Sensible Micro Corp

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$10.953

100+ parts

$9.967

1k+ parts

$8.981

10k+ parts

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70

$10.953

$9.967

$8.981

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Semicontronic

India . 5,118 parts In-Stock

1+ parts

$24.780

100+ parts

$24.160

1k+ parts

$24.037

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5,118

$24.780

$24.160

$24.037

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Ampacity Inc.

Singapore . 4,731 parts In-Stock

1+ parts

$24.780

100+ parts

-

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4,731

$24.780

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Corphita

USA . 2,489 parts In-Stock

1+ parts

$26.235

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2,489

$26.235

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Parana Technologies

USA . 1,723 parts In-Stock

1+ parts

$28.808

100+ parts

-

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$52.111

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1,723

$28.808

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$52.111

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DigiPath Technology Company

USA . 1,103 parts In-Stock

1+ parts

$31.722

100+ parts

$29.184

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-

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1,103

$31.722

$29.184

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IDEA Electronic Components Group

UK . 1,057 parts In-Stock

1+ parts

$32.369

100+ parts

$30.751

1k+ parts

$29.132

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1,057

$32.369

$30.751

$29.132

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ChromeModa Solutions

Germany . 102 parts In-Stock

1+ parts

$32.369

100+ parts

$26.543

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102

$32.369

$26.543

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Continental Prestige Electronics

USA . 6,566 parts In-Stock

1+ parts

$41.398

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$40.570

6,566

$41.398

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-

$40.570

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$41.398

100+ parts

-

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$39.328

10k+ parts

$38.500

1,000

$41.398

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$39.328

$38.500

iBuyXS LLC

. 50 parts In-Stock

1+ parts

$45.000

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$45.000

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Corohmni

South Africa . 216 parts In-Stock

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$53.614

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$53.614

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Microchip USA

USA . 2,373 parts In-Stock

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$102.856

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2,373

$102.856

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Lixinc

USA . 9,042 parts In-Stock

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9,042

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Infinite Electronics LLP (Excess)

. 8,074 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,635 parts In-Stock

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4,635

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Argo Parts USA

USA . 4,374 parts In-Stock

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4,374

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Perfect Parts

USA . 2,085 parts In-Stock

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2,085

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Kepictronics

USA . 1,000 parts In-Stock

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S.R.D Solutions

India . 737 parts In-Stock

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737

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Authorized Procurement Solutions

USA . 50 parts In-Stock

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BidChips

USA . 50 parts In-Stock

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50

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Speed Components Ltd (Excess)

Israel . 50 parts In-Stock

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50

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Overview

Unlock the full potential of your projects with the DM3730CUS100 by Texas Instruments. As a leader in microprocessor technology, Texas Instruments ensures top-notch quality and reliability in every product they create. This powerful microprocessor, with integrated cache and low power mode, offers unmatched performance and efficiency for a wide range of applications. Experience seamless operation and superior speed with this cutting-edge technology, designed to elevate your projects to the next level. Choose Texas Instruments for unrivaled value and innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the microprocessor, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

The integrated cache improves the performance of the microprocessor by allowing for faster access to frequently used data, enhancing overall speed and efficiency.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage of 1.2 V helps in reducing power consumption and heat generation, making it an energy-efficient choice.

On Chip Data RAM Width: 8

The on-chip data RAM width of 8 improves data processing capabilities and allows for efficient handling of large amounts of information.

Address Bus Width: 26

A wider address bus width of 26 enables the microprocessor to access a larger memory space, enhancing its versatility and performance.

Package Shape: SQUARE

The square package shape offers a compact design, making it easier to integrate the microprocessor into various electronic devices without wasting space.

Bit Size: 32

The 32-bit size enhances the processing capabilities of the microprocessor, allowing it to handle complex tasks and calculations efficiently.

Power Supplies (V): 1.2, 1.8

The availability of multiple power supply options allows for flexibility in designing and optimizing power consumption based on specific requirements.

No. of Terminals: 423

Having a higher number of terminals provides more connectivity options and functionality, making the microprocessor suitable for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles offers ease of assembly, space-saving benefits, and efficient thermal management.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage of 1.08 V ensures stable operation even under low power conditions, enhancing reliability and performance.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, the microprocessor can function effectively in various operating environments without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the microprocessor remains operational even in colder conditions, increasing its versatility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish with tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom simplifies the installation process and enhances thermal dissipation, improving overall performance and longevity.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm allows for a compact design and facilitates space-saving integration of the microprocessor into electronic devices.

RAM Words: 16384

With 16384 RAM words, the microprocessor can efficiently store and access a large amount of data, enhancing its processing capabilities and overall performance.

Width: 16 mm

The width of 16 mm provides a balance between compactness and functionality, allowing for easy integration while supporting various features and connectivity options.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the microprocessor during manufacturing and maintenance, ensuring reliability and performance.

External Data Bus Width: 16

The external data bus width of 16 enhances data transfer speed and efficiency, enabling seamless communication with other components and peripherals.

Maximum Clock Frequency: 54 MHz

The high maximum clock frequency of 54 MHz allows the microprocessor to execute tasks quickly and efficiently, improving overall performance and responsiveness.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable soldering and assembly of the microprocessor, contributing to its durability and functionality.

Length: 16 mm

The length of 16 mm complements the compact width and height of the microprocessor, facilitating integration into electronic devices without compromising performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with RISC architecture, it offers efficient processing power, reduced complexity, and enhanced performance for various computing tasks.

Technology: CMOS

The CMOS technology used in the microprocessor ensures low power consumption, high speed, and reliable operation, making it an energy-efficient and versatile choice.

Terminal Form: BALL

The ball terminal form allows for easy and reliable connections, facilitating soldering and assembly processes while ensuring stable performance and connectivity.

Maximum Supply Current: 37 mA

The low maximum supply current of 37 mA contributes to energy efficiency, reducing power consumption and heat generation for sustainable and reliable operation.

Nominal Supply Voltage: 1.14 V

The nominal supply voltage of 1.14 V provides a stable operating environment for the microprocessor, ensuring consistent performance and reliability over time.

No. of DMA Channels: 128

Having 128 DMA channels enables efficient data transfer and processing, improving overall system performance and responsiveness for a wide range of applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and efficient connectivity, optimizing space usage and enhancing functionality in compact designs.

Format: FLOATING POINT

With a floating-point format, the microprocessor can handle complex mathematical calculations with increased precision and accuracy, making it suitable for demanding computational tasks.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the microprocessor can withstand moderate exposure to moisture during manufacturing and operation, ensuring long-term reliability and functionality.

Speed: 1000 rpm

The speed of 1000 rpm allows the microprocessor to deliver fast and responsive performance, supporting seamless operation in various computing and processing tasks.

Low Power Mode: YES

The low power mode feature optimizes energy efficiency by reducing power consumption when the microprocessor is idle or under low load, extending battery life and enhancing sustainability.

Technical Specifications

Microprocessors DM3730CUS100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

423

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM3730CUS100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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