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DM3725CUS100

Texas Instruments

DM3725CUS100 by Texas Instruments

The Texas Instruments DM3725CUS100 microprocessor features 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for applications requiring high-speed processing with a max clock frequency of 54 MHz. Package style is grid array with low profile and fine pitch terminals.

Median Price

$32.959

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,682 parts In-Stock

1+ parts

$32.959

100+ parts

$29.297

1k+ parts

$21.542

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1,682

$32.959

$29.297

$21.542

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 90 parts In-Stock

1+ parts

$29.674

100+ parts

$26.249

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90

$29.674

$26.249

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Digiode

USA . 2,330 parts In-Stock

1+ parts

$31.311

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2,330

$31.311

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Vyrian

USA . 5,711 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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90

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Dan-Mar Components

USA . 90 parts In-Stock

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90

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Prism Electronics

USA . 7 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 869 parts In-Stock

1+ parts

$0.221

100+ parts

-

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$0.212

869

$0.221

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$0.212

Northwest PG Solutions

USA . 1,638 parts In-Stock

1+ parts

$0.243

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-

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$0.214

1,638

$0.243

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$0.214

AZTECH Wire

Italy . 1,057 parts In-Stock

1+ parts

$13.080

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1,057

$13.080

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Parana Technologies

USA . 94 parts In-Stock

1+ parts

$21.824

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$22.304

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94

$21.824

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$22.304

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DigiPath Technology Company

USA . 477 parts In-Stock

1+ parts

$24.031

100+ parts

$22.108

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477

$24.031

$22.108

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ChromeModa Solutions

Germany . 6,757 parts In-Stock

1+ parts

$24.521

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$20.107

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6,757

$24.521

$20.107

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IDEA Electronic Components Group

UK . 198 parts In-Stock

1+ parts

$24.521

100+ parts

$23.295

1k+ parts

$22.069

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198

$24.521

$23.295

$22.069

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Corphita

USA . 1,243 parts In-Stock

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$29.663

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1,243

$29.663

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Microchip USA

USA . 1,072 parts In-Stock

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$73.957

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Lixinc

USA . 3,955 parts In-Stock

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3,955

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Component Stockers USA

USA . 1,217 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 260 parts In-Stock

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260

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Cyclops Electronics Ltd (Excess)

UK . 26 parts In-Stock

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Overview

Experience superior performance and reliability with the DM3725CUS100 microprocessor by Texas Instruments. Known for their exceptional quality and innovation, Texas Instruments delivers cutting-edge technology in the field of microprocessors. Ideal for a wide range of applications, this microprocessor offers unmatched value and benefits to customers looking for high-speed processing capabilities. Whether you're working on embedded systems, robotics, or IoT devices, the DM3725CUS100 is sure to meet your needs with its advanced features and impressive functionality. Choose Texas Instruments for top-of-the-line microprocessors that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the microprocessor, making it suitable for various environments.

Integrated Cache: YES

Having integrated cache helps in improving the performance and efficiency of the microprocessor by reducing access time to frequently used data.

Maximum Supply Voltage: 1.2 V

Operating at a maximum supply voltage of 1.2V ensures energy efficiency and helps in reducing power consumption.

Address Bus Width: 26

A wider address bus width of 26 bits allows the microprocessor to access a larger memory space, enhancing its capabilities.

Package Shape: SQUARE

The square package shape helps in efficient placement on circuit boards and allows for better utilization of space in electronic devices.

Bit Size: 32

With a bit size of 32, the microprocessor can handle and process data in larger chunks, improving overall performance.

Power Supplies (V): 1.2, 1.8

Supporting multiple power supply voltages allows for flexibility in different operating conditions and power requirements.

No. of Terminals: 423

Having a high number of terminals enables connectivity to various external components, expanding the microprocessor's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch ensures easy installation and integration into complex electronic systems.

Minimum Supply Voltage: 1.08 V

Operating at a minimum supply voltage of 1.08V helps in reducing power consumption and ensures stable performance under low power conditions.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the microprocessor can withstand cold temperatures without affecting its functionality.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides corrosion resistance and ensures good electrical conductivity for optimal performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure soldering onto circuit boards, enhancing the reliability of connections.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm allows for slim and compact designs in electronic devices, saving space and enabling sleek form factors.

RAM Words: 16384

With a high number of RAM words, the microprocessor can efficiently store and access data, enabling smooth multitasking and fast data processing.

Width: 16 mm

Having a compact width of 16mm makes the microprocessor suitable for space-constrained applications and allows for versatile integration in various devices.

Boundary Scan: YES

Boundary scan capability helps in testing and debugging the microprocessor during manufacturing and maintenance, ensuring high quality and reliability.

External Data Bus Width: 16

An external data bus width of 16 bits enables efficient data transfer between the microprocessor and external peripherals, enhancing overall performance.

Maximum Clock Frequency: 54 MHz

Operating at a maximum clock frequency of 54MHz allows the microprocessor to process instructions quickly and handle demanding tasks with ease.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microprocessor can withstand high-temperature soldering processes without damage.

Length: 16 mm

The compact length of 16mm complements the slim width of the microprocessor, enabling space-efficient designs and versatile placement in electronic systems.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor with peripheral IC type ensures efficient processing of instructions and data, leading to high performance and low power consumption.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and reduced noise for the microprocessor, making it energy-efficient and reliable.

Terminal Form: BALL

Having a terminal form of ball enhances the reliability of connections and simplifies the soldering process, ensuring secure and efficient integration.

Maximum Supply Current: 1400 mA

Operating at a maximum supply current of 1400mA allows the microprocessor to deliver high performance while maintaining energy efficiency and stability.

Nominal Supply Voltage: 1.14 V

The nominal supply voltage of 1.14V provides a stable operating voltage for the microprocessor, ensuring consistent performance and reliability.

No. of DMA Channels: 128

Having a high number of DMA channels enables efficient data transfer and processing, enhancing performance and multitasking capabilities of the microprocessor.

Terminal Pitch: 0.65 mm

A fine terminal pitch of 0.65mm allows for precise and secure connections, enabling reliable signal transmission and efficient operation of the microprocessor.

Format: FLOATING POINT

The floating-point format allows for accurate and efficient processing of decimal numbers and complex mathematical operations, enhancing the microprocessor's computational capabilities.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to moisture during handling and assembly processes, ensuring reliability in humid environments.

Speed: 1000 rpm

Operating at a speed of 1000rpm allows the microprocessor to handle tasks quickly and efficiently, leading to high performance and responsiveness in various applications.

Low Power Mode: YES

Having a low power mode enhances energy efficiency and prolongs battery life in mobile devices, making the microprocessor an ideal choice for power-sensitive applications.

Technical Specifications

Microprocessors DM3725CUS100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

423

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

1400 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM3725CUS100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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