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AM3874BCYE100

Texas Instruments

AM3874BCYE100 by Texas Instruments

AM3874BCYE100 by Texas Instruments is a 32-bit microprocessor with 28-bit address bus width, 16-bit external data bus width, and integrated cache. It is used in applications requiring low power mode, operating at a max clock frequency of 30 MHz. The package style is grid array with fine pitch terminals, suitable for high-speed computing tasks.

Median Price

$59.610

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$59.610

1k+ parts

$53.340

10k+ parts

$50.200

4

-

$59.610

$53.340

$50.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 274 parts In-Stock

1+ parts

$62.928

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$62.928

-

-

-

Vyrian

USA . 1,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,931

-

-

-

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LIBRA Elektronik GmbH

Germany . 40 parts In-Stock

1+ parts

-

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-

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40

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,175 parts In-Stock

1+ parts

$12.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,175

$12.850

-

-

-

Parana Technologies

USA . 1,867 parts In-Stock

1+ parts

$23.970

100+ parts

-

1k+ parts

$24.624

10k+ parts

-

1,867

$23.970

-

$24.624

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ChromeModa Solutions

Germany . 4,607 parts In-Stock

1+ parts

$26.933

100+ parts

$22.085

1k+ parts

-

10k+ parts

-

4,607

$26.933

$22.085

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IDEA Electronic Components Group

UK . 1,232 parts In-Stock

1+ parts

$26.933

100+ parts

$25.586

1k+ parts

$24.240

10k+ parts

-

1,232

$26.933

$25.586

$24.240

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Corphita

USA . 4,969 parts In-Stock

1+ parts

$59.616

100+ parts

-

1k+ parts

-

10k+ parts

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4,969

$59.616

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-

-

Native Components

USA . 371 parts In-Stock

1+ parts

$226.266

100+ parts

$221.741

1k+ parts

$219.478

10k+ parts

$217.215

371

$226.266

$221.741

$219.478

$217.215

Northwest PG Solutions

USA . 644 parts In-Stock

1+ parts

$248.893

100+ parts

-

1k+ parts

-

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644

$248.893

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-

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Microchip USA

USA . 1,351 parts In-Stock

1+ parts

-

100+ parts

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1,351

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-

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DigiPath Technology Company

USA . 396 parts In-Stock

1+ parts

-

100+ parts

$24.283

1k+ parts

-

10k+ parts

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396

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$24.283

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Overview

Unleash the power of innovation with the AM3874BCYE100 by Texas Instruments, a top-of-the-line microprocessor designed to exceed expectations. Known for its superior quality and cutting-edge technology, Texas Instruments delivers unmatched performance in a wide range of applications. From automotive to industrial automation, this microprocessor offers unparalleled value, benefits, and advantages to customers looking for reliability and efficiency. Upgrade your systems with the AM3874BCYE100 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by reducing the average time to access memory.

Surface Mount: YES

Surface mount technology simplifies the assembly process and allows for more compact and efficient designs.

Bit Size: 32

A 32-bit architecture allows for faster processing and improved overall performance compared to lower bit sizes.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this microprocessor can withstand extended use without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an energy-efficient choice for electronic devices.

Maximum Clock Frequency: 30 MHz

A high maximum clock frequency allows for faster data processing and improved performance for demanding applications.

Low Power Mode: YES

The ability to operate in a low power mode helps conserve energy and extend the battery life of devices powered by this microprocessor.

Technical Specifications

Microprocessors AM3874BCYE100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM3874BCYE100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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