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P1010NSE5HHA

NXP Semiconductors

P1010NSE5HHA by NXP Semiconductors

The NXP Semiconductors P1010NSE5HHA microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for applications requiring a high-speed RISC processor with boundary scan capability. Operating temperature range from 0 to 105°C makes it suitable for various industrial environments.

Median Price

$37.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 105 parts In-Stock

1+ parts

$37.080

100+ parts

$36.340

1k+ parts

$35.600

10k+ parts

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105

$37.080

$36.340

$35.600

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Flip Electronics (Authorized)

USA . 27 parts In-Stock

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27

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$37.480

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100

$37.480

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Vyrian

USA . 5,901 parts In-Stock

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5,901

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Digiode

USA . 1,617 parts In-Stock

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1,617

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Anansix

USA . 906 parts In-Stock

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Flip Electronics

USA . 27 parts In-Stock

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27

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Distributors (Availability)

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Semicontronic

India . 27 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

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27

$9.000

$8.775

$8.730

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One Stop Electronics

USA . 27 parts In-Stock

1+ parts

$11.000

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27

$11.000

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AZTECH Wire

Italy . 768 parts In-Stock

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$18.225

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768

$18.225

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Ampacity Inc.

Singapore . 27 parts In-Stock

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$31.000

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$31.000

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Modulus Dynamics

Lithuania . 3,691 parts In-Stock

1+ parts

$37.199

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$37.199

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$37.199

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3,691

$37.199

$37.199

$37.199

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Corohmni

South Africa . 676 parts In-Stock

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$37.199

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676

$37.199

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Continental Prestige Electronics

USA . 5,557 parts In-Stock

1+ parts

$37.480

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$36.730

5,557

$37.480

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$36.730

Netroflash

USA . 2,000 parts In-Stock

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$37.480

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2,000

$37.480

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Vigor

Singapore . 150 parts In-Stock

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$40.350

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$40.350

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Microchip USA

USA . 2,372 parts In-Stock

1+ parts

$92.805

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2,372

$92.805

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UNI Independent Distributors

Spain . 3,316 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,655 parts In-Stock

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2,655

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Corphita

USA . 614 parts In-Stock

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614

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unleash the power of innovation with the P1010NSE5HHA by NXP Semiconductors! This top-of-the-line microprocessor offers unparalleled performance and reliability, thanks to NXP's legacy of excellence in semiconductor manufacturing. Ideal for a wide range of applications, this cutting-edge technology provides customers with a seamless experience, improved efficiency, and advanced functionality. Elevate your projects to new heights with the P1010NSE5HHA - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the microprocessor, making it a reliable choice for long-term use.

Integrated Cache: YES

Having integrated cache improves processing speed by storing frequently accessed data, enhancing overall performance.

Maximum Supply Voltage: 1.05 V

Operates efficiently within a specified voltage range, ensuring stable performance and preventing damage from voltage spikes.

Address Bus Width: 16

A wider address bus allows for more memory addressing capabilities, enabling the microprocessor to handle larger amounts of data.

No. of Terminals: 425

Having a high number of terminals facilitates connectivity with other components, expanding compatibility and versatility.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture simplifies instructions, leading to faster processing speeds and improved overall efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Speed: 800 rpm

Operating at a speed of 800 rpm allows for quick data processing and response times, enhancing the overall performance of the microprocessor.

Technical Specifications

Microprocessors P1010NSE5HHA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B425

JESD-609 Code:

e2

Length:

19 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver (Sn/Ag)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

P1010NSE5HHA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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