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STM32MP135AAF3

STMicroelectronics

STM32MP135AAF3 by STMicroelectronics

STM32MP135AAF3 by STMicroelectronics is a 32-bit microprocessor with 8-bit RAM width, 26-bit address bus, and 16-bit external data bus. It operates at a max clock frequency of 48 MHz and has low power mode. Ideal for applications requiring high-speed processing in compact devices.

Median Price

$7.665

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 150 parts In-Stock

1+ parts

$3.744

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$3.744

-

-

-

Chip1Stop

Japan . 150 parts In-Stock

1+ parts

$5.610

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$5.610

-

-

-

Mouser Electronics

USA . 142 parts In-Stock

1+ parts

$7.410

100+ parts

$5.330

1k+ parts

$5.150

10k+ parts

-

142

$7.410

$5.330

$5.150

-

Farnell

UK . 306 parts In-Stock

1+ parts

$7.920

100+ parts

$5.240

1k+ parts

$4.160

10k+ parts

-

306

$7.920

$5.240

$4.160

-

Newark

USA . 349 parts In-Stock

1+ parts

$8.270

100+ parts

$5.960

1k+ parts

$5.530

10k+ parts

-

349

$8.270

$5.960

$5.530

-

DigiKey

USA . 100 parts In-Stock

1+ parts

$8.960

100+ parts

$5.907

1k+ parts

$5.363

10k+ parts

-

100

$8.960

$5.907

$5.363

-

Element14

Singapore . 306 parts In-Stock

1+ parts

$13.130

100+ parts

$9.380

1k+ parts

$7.300

10k+ parts

-

306

$13.130

$9.380

$7.300

-

Avnet

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

RS (Exports)

UK . 156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.833

10k+ parts

-

156

-

-

$4.833

-

Verical

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,814 parts In-Stock

1+ parts

$3.419

100+ parts

-

1k+ parts

-

10k+ parts

-

2,814

$3.419

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.098

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$7.098

-

-

-

Vyrian

USA . 8,882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,882

-

-

-

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Anansix

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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1,040

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 250 parts In-Stock

1+ parts

$2.920

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$2.920

-

-

-

Semicontronic

India . 95 parts In-Stock

1+ parts

$2.920

100+ parts

$2.847

1k+ parts

$2.832

10k+ parts

-

95

$2.920

$2.847

$2.832

-

Corphita

USA . 1,677 parts In-Stock

1+ parts

$3.239

100+ parts

-

1k+ parts

-

10k+ parts

-

1,677

$3.239

-

-

-

Continental Prestige Electronics

USA . 306 parts In-Stock

1+ parts

$6.030

100+ parts

$4.560

1k+ parts

-

10k+ parts

-

306

$6.030

$4.560

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.098

100+ parts

-

1k+ parts

$6.743

10k+ parts

$6.601

50

$7.098

-

$6.743

$6.601

Argo Parts USA

USA . 3,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,177

-

-

-

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GreenTree Electronics

Israel . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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800

-

-

-

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Glotronic Ltd.

UK . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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80

-

-

-

-

Overview

Unleash the power of innovation with the STM32MP135AAF3 by STMicroelectronics. This cutting-edge microprocessor, known for its superior quality and reliability, is tailored to meet the demands of various applications. With integrated cache, low power mode, and a maximum clock frequency of 48 MHz, this product offers unmatched performance and efficiency. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, the STM32MP135AAF3 provides the value, benefits, and advantages that customers are looking for in a microprocessor. Elevate your projects to the next level with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for portable devices.

Integrated Cache: YES

This feature enhances the processing speed and efficiency of the microprocessor, making it a reliable choice for high-performance applications.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into compact electronic devices, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.38 V

The high maximum supply voltage tolerance ensures stable performance and reliable operation of the microprocessor in various voltage conditions.

On Chip Data RAM Width: 8

With a wide data RAM width, this microprocessor can handle large amounts of data simultaneously, enabling faster processing speeds for complex applications.

Address Bus Width: 26

The wide address bus width allows for efficient data transfer and access to memory locations, enhancing the overall performance of the microprocessor.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it ideal for devices with limited space availability.

Bit Size: 32

The 32-bit architecture offers enhanced processing capabilities and compatibility with modern software applications, making it a versatile choice for various computing tasks.

No. of Terminals: 320

The numerous terminals provide ample connection points for external devices and peripherals, increasing the versatility and expandability of the microprocessor.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style allows for efficient heat dissipation and optimal signal integrity, ensuring reliable performance in demanding environments.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage requirement minimizes power consumption and heat generation, making this microprocessor energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable performance in harsh conditions or high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability enables the microprocessor to function in cold environments or during temperature fluctuations, enhancing its versatility and durability.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation and connection process, making it convenient for assembly and maintenance tasks.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for slim and compact device designs, ideal for space-constrained applications.

RAM Words: 172032

With a large number of RAM words, this microprocessor can handle extensive data storage and processing requirements, making it suitable for memory-intensive tasks.

Width: 11 mm

The compact width dimension enables the microprocessor to fit into narrow spaces or tight layouts, facilitating design flexibility and compatibility with small form-factor devices.

Boundary Scan: YES

The presence of boundary scan capability allows for easy testing and debugging of the microprocessor, ensuring high reliability and quality control during production.

External Data Bus Width: 16

The wide external data bus width facilitates high-speed data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency provides fast processing speeds and responsiveness, making this microprocessor suitable for high-performance computing tasks.

Length: 11 mm

The compact length dimension contributes to the overall small footprint of the microprocessor, ideal for compact electronic devices and PCB layouts.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor delivers efficient and streamlined processing operations, optimizing performance and power efficiency for various applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable contact points, ensuring stable operation and durability in demanding operational conditions.

Maximum Supply Current: 239 mA

The moderate maximum supply current requirement ensures efficient power usage and prevents overloading of power sources, enhancing the reliability and longevity of the microprocessor.

Nominal Supply Voltage: 1.25 V

The stable nominal supply voltage ensures consistent and reliable performance of the microprocessor, making it suitable for continuous operation in various conditions.

No. of DMA Channels: 56

The abundance of DMA channels enables efficient data transfer and management processes, optimizing system resource allocation and improving overall performance.

No. of Serial I/Os: 10

The multiple serial I/Os provide connectivity options for external devices and peripherals, enhancing the versatility and compatibility of the microprocessor with various interfaces.

Terminal Pitch: 0.5 mm

The narrow terminal pitch allows for a high-density layout of connection points, enabling compact design integration and facilitating streamlined assembly processes.

Format: FIXED POINT

The fixed-point format offers precise and efficient numerical processing capabilities, suitable for applications that require accurate calculations and data manipulation.

Speed: 650 rpm

The high speed rating ensures fast data processing and responsiveness, making this microprocessor well-suited for time-sensitive applications and real-time computing tasks.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation and reduced power consumption, extending battery life and enhancing the sustainability of devices powered by this microprocessor.

Technical Specifications

Microprocessors STM32MP135AAF3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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