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AM3894CCYGA120

Texas Instruments

AM3894CCYGA120 by Texas Instruments

AM3894CCYGA120 by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 27 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.

Median Price

$97.313

Lifecycle Status

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7

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1k+

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Texas Instruments

USA . 1,790 parts In-Stock

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$75.196

100+ parts

$72.934

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$56.538

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$75.196

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$56.538

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Mouser Electronics

USA . 23 parts In-Stock

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$119.430

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$92.410

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23

$119.430

$92.410

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Distributors (In-Stock)

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Digiode

USA . 1,892 parts In-Stock

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$71.436

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Nova Conductors

Japan . 42 parts In-Stock

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$90.235

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Vyrian

USA . 684 parts In-Stock

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VNN

France . 58 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Corohmni

South Africa . 604 parts In-Stock

1+ parts

$26.051

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-

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604

$26.051

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Advanced Electronics

New Zealand . 25 parts In-Stock

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$40.491

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$38.467

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$38.467

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25

$40.491

$38.467

$38.467

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Parana Technologies

USA . 459 parts In-Stock

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$56.408

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DigiPath Technology Company

USA . 1,482 parts In-Stock

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$62.112

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ChromeModa Solutions

Germany . 6,617 parts In-Stock

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$63.380

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$51.972

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6,617

$63.380

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IDEA Electronic Components Group

UK . 85 parts In-Stock

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$63.380

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$60.211

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$57.042

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85

$63.380

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$57.042

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Semicontronic

India . 879 parts In-Stock

1+ parts

$63.920

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$62.322

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$62.002

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$63.920

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$62.002

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Ampacity Inc.

Singapore . 748 parts In-Stock

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$63.920

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Corphita

USA . 1,645 parts In-Stock

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$67.676

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Modulus Dynamics

Lithuania . 2,853 parts In-Stock

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$76.327

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$76.327

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$76.327

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Continental Prestige Electronics

USA . 4,417 parts In-Stock

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$82.715

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$81.061

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$81.061

Netroflash

USA . 50 parts In-Stock

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$90.235

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$88.430

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$90.235

$88.430

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Microchip USA

USA . 1,943 parts In-Stock

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$148.150

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$145.580

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$144.290

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$143.000

1,943

$148.150

$145.580

$144.290

$143.000

A-Z Elektronik GmbH

Germany . 5,984 parts In-Stock

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iodParts Technologies Inc.

India . 5,539 parts In-Stock

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Lixinc

USA . 5,214 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,989 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 216 parts In-Stock

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Overview

Discover the AM3894CCYGA120 by Texas Instruments, a high-quality microprocessor that offers unmatched performance and reliability. As a leader in the industry, Texas Instruments ensures that every product is manufactured to the highest standards, providing you with peace of mind and confidence in your purchase. Designed for a wide range of applications, this microprocessor is perfect for industries such as automotive, aerospace, and telecommunications. Experience the value, benefits, and advantages this product brings, from its integrated cache and low power mode to its advanced technology and wide address bus width. Trust Texas Instruments to deliver excellence, and unlock endless possibilities with the AM3894CCYGA120.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microprocessor's plastic/epoxy package body material ensures excellent durability and protection, making it a reliable choice for various applications.

Integrated Cache: YES

With an integrated cache, this microprocessor offers increased performance and faster access to frequently used data, making it an ideal choice for demanding computational tasks.

Surface Mount: YES

The surface mount feature of this microprocessor allows for easy installation and integration onto circuit boards, making it a convenient choice for compact and space-constrained applications.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V, this microprocessor offers energy efficiency and low power consumption, making it a suitable choice for battery-powered devices and applications.

On Chip Data RAM Width: 8

The on-chip data RAM width of this microprocessor, being 8 bits, enables high-speed data processing and efficient handling of large amounts of data, making it an excellent choice for data-intensive applications.

Address Bus Width: 28

With a wide address bus width of 28 bits, this microprocessor can handle larger memory spaces and perform extensive memory operations, making it suitable for memory-intensive tasks and applications.

Package Shape: SQUARE

The square package shape of this microprocessor allows for efficient utilization of space and straightforward integration into circuit board layouts, making it a versatile choice for various form factors.

Bit Size: 32

This microprocessor's 32-bit architecture enables it to process larger data chunks and perform more complex calculations, making it a powerful choice for demanding computational tasks.

No. of Terminals: 1031

With a high number of terminals, this microprocessor provides extensive connectivity options and supports a wide range of peripheral devices, making it a versatile choice for diverse application requirements.

Package Style (Meter): GRID ARRAY, FINE PITCH

Featuring a grid array, fine pitch package style, this microprocessor offers enhanced electrical performance, increased signal integrity, and ease of assembly, making it a reliable choice for high-performance applications.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95V, this microprocessor ensures power efficiency and extended battery life, making it an optimal choice for mobile devices and low-power applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this microprocessor can withstand harsh environmental conditions and deliver reliable performance in demanding applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this microprocessor remains operational in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, making this microprocessor a reliable choice for long-lasting and high-quality connections.

Terminal Position: BOTTOM

With terminals positioned at the bottom, this microprocessor facilitates easy and reliable connections during installation and ensures compatibility with various types of sockets, making it a convenient choice for system integration.

Maximum Seated Height: 3.31 mm

With a maximum seated height of 3.31mm, this microprocessor allows for efficient space utilization in compact designs and ensures compatibility with height-constrained applications.

RAM Words: 65536

Offering 65,536 RAM words, this microprocessor provides ample memory storage capacity for data-intensive tasks, making it an ideal choice for applications requiring extensive data manipulation and storage.

Width: 25 mm

With a compact width of 25mm, this microprocessor allows for efficient space management and easy integration into various system designs, making it suitable for applications where size is a critical factor.

Boundary Scan: YES

Featuring boundary scan capability, this microprocessor enables efficient debugging, testing, and troubleshooting during manufacturing and maintenance processes, making it a reliable choice for streamlined production and maintenance workflows.

External Data Bus Width: 16

With an external data bus width of 16 bits, this microprocessor facilitates efficient data transfer between the microprocessor and external devices, making it an optimal choice for applications requiring high-speed data communication.

Maximum Clock Frequency: 27 MHz

Operating at a maximum clock frequency of 27 MHz, this microprocessor provides high-speed processing capabilities, enabling swift execution of instructions and efficient task completion, making it well-suited for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this microprocessor ensures reliable solder connections during the manufacturing process, making it a dependable choice for robust and high-quality electronic assemblies.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, this microprocessor withstands high-temperature soldering processes, ensuring secure and reliable connections during manufacturing, making it a suitable choice for demanding manufacturing environments.

Length: 25 mm

The compact length of 25mm makes this microprocessor suitable for space-constrained designs while providing ample performance capabilities, making it an ideal choice for applications where size and performance are critical factors.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this microprocessor can withstand harsh operating conditions, making it a reliable choice for demanding industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

As a microprocessor with a Reduced Instruction Set Computing (RISC) architecture, this product provides simplified and efficient instruction execution, making it an excellent choice for applications requiring fast and streamlined processing.

Technology: CMOS

Utilizing Complementary Metal-Oxide-Semiconductor (CMOS) technology, this microprocessor achieves low power consumption, high speed, and excellent reliability, making it an optimal choice for energy-efficient and high-performance applications.

Terminal Form: BALL

With a ball terminal form, this microprocessor ensures reliable and secure connections during installation, making it a suitable choice for applications with demanding shock and vibration requirements.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1V, this microprocessor provides a balance between power efficiency and performance, making it a versatile choice for various applications that require optimized power consumption.

No. of DMA Channels: 72

Featuring 72 Direct Memory Access (DMA) channels, this microprocessor enables efficient direct data transfer between peripherals and memory, reducing CPU overhead and enhancing overall system performance, making it a powerful choice for data-intensive applications.

Terminal Pitch: 0.65 mm

With a narrow terminal pitch of 0.65mm, this microprocessor allows for efficient utilization of space on the circuit board, making it suitable for applications with high component density and miniaturization requirements.

Format: FLOATING POINT

Supporting floating-point format, this microprocessor enables precise and efficient handling of decimal numbers and complex mathematical operations, making it an ideal choice for advanced computational tasks.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this microprocessor provides enhanced protection against moisture-related issues during storage and handling, ensuring long-term reliability and quality in various environments.

Speed: 1200 rpm

Operating at a high speed of 1200 revolutions per minute (rpm), this microprocessor delivers fast and efficient performance, making it an excellent choice for applications that require rapid data processing.

Low Power Mode: YES

Featuring a low power mode, this microprocessor offers power-saving capabilities, enabling energy-efficient operation and extended battery life in portable devices, making it an optimal choice for battery-powered applications.

Technical Specifications

Microprocessors AM3894CCYGA120 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

3.31 mm

Speed:

1200 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

AM3894CCYGA120 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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