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MCF5474VR266

NXP Semiconductors

MCF5474VR266 by NXP Semiconductors

NXP Semiconductors' MCF5474VR266 microprocessor features 32-bit address bus width, 8-word on-chip data RAM, and integrated cache. Ideal for commercial applications requiring a max clock frequency of 66.67 MHz and low power mode support.

Median Price

$100.680

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

MCF5474VR266 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 800 parts In-Stock

1+ parts

$100.680

100+ parts

$78.830

1k+ parts

-

10k+ parts

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800

$100.680

$78.830

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Verical

USA . 800 parts In-Stock

1+ parts

$100.680

100+ parts

$78.830

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-

10k+ parts

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800

$100.680

$78.830

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DigiKey

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$102.640

1k+ parts

-

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80

-

$102.640

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,420 parts In-Stock

1+ parts

$58.460

100+ parts

-

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1,420

$58.460

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$70.280

100+ parts

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750

$70.280

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Vyrian

USA . 5,139 parts In-Stock

1+ parts

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5,139

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Anansix

USA . 766 parts In-Stock

1+ parts

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766

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Mil-Aero Solutions, Inc.

USA . 400 parts In-Stock

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400

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Chip Stock

USA . 175 parts In-Stock

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175

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TME

Poland . 150 parts In-Stock

1+ parts

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100+ parts

$70.570

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150

-

$70.570

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Flip Electronics

USA . 30 parts In-Stock

1+ parts

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30

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Bristol Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$11.995

100+ parts

-

1k+ parts

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612

$11.995

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Modulus Dynamics

Lithuania . 2,746 parts In-Stock

1+ parts

$30.231

100+ parts

$30.231

1k+ parts

$30.231

10k+ parts

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2,746

$30.231

$30.231

$30.231

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Aztec Data Supply Inc.

USA . 318 parts In-Stock

1+ parts

$38.302

100+ parts

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318

$38.302

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Corohmni

South Africa . 94 parts In-Stock

1+ parts

$50.747

100+ parts

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94

$50.747

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Ampacity Inc.

Singapore . 67 parts In-Stock

1+ parts

$52.310

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67

$52.310

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Corphita

USA . 1,001 parts In-Stock

1+ parts

$55.383

100+ parts

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1,001

$55.383

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Continental Prestige Electronics

USA . 6,536 parts In-Stock

1+ parts

$70.280

100+ parts

-

1k+ parts

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10k+ parts

$68.874

6,536

$70.280

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-

$68.874

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$71.686

100+ parts

$71.686

1k+ parts

$71.686

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1,000

$71.686

$71.686

$71.686

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Component Stockers USA

USA . 524 parts In-Stock

1+ parts

$73.000

100+ parts

$51.760

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524

$73.000

$51.760

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Vigor

Singapore . 1,665 parts In-Stock

1+ parts

$77.920

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1,665

$77.920

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Semicontronic

India . 6 parts In-Stock

1+ parts

$96.000

100+ parts

$93.600

1k+ parts

$93.120

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6

$96.000

$93.600

$93.120

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Microchip USA

USA . 695 parts In-Stock

1+ parts

$110.910

100+ parts

$108.980

1k+ parts

$108.010

10k+ parts

$107.050

695

$110.910

$108.980

$108.010

$107.050

Lixinc

USA . 7,953 parts In-Stock

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7,953

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UNI Independent Distributors

Spain . 3,534 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,317 parts In-Stock

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Perfect Parts

USA . 1,047 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Kepictronics

USA . 36 parts In-Stock

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iodParts Technologies Inc.

India . 20 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the MCF5474VR266 microprocessor by NXP Semiconductors. This high-quality product offers integrated cache, a wide address bus width, and low power mode, making it ideal for a variety of applications. With its advanced features and reliable performance, this microprocessor provides unbeatable value and benefits to customers looking to stay ahead in today's fast-paced digital world. Experience the difference with the MCF5474VR266 - innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package, making it suitable for various applications.

Integrated Cache: YES

Enhances processing speed by storing frequently accessed data closer to the processor.

Surface Mount: YES

Enables easy installation on circuit boards, reducing overall assembly time.

Maximum Supply Voltage: 1.58 V

Allows for reliable performance within specified voltage ranges.

On Chip Data RAM Width: 8

Provides efficient data storage and retrieval capabilities for improved processing speed.

Address Bus Width: 32

Supports a larger memory address space, enabling handling of complex computing tasks.

Package Shape: SQUARE

Facilitates easy and compact integration into electronic systems.

Bit Size: 32

Enables processing of 32-bit data at a time, enhancing computational capabilities.

No. of Terminals: 388

Offers a wide range of connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY

Provides high density packaging for improved thermal performance and power efficiency.

Minimum Supply Voltage: 1.43 V

Ensures stable operation even at lower voltage levels for energy-efficient applications.

Maximum Operating Temperature: 70 °C

Suitable for use in environments with moderate temperature conditions.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature environments for versatile applications.

Terminal Finish: TIN SILVER COPPER

Provides good solderability and conductivity for reliable connections.

Terminal Position: BOTTOM

Enables easy mounting on PCBs for streamlined assembly processes.

Maximum Seated Height: 2.55 mm

Allows for compact designs with minimal height constraints.

RAM Words: 32768

Offers ample memory storage capacity for handling large data sets and computations.

Width: 27 mm

Compact size enables integration into space-constrained electronic devices.

Boundary Scan: YES

Facilitates efficient testing and debugging of the device during production.

External Data Bus Width: 32

Supports fast data transfer between the processor and external components.

Maximum Clock Frequency: 66.67 MHz

Offers high-speed processing capabilities for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper solder reflow during manufacturing for reliable connections.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes for robustness.

Length: 27 mm

Compact form factor for easy integration into various electronic systems.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications with typical temperature requirements.

Peripheral IC Type: MICROPROCESSOR

Designed for processing tasks and communication with external devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Terminal Form: BALL

Enables efficient connections with other components on the PCB.

Nominal Supply Voltage: 1.5 V

Optimal voltage level for reliable and efficient performance.

No. of DMA Channels: 16

Supports efficient data transfer operations for improved system performance.

No. of Serial I/Os: 4

Provides connectivity options for serial communication with external devices.

Terminal Pitch: 1 mm

Allows for easy routing of signals and connections on the PCB.

Format: FLOATING POINT

Supports floating-point arithmetic operations for handling complex calculations.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture during storage and handling.

Speed: 266.66 rpm

Offers high processing speed for quick execution of tasks.

Low Power Mode: YES

Enables energy-efficient operation for battery-powered applications or reduced power consumption.

Technical Specifications

Microprocessors MCF5474VR266 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of Serial I/Os:

4

No. of Terminals:

388

On Chip Data RAM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

2.55 mm

Speed:

266.66 rpm

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MCF5474VR266 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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