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AM3872BCYE80

Texas Instruments

AM3872BCYE80 by Texas Instruments

The Texas Instruments AM3872BCYE80 microprocessor features 32-bit architecture, 16-bit address and data bus width, with a max clock frequency of 30 MHz. It is designed for low power applications with integrated cache memory and boundary scan capability. Ideal for use in compact devices requiring high processing speeds and efficient power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,750 parts In-Stock

1+ parts

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100+ parts

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2,750

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Digiode

USA . 1,296 parts In-Stock

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1,296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 887 parts In-Stock

1+ parts

$0.338

100+ parts

-

1k+ parts

-

10k+ parts

$0.324

887

$0.338

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-

$0.324

Northwest PG Solutions

USA . 1,593 parts In-Stock

1+ parts

$0.372

100+ parts

-

1k+ parts

-

10k+ parts

$0.328

1,593

$0.372

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-

$0.328

AZTECH Wire

Italy . 640 parts In-Stock

1+ parts

$17.132

100+ parts

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640

$17.132

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One Stop Electronics

USA . 952 parts In-Stock

1+ parts

$24.000

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952

$24.000

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Parana Technologies

USA . 2,027 parts In-Stock

1+ parts

$73.181

100+ parts

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2,027

$73.181

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DigiPath Technology Company

USA . 1,635 parts In-Stock

1+ parts

$80.581

100+ parts

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1,635

$80.581

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IDEA Electronic Components Group

UK . 2,231 parts In-Stock

1+ parts

$82.226

100+ parts

$78.115

1k+ parts

$74.003

10k+ parts

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2,231

$82.226

$78.115

$74.003

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ChromeModa Solutions

Germany . 971 parts In-Stock

1+ parts

$82.226

100+ parts

$67.425

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971

$82.226

$67.425

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Corphita

USA . 1,296 parts In-Stock

1+ parts

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1,296

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Overview

Elevate your electronic devices with the AM3872BCYE80 by Texas Instruments, a top-tier microprocessor that promises unmatched quality and performance. Manufactured by the renowned Texas Instruments, this microprocessor offers integrated cache, low power mode, and a maximum clock frequency of 30 MHz. Perfect for a wide range of applications, this microprocessor is designed to exceed expectations and deliver exceptional value to customers. Upgrade your technology today with the AM3872BCYE80 and experience the benefits of cutting-edge innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Integrated Cache: YES

Having integrated cache improves the processor's performance by reducing latency in accessing data.

Maximum Supply Voltage: 1.42 V

This high maximum supply voltage allows for stable operation under varying load conditions.

Address Bus Width: 16

A wider address bus allows for larger memory addressing capability, enhancing the processor's overall performance.

Package Shape: SQUARE

The square package shape helps in efficient and compact PCB layout, saving valuable space in electronic devices.

Bit Size: 32

32-bit processing capability enables the processor to handle complex tasks and data with ease.

Power Supplies (V): 0.95/1.35

The availability of multiple power supply options allows for flexibility in design and power efficiency.

No. of Terminals: 684

Having a high number of terminals enables the processor to interface with multiple components, increasing its versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

This package style offers high-density interconnects and improved signal integrity, enhancing overall performance.

Minimum Supply Voltage: 1.28 V

The low minimum supply voltage helps in reducing power consumption and improving efficiency.

Terminal Position: BOTTOM

Bottom terminal position allows for easier and more convenient PCB mounting and assembly.

Maximum Seated Height: 3.06 mm

The low maximum seated height enables the processor to be used in slim and compact electronic devices.

Width: 23 mm

Compact width helps in accommodating the processor in small form factor devices without compromising on performance.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the processor, improving overall reliability and ease of maintenance.

External Data Bus Width: 16

16-bit external data bus width allows for efficient data transfer between the processor and external memory or peripherals.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency enables the processor to handle tasks at a faster rate, improving overall performance.

Length: 23 mm

The compact length of the processor makes it suitable for space-constrained electronic devices.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, this product is designed to handle a wide range of computing tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic devices.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and ease of soldering during assembly.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage ensures stable operation and optimal performance of the processor.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and compact PCB design.

Format: FLOATING POINT

Having floating-point format supports accurate and efficient mathematical calculations, essential for many computing tasks.

Speed: 800 rpm

The high speed rating indicates the processor's capability to handle complex tasks quickly and efficiently.

Low Power Mode: YES

The availability of low power mode helps in reducing power consumption during idle or low load situations, enhancing energy efficiency.

Technical Specifications

Microprocessors AM3872BCYE80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

684

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

Maximum Seated Height:

3.06 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM3872BCYE80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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