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DM3725CUS

Texas Instruments

DM3725CUS by Texas Instruments

The Texas Instruments DM3725CUS microprocessor features a 32-bit architecture with integrated cache and 26-bit address bus width. With a max clock frequency of 54 MHz, it is suitable for applications requiring high-speed processing such as embedded systems and industrial automation. The package style includes a low-profile grid array with 423 terminals, making it ideal for compact designs that demand efficient power management.

Median Price

$27.467

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,820 parts In-Stock

1+ parts

$27.467

100+ parts

$24.415

1k+ parts

$17.952

10k+ parts

-

6,820

$27.467

$24.415

$17.952

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,592 parts In-Stock

1+ parts

$26.094

100+ parts

-

1k+ parts

-

10k+ parts

-

3,592

$26.094

-

-

-

Vyrian

USA . 6,188 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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6,188

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 165 parts In-Stock

1+ parts

$0.323

100+ parts

-

1k+ parts

-

10k+ parts

$0.310

165

$0.323

-

-

$0.310

Northwest PG Solutions

USA . 2,092 parts In-Stock

1+ parts

$0.355

100+ parts

-

1k+ parts

-

10k+ parts

$0.313

2,092

$0.355

-

-

$0.313

AZTECH Wire

Italy . 577 parts In-Stock

1+ parts

$13.080

100+ parts

-

1k+ parts

-

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577

$13.080

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-

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Corphita

USA . 1,438 parts In-Stock

1+ parts

$24.720

100+ parts

-

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-

10k+ parts

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1,438

$24.720

-

-

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Microchip USA

USA . 1,700 parts In-Stock

1+ parts

$64.606

100+ parts

-

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1,700

$64.606

-

-

-

Parana Technologies

USA . 450 parts In-Stock

1+ parts

$71.270

100+ parts

-

1k+ parts

-

10k+ parts

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450

$71.270

-

-

-

ChromeModa Solutions

Germany . 1,961 parts In-Stock

1+ parts

$80.079

100+ parts

$65.665

1k+ parts

-

10k+ parts

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1,961

$80.079

$65.665

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-

IDEA Electronic Components Group

UK . 401 parts In-Stock

1+ parts

$80.079

100+ parts

$76.075

1k+ parts

$72.071

10k+ parts

-

401

$80.079

$76.075

$72.071

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A-Z Elektronik GmbH

Germany . 5,349 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,349

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Alle Elektronik GmbH

Germany . 3,566 parts In-Stock

1+ parts

-

100+ parts

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3,566

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DigiPath Technology Company

USA . 275 parts In-Stock

1+ parts

-

100+ parts

$72.199

1k+ parts

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275

-

$72.199

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Kepictronics

USA . 33 parts In-Stock

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33

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Overview

Experience unparalleled performance and reliability with the Texas Instruments DM3725CUS microprocessor. As a trusted industry leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality and cutting-edge technology in all its products. Ideal for a wide range of applications, this microprocessor boasts integrated cache, low power mode, and a high clock frequency of 54 MHz. With features like these, customers can expect seamless operation, improved efficiency, and enhanced overall performance. Trust Texas Instruments to deliver superior solutions for your microprocessing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microprocessor, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Having integrated cache improves the overall performance of the microprocessor by reducing memory access times.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.2 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 26

Having a wider address bus allows for larger memory addressing capability, enabling handling of more data.

Package Shape: SQUARE

The square package shape facilitates easier handling and installation within devices or systems.

Bit Size: 32

Being a 32-bit microprocessor enables it to handle larger chunks of data at once, improving overall processing speed.

Power Supplies (V): 1.2,1.8

Support for multiple power supply voltages offers flexibility in designing systems and optimizing power consumption.

No. of Terminals: 423

Having a high number of terminals allows for more connections and functionalities to be integrated, enhancing the microprocessor's capabilities.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The choice of terminal finish materials ensures good conductivity, reliability, and resistance to corrosion.

Maximum Clock Frequency: 54 MHz

Supporting a high clock frequency enables faster data processing and overall system performance.

Technical Specifications

Microprocessors DM3725CUS attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

423

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

1400 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM3725CUS Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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