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AT91SAM9G45-CU-999

Microchip Technology

AT91SAM9G45-CU-999 by Microchip Technology

Microchip AT91SAM9G45-CU-999 is a 32-bit microprocessor with 8-bit RAM, 26-bit address bus, and 32-bit external data bus. It operates at up to 50 MHz clock frequency and features integrated cache for enhanced performance. Ideal for low power applications due to its min supply voltage of 0.9 V and max seated height of 1.2 mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,744 parts In-Stock

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VNN

France . 3,791 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 550 parts In-Stock

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ComSIT Distribution GmbH

Germany . 484 parts In-Stock

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AZTECH Wire

Italy . 614 parts In-Stock

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Ampacity Inc.

Singapore . 1,396 parts In-Stock

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LMD Electronica

Estonia . 7,765 parts In-Stock

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Ledger Components

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NIA Electronics

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Argo Parts USA

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Montano Global Distributors

Canada . 3,484 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

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LOOK Integrated Logistics

Peru . 1,350 parts In-Stock

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Assy Fe

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Microchip USA

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Bastille Electronics

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Overview

Unlock the power of cutting-edge technology with the AT91SAM9G45-CU-999 by industry leader Microchip Technology. Designed with quality and precision, this microprocessor offers unmatched performance and reliability for a wide range of applications. From consumer electronics to industrial automation, this product delivers exceptional value, efficiency, and versatility to meet your unique needs. Experience the difference with Microchip Technology's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material enhances durability and reliability of the microprocessor.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency.

Maximum Supply Voltage: 1.1 V

Higher supply voltage allows for better performance capabilities.

On Chip Data RAM Width: 8

Wider data RAM width improves data processing capabilities.

Address Bus Width: 26

Wide address bus enables efficient data handling.

Package Shape: SQUARE

Square shape allows for compact and space-saving design.

Bit Size: 32

32-bit architecture provides compatibility with modern software and applications.

No. of Terminals: 324

Higher number of terminals allow for more connections and functionalities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch enhances overall performance and reliability.

Minimum Supply Voltage: 0.9 V

Lower supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

Higher operating temperature range ensures stable performance in various environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in extreme conditions.

Terminal Position: BOTTOM

Bottom terminal position enables easier and more secure connections.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact and slim device design.

RAM Words: 65536

Large RAM capacity enables efficient data storage and processing.

Width: 15 mm

Compact width makes it suitable for various device designs.

Boundary Scan: YES

Boundary scan capability enhances debugging and testing processes.

External Data Bus Width: 32

Wide external data bus enables fast data transfer and processing.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for quick data processing and response times.

Length: 15 mm

Compact length makes it suitable for space-constrained devices.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enables efficient and fast processing of instructions.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Terminal Form: BALL

Ball terminal form provides secure connections and better conductivity.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance.

No. of DMA Channels: 37

Higher number of DMA channels allow for efficient data transfer and processing.

No. of Serial I/Os: 7

Multiple serial I/Os enable connectivity with various external devices.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for more terminals in a limited space.

Format: FIXED POINT

Fixed point format simplifies mathematical operations and calculations.

Speed: 400 rpm

High speed operation ensures quick response and data processing.

Low Power Mode: YES

Low power mode helps in conserving energy and prolonging battery life.

Technical Specifications

Microprocessors AT91SAM9G45-CU-999 attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

No. of DMA Channels:

37

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

65536

Maximum Seated Height:

1.2 mm

Speed:

400 rpm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AT91SAM9G45-CU-999 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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