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AM3357BZCZD30

Texas Instruments

AM3357BZCZD30 by Texas Instruments

AM3357BZCZD30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, making it ideal for compact designs with a terminal pitch of 0.8 mm.

Median Price

$18.866

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 1,065 parts In-Stock

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$15.382

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$13.436

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$9.266

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$15.382

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Mouser Electronics

USA . 126 parts In-Stock

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$22.350

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$15.260

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$12.750

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126

$22.350

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$12.750

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Distributors (In-Stock)

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Digiode

USA . 1,817 parts In-Stock

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$14.613

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Nova Conductors

Japan . 97 parts In-Stock

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VNN

France . 4,693 parts In-Stock

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Vyrian

USA . 3,422 parts In-Stock

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Chip Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 342 parts In-Stock

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$13.070

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$13.070

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Corphita

USA . 4,164 parts In-Stock

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$13.844

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Continental Prestige Electronics

USA . 1,043 parts In-Stock

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$16.123

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$15.800

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$16.123

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$15.800

Advanced Electronics

New Zealand . 39 parts In-Stock

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$16.445

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$16.445

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$16.445

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$16.445

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Semicontronic

India . 504 parts In-Stock

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$28.460

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$27.748

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$27.606

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504

$28.460

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Corohmni

South Africa . 952 parts In-Stock

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Parana Technologies

USA . 1,513 parts In-Stock

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$51.453

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DigiPath Technology Company

USA . 1,650 parts In-Stock

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$56.656

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ChromeModa Solutions

Germany . 738 parts In-Stock

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$57.812

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$47.406

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IDEA Electronic Components Group

UK . 45 parts In-Stock

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$54.921

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$52.031

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iodParts Technologies Inc.

India . 8,018 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,046 parts In-Stock

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Argo Parts USA

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Alle Elektronik GmbH

Germany . 3,112 parts In-Stock

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Kepictronics

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Lixinc

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Robosynatics

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Lucentia Tech

USA . 100 parts In-Stock

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$14.989

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$13.880

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$13.880

Perfect Parts

USA . 96 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the AM3357BZCZD30 by Texas Instruments. As a leader in microprocessors, Texas Instruments delivers cutting-edge technology for a wide range of applications. Whether you're looking to enhance your industrial automation systems or boost the efficiency of your embedded computing devices, this product offers unmatched value and benefits. Trust in Texas Instruments to provide top-quality solutions that meet your needs and exceed your expectations. Elevate your projects with the AM3357BZCZD30 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

The integrated cache helps to improve the performance of the microprocessor by storing frequently accessed data, leading to faster processing speeds.

Surface Mount: YES

The surface mount capability makes it easy to install the microprocessor on circuit boards, saving space and simplifying the overall design.

Maximum Supply Voltage: 1.144 V

This voltage limit ensures safe operation of the microprocessor, preventing damage from overvoltage situations.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage within the microprocessor, enhancing overall performance.

Address Bus Width: 28

The wide address bus width provides the microprocessor with the ability to access a large range of memory locations, increasing its versatility and capabilities.

Package Shape: SQUARE

The square package shape helps to optimize space utilization on circuit boards, making the product suitable for compact designs.

Bit Size: 32

The 32-bit architecture of the microprocessor allows it to handle large amounts of data and perform complex calculations, making it suitable for demanding applications.

Power Supplies (V): 0.95/1.1

The range of power supply voltages supported by the microprocessor offers flexibility in different operating conditions, ensuring compatibility with various systems.

No. of Terminals: 324

The large number of terminals provides ample connectivity options for interfacing the microprocessor with other components, allowing for versatile system integration.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact form factor with a low profile, making it suitable for space-constrained applications that require high-density packaging.

Technical Specifications

Microprocessors AM3357BZCZD30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3357BZCZD30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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